3x3 mm DFN Package Sensor SILICON LABS SI7007-A10-IM1 for Humidity and Temperature Measurement Needs
Product Overview
The Si7007 Humidity and Temperature Sensor is a monolithic CMOS IC that integrates humidity and temperature sensor elements, an analog-to-digital converter, signal processing, calibration data, and a PWM output. The PWM output can be filtered to produce an analog voltage output. It features precision sensing, low power consumption, and is factory-calibrated for interchangeability. The Si7007 is available in a 3x3 mm DFN package and is reflow solderable. An optional factory-installed cover provides protection against liquids and particulates. This sensor is ideal for measuring humidity, dew-point, and temperature in various applications including HVAC/R, thermostats, respiratory therapy, white goods, indoor weather stations, micro-environments, automotive climate control, asset tracking, and mobile devices.
Product Attributes
- Brand: Silicon Laboratories
- Model: Si7007-A10
- Package: 3x3 mm DFN
- Certifications: Patent Protected
Technical Specifications
| Parameter | Symbol | Test Condition | Min | Typ | Max | Unit |
| Power Supply | VDD | Recommended Operating Conditions | 1.9 | 3.6 | V | |
| Operating Temperature | TA | Recommended Operating Conditions | 40 | +125 | C | |
| Relative Humidity Operating Range | Non-condensing | 0 | 100 | %RH | ||
| Relative Humidity Accuracy | 090% RH | 4 | 5 | %RH | ||
| Temperature Operating Range | 40 | +125 | C | |||
| Temperature Accuracy | 10 C | 0.5 | 1 | C | ||
| PWM Frequency | FPWM | 1.00 | 1.22 | 1.40 | kHz | |
| Current Consumption (Average) | IDD | 150 | 300 | A | ||
| Powerup Time | tPU | From VDD 1.9 V to PWM output enabled, 25 C | 48 | 55 | ms | |
| Powerup Time | tPU | From VDD 1.9 V to PWM output enabled, full temperature range | 110 | ms | ||
| Junction to Air Thermal Resistance | JA | JEDEC 2-Layer board, No Airflow | 256 | C/W | ||
| Junction to Air Thermal Resistance | JA | JEDEC 2-Layer board, 1 m/s Airflow | 224 | C/W | ||
| Junction to Air Thermal Resistance | JA | JEDEC 2-Layer board, 2.5 m/s Airflow | 205 | C/W | ||
| Junction to Case Thermal Resistance | JC | JEDEC 2-Layer board | 22 | C/W | ||
| Junction to Board Thermal Resistance | JB | JEDEC 2-Layer board | 134 | C/W | ||
| Storage Temperature | 65 | 150 | C | |||
| ESD Tolerance (HBM) | 2 | kV | ||||
| ESD Tolerance (CDM) | 1.25 | kV | ||||
| ESD Tolerance (MM) | 250 | V |
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