HP-D30 High Speed Piezoelectric Jet Dispensing Machine Underfill Red Glue Dispensing
| Model | HP-D30 |
|---|---|
| Machine Dimensions | L990*W1350*H1600mm |
| Weight | 1000kg |
| Control Method | Industrial PC + Motion Control Card |
| Programming | Online visual programming |
| CCD Vision | Automatic calibration and error correction |
| X/Y/Z Drive | Servo motor + precision grinding screw |
| Max Movement Speed | 1000mm/s |
| Repeat Accuracy | ±0.01mm |
| Dispensing Itinerary | X=400mm, Y=400mm, Z=50mm |
| Component Height | 50mm max |
| Dispensing Valve | 1x H-Y01 piezoelectric jet valve |
| Material Capacity | 30CC / 50CC |
| Track Width | 50-400mm (automatic adjust) |
| Conveyor Speed | 0.5-3.5m/min adjustable |
| Air Pressure | 6.2kgf/cm² |
| Power Supply | 220V 50-60Hz |
| Total Power | 3KW |
| Interface | SMEMA |
| Alarm System | Menu display + sound/light alarm |
- Underfill for flip chips and BGAs
- Precision adhesive dispensing
- Encapsulation and dam & fill
- Solder paste jetting
- Thermal interface material application
- Camera module assembly
- MEMS and sensor packaging
- High-precision electronics assembly
Industry Keywords Tag Cloud :
Core Equipment Terms: Automated Dispensing Machine, Fluid Dispensing Robot, Automatic Glue Dispenser, Selective Fluid Dispensing System, Inline Dispensing Machine, PCB Dispensing Equipment, PCBA Glue Dispenser, Tabletop Dispensing Robot, Dual-Component Dispensing System
Fluid Control Automation Processing & Technology Keywords: Precision Dispensing, Jet Dispensing, Needle Dispensing, Micro-Dispensing Technology, Potting Process, Encapsulation System, Underfill Dispensing, Dam and Fill, Silicone Sealing, Thermal Interface Material Application
Glue Volume Calibration Material Compatibility Keywords: Silicone Adhesive, Epoxy Resin, Polyurethane Glue, UV Curable Adhesive, Cyanoacrylate, Thermal Conductive Paste, Conductive Silver Epoxy, Two-Part Adhesive, Solvent-Free Glue, Protective Polymeric
Material Manufacturing & Application Keywords: PCB Assembly, SMT Production Line, Semiconductor Packaging, Electronics Manufacturing, LED Encapsulation, Automotive Electronics Assembly, Sensor Sealing, Camera Module Bonding, Smart Device Components Protection
Industrial Control Module Potting Performance & Inspection Keywords: High Precision Dispensing, Non-Contact Jetting, High-Speed Fluid Deposition, Dynamic Weight Calibration, Laser Height Sensor, Vision Alignment System, CCD Positioning, Automatic Nozzle Cleaning, Closed-Loop Fluid Control
Industry 4.0 Smart Dispensing Quality & Curing Keywords: Dispensing Quality Control, Glue Line Inspection, Automated Optical Inspection, Defect Detection, UV Curing Process, Thermal Curing Line, Process Verification, Quality Assurance, Turnkey Dispensing Solution, Smart Production Line Integration
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