Shenzhen Haipai Holding Co., Ltd
                                                                                                           
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12 Years
Since 2014
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3000mm Length Infrared Curing Ovens Three Temperature Zones For Precise Thermal Profiling

Price Negotiable
Price: Negotiable
MOQ: 1 unit
Delivery Time: 30 working days
Brand: Haipai
Product Description
HP-IR3C Energy-Efficient Infrared Curing Oven 
Three-zone infrared curing furnace with <10 minute warm-up time and thick insulation that significantly reduces heat loss for improved energy efficiency.
Product Overview
The HP-IR3C is a three-zone infrared curing furnace designed for applications requiring extended curing profiles or higher throughput. With a 3000mm total length and three independent temperature zones, this system provides superior flexibility for thermal profiling compared to two-zone models.
Key Features
  • Three independent PID temperature control zones via touch screen interface
  • Precise temperature control from room temperature to 120°C
  • Extended furnace body enables slower conveyor speeds with adequate curing time
  • High-quality heating tubes for uniform temperature distribution
  • Durable T1.5 iron plate construction for furnace and inner chamber
  • Thick peripheral insulation minimizes heat loss and energy consumption
  • Stainless steel 35B 5mm lengthened pin chain conveyor system
  • Reinforced high-temperature aluminum guide rails with support adjustment
  • Electric rail width adjustment from 50-450mm
  • Stepper motor controlled conveyor speed (0.5-3.5m/min)
  • Software-controlled electric lid opening system
  • SMEMA interface compatibility
Technical Specifications
Model HP-IR3C
Machine Dimensions L3000*W1080*H1300mm
Weight Approx. 550KG
Control Method PLC + Touch Screen
PCB Height 910±20mm
Conveyor Type Chain conveying (35B 5mm lengthened pin stainless steel chain)
Conveyor Speed 0.5-3.5m/min adjustable
Transmission Motor Stepper motor
PCB Width MAX: 450mm (electrically adjustable 50-450mm)
Temperature Zones 3 zones
Temperature Range Room temperature - 120°C
Warm-up Time <10 minutes
Max PCB Size L450*W450mm
Component Height ±110mm max
Lid Opening Software control, electric lifting
Power Supply AC380V 50Hz 3-phase 5-wire
Total Power 12.5KW
Interface SMEMA
Applications
  • Extended thermal curing profiles
  • High-volume conformal coating curing
  • Thick coating layer curing
  • Multi-stage temperature ramp applications
  • Epoxy and adhesive curing
  • Encapsulant curing
  • PCB baking and preheating

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Shenzhen Haipai Holding Co., Ltd
Location No.1303, Building 2, Kechuang Workshop, No.6 Songjiang Road,  Shapu Community, Songgang Sub-district,‌Bao'an District, Shenzhen.
Contact Person Mary Yang

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