3000mm Length Infrared Curing Ovens Three Temperature Zones For Precise Thermal Profiling
Price:
Negotiable
MOQ:
1 unit
Delivery Time:
30 working days
Brand:
Haipai
Product Description
HP-IR3C Energy-Efficient Infrared Curing Oven
Three-zone infrared curing furnace with <10 minute warm-up time and thick insulation that significantly reduces heat loss for improved energy efficiency.
Product Overview
The HP-IR3C is a three-zone infrared curing furnace designed for applications requiring extended curing profiles or higher throughput. With a 3000mm total length and three independent temperature zones, this system provides superior flexibility for thermal profiling compared to two-zone models.
Key Features
- Three independent PID temperature control zones via touch screen interface
- Precise temperature control from room temperature to 120°C
- Extended furnace body enables slower conveyor speeds with adequate curing time
- High-quality heating tubes for uniform temperature distribution
- Durable T1.5 iron plate construction for furnace and inner chamber
- Thick peripheral insulation minimizes heat loss and energy consumption
- Stainless steel 35B 5mm lengthened pin chain conveyor system
- Reinforced high-temperature aluminum guide rails with support adjustment
- Electric rail width adjustment from 50-450mm
- Stepper motor controlled conveyor speed (0.5-3.5m/min)
- Software-controlled electric lid opening system
- SMEMA interface compatibility
Technical Specifications
| Model | HP-IR3C |
|---|---|
| Machine Dimensions | L3000*W1080*H1300mm |
| Weight | Approx. 550KG |
| Control Method | PLC + Touch Screen |
| PCB Height | 910±20mm |
| Conveyor Type | Chain conveying (35B 5mm lengthened pin stainless steel chain) |
| Conveyor Speed | 0.5-3.5m/min adjustable |
| Transmission Motor | Stepper motor |
| PCB Width | MAX: 450mm (electrically adjustable 50-450mm) |
| Temperature Zones | 3 zones |
| Temperature Range | Room temperature - 120°C |
| Warm-up Time | <10 minutes |
| Max PCB Size | L450*W450mm |
| Component Height | ±110mm max |
| Lid Opening | Software control, electric lifting |
| Power Supply | AC380V 50Hz 3-phase 5-wire |
| Total Power | 12.5KW |
| Interface | SMEMA |
Applications
- Extended thermal curing profiles
- High-volume conformal coating curing
- Thick coating layer curing
- Multi-stage temperature ramp applications
- Epoxy and adhesive curing
- Encapsulant curing
- PCB baking and preheating
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Shenzhen Haipai Holding Co., Ltd
Location
No.1303, Building 2, Kechuang Workshop, No.6 Songjiang Road, Shapu Community, Songgang Sub-district,Bao'an District, Shenzhen.
Contact Person
Mary Yang