HP-IR2C 2 Zone Infrared Curing Furnace With Dual Zone PID Temperature Control
Price:
Negotiable
MOQ:
1 unit
Delivery Time:
30 working days
Brand:
Haipai
Product Description
HP-IR2C 2-Zone Infrared Curing Oven
The HP-IR2C Infrared Curing Furnace delivers professional-grade thermal curing with its advanced dual-zone design and independent PID temperature control. Each of the two zones features its own PID controller integrated with the PLC + touch screen interface, enabling precise thermal profiling for different material requirements—from low-temperature epoxies to higher-temperature conformal coatings.
This dual-zone architecture allows operators to create temperature gradients along the furnace length, with Zone 1 serving as a preheat section and Zone 2 providing full curing temperature, optimizing the curing process and preventing thermal shock to sensitive components. The temperature control range from room temperature to 150°C accommodates a wide variety of thermally-cured materials, while the impressive <10 minute warm-up time minimizes downtime between production runs.
With electrically adjustable rail width (50-450mm), conveyor speed control (0.5-3.5m/min), and ±110mm component clearance, the HP-IR2C delivers the precision and flexibility that demanding thermal curing applications require.
Key Specifications
| Temperature Control Range | Room temperature to 150°C |
| Warm-up Time | < 10 minutes |
| Temperature Zones | 2 independent zones with PID control |
| Conveyor Speed | 0.5-3.5 m/min adjustable |
| PCB Maximum Size | L450mm * W450mm |
| Component Height | ±110mm |
| Rail Width Adjustment | 50-450mm electrically adjustable |
| Power Supply | AC380V, 50Hz, 3-phase 5-wire system |
| Total Power | 6.5KW |
| Equipment Weight | Approx. 400KG |
Advanced Features
- Precise 2-Zone Control: Independent PID temperature control with PLC + touch screen interface for optimal thermal profiling
- Rapid Operation: Less than 10-minute warm-up time minimizes production downtime
- Energy Efficient Design: Thick insulation cotton minimizes heat loss and reduces power consumption
- Robust Construction: T1.5 iron plate welded body with stainless steel chain conveyor (35B 5mm lengthened pins)
- Stable Transport: Reinforced aluminum alloy guide rails with anti-vibration design prevent track shaking and board fall-off
- Automated Operation: Electric lid opening via software control and electrically adjustable rail width
- Seamless Integration: Standard SMEMA interface for SMT production line communication
- Flexible Processing: Accommodates diverse PCB sizes and component heights with precise speed control
Primary Applications
- Thermal curing of conformal coatings
- Epoxy and adhesive curing
- Silicone and polyurethane curing
- Solder paste drying
- PCB baking and preheating
- Ink and marking drying
- Underfill curing
- Encapsulant curing
- General industrial thermal curing
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Company
Shenzhen Haipai Holding Co., Ltd
Location
No.1303, Building 2, Kechuang Workshop, No.6 Songjiang Road, Shapu Community, Songgang Sub-district，Bao'an District, Shenzhen.
Contact Person
Mary Yang