HP-740D 4 Axis Online Dispenser ±180° Rotating U Axis 2600ML Glue Supply For High Density PCBs
- tection light source
- SMEMA interface for seamless integration into production lines
| Parameter | Specification |
|---|---|
| Model | HP-740D |
| External Dimensions (L*W*H) | L1060mm * W1300mm * H1700mm |
| Weight | Approx. 500 kg |
| Control Method | Industrial PC + Board Control |
| Programming Method | Manual teaching + mouse/keyboard |
| PCB Transfer Height | 910±20mm |
| Conveyor Speed | 0.5-3.5 m/min adjustable |
| Conveyor Type | Chain conveyor (35B 5mm extended pin belt with stainless steel chain guard) |
| Transfer Motor | Dual stepper motors, independent control |
| Conveyor Rail Width | 50-450mm adjustable |
| Component Clearance | 100mm max |
| Rail Width Adjustment Drive | Stepper motor drives dual ball screws |
| Rail Width Adjustment Method | Electrical control |
| X.Y.Z Drive Mode | Servo Motor + Screw Drive Module |
| X.Y Maximum Speed | 800mm/s |
| Z Maximum Speed | 300mm/s |
| XYZ Axis Repeatability | ±0.02mm |
| U-Axis Drive Mode | Servo motor + hollow rotating platform |
| U-Axis Rotation Angle | ±180° |
| Valve Type | 1x H-N02 silicone dispensing valve |
| Valve Tilt Adjustment | 0-45° manual |
| Tank Capacity | 2600ML glue supply system |
| Cleaning Function | Built-in automatic cleaning |
| Lighting | Built-in LED lighting |
| Inspection | Built-in UV detection light source |
| Power Supply | AC220V 50Hz |
| Air Supply | 4-6 kgf/cm² |
| Total Power | 1.8KW |
| Interface | SMEMA |
Industry Keywords Tag Cloud :
Core Equipment Terms: Automated Dispensing Machine, Fluid Dispensing Robot, Automatic Glue Dispenser, Selective Fluid Dispensing System, Inline Dispensing Machine, PCB Dispensing Equipment, PCBA Glue Dispenser, Tabletop Dispensing Robot, Dual-Component Dispensing System
Fluid Control Automation Processing & Technology Keywords: Precision Dispensing, Jet Dispensing, Needle Dispensing, Micro-Dispensing Technology, Potting Process, Encapsulation System, Underfill Dispensing, Dam and Fill, Silicone Sealing, Thermal Interface Material Application
Glue Volume Calibration Material Compatibility Keywords: Silicone Adhesive, Epoxy Resin, Polyurethane Glue, UV Curable Adhesive, Cyanoacrylate, Thermal Conductive Paste, Conductive Silver Epoxy, Two-Part Adhesive, Solvent-Free Glue, Protective Polymeric
Material Manufacturing & Application Keywords: PCB Assembly, SMT Production Line, Semiconductor Packaging, Electronics Manufacturing, LED Encapsulation, Automotive Electronics Assembly, Sensor Sealing, Camera Module Bonding, Smart Device Components Protection
Industrial Control Module Potting Performance & Inspection Keywords: High Precision Dispensing, Non-Contact Jetting, High-Speed Fluid Deposition, Dynamic Weight Calibration, Laser Height Sensor, Vision Alignment System, CCD Positioning, Automatic Nozzle Cleaning, Closed-Loop Fluid Control
Industry 4.0 Smart Dispensing Quality & Curing Keywords: Dispensing Quality Control, Glue Line Inspection, Automated Optical Inspection, Defect Detection, UV Curing Process, Thermal Curing Line, Process Verification, Quality Assurance, Turnkey Dispensing Solution, Smart Production Line Integration
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