HP-D302 Dual Valve High Speed Dispensing Machine With 2x Piezoelectric Injection Valves
- Dual-Valve Configuration: Electrically adjustable valve spacing for optimal positioning across different board layouts
- High-Speed Operation: Maximum movement speed of 1000mm/s with ±0.01mm repeatability precision
- Precision Motion System: Servo motors with precision grinding lead screws for smooth, stable operation
- Advanced Vision System: Integrated CCD visual positioning with automatic calibration and real-time error correction
- Intuitive Programming: Online visual programming interface for rapid setup without complex coding
- Versatile Application: Process two separate areas simultaneously or two boards side-by-side for doubled throughput
| Parameter | Specification |
|---|---|
| Model | HP-D302 |
| External Dimensions (L*W*H) | L990mm * W1350mm * H1600mm |
| Weight | 1000 kg |
| Control System | Industrial PC + Motion Control Card |
| Programming Method | Online visual programming |
| CCD Visual Positioning | Automatic calibration and error correction |
| Maximum Component Height | 50mm |
| X, Y, Z Axis Drive | Servo Motor + Precision Grinding Lead Screw |
| Maximum Movement Speed | 1000mm/s |
| Repeatability Precision | ±0.01mm |
| Dispensing Travel Range | X=400mm, Y=400mm, Z=50mm |
| Valve Configuration | 2x H-Y01 piezoelectric injection valves |
| Valve Spacing Adjustment | Electrically adjustable |
| Dispensing Capacity | 30CC / 50CC |
| Automatic Width Adjustment | Single lane, 50-400mm |
| Conveyor Speed | 0.5-3.5m/min adjustable |
| Alarm System | Menu display + sound/light alarm |
| Power Supply | 220V 50-60Hz |
| Air Pressure | 6.2 kgf/cm² |
| Total Power | 3KW |
| Communication Interface | SMEMA |
| Remarks | Standard CCD camera included |
Industry Keywords Tag Cloud :
Core Equipment Terms: Automated Dispensing Machine, Fluid Dispensing Robot, Automatic Glue Dispenser, Selective Fluid Dispensing System, Inline Dispensing Machine, PCB Dispensing Equipment, PCBA Glue Dispenser, Tabletop Dispensing Robot, Dual-Component Dispensing System
Fluid Control Automation Processing & Technology Keywords: Precision Dispensing, Jet Dispensing, Needle Dispensing, Micro-Dispensing Technology, Potting Process, Encapsulation System, Underfill Dispensing, Dam and Fill, Silicone Sealing, Thermal Interface Material Application
Glue Volume Calibration Material Compatibility Keywords: Silicone Adhesive, Epoxy Resin, Polyurethane Glue, UV Curable Adhesive, Cyanoacrylate, Thermal Conductive Paste, Conductive Silver Epoxy, Two-Part Adhesive, Solvent-Free Glue, Protective Polymeric
Material Manufacturing & Application Keywords: PCB Assembly, SMT Production Line, Semiconductor Packaging, Electronics Manufacturing, LED Encapsulation, Automotive Electronics Assembly, Sensor Sealing, Camera Module Bonding, Smart Device Components Protection
Industrial Control Module Potting Performance & Inspection Keywords: High Precision Dispensing, Non-Contact Jetting, High-Speed Fluid Deposition, Dynamic Weight Calibration, Laser Height Sensor, Vision Alignment System, CCD Positioning, Automatic Nozzle Cleaning, Closed-Loop Fluid Control
Industry 4.0 Smart Dispensing Quality & Curing Keywords: Dispensing Quality Control, Glue Line Inspection, Automated Optical Inspection, Defect Detection, UV Curing Process, Thermal Curing Line, Process Verification, Quality Assurance, Turnkey Dispensing Solution, Smart Production Line Integration
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