Benchtop Fully Automatic Dispensing Machine With ±0.02mm Repeatability 500mm/s Speed
- Compact 280*280mm dispensing area ideal for smaller PCBs and precision assemblies
- Stepper motor + synchronous belt drive for exceptional accuracy
- Complete glue supply system for extended production runs
- Single Y-platform worktable for cost-effective operation
- Advanced teach pendant programming with exportable programs
| Model | HP-D331-1 |
| Maximum Dispensing Area | 280mm * 280mm |
| Machine Dimensions (L*W*H) | 520mm * 600mm * 680mm (excluding cover) |
| Weight | 85 kg |
| Drive System | Stepper Motor + Synchronous Belt |
| Repeat Positioning Accuracy | ±0.02mm |
| Travel Speed (X, Y) | Up to 500 mm/s |
| Travel Speed (Z) | Up to 300 mm/s |
| Valve Configuration | 1x dispensing valve |
| Tank Capacity | Complete glue supply system |
| Workbench | Single Y-platform |
| Teaching Method | Teach pendant (programs exportable for reuse) |
| Control System | Independently developed motion control |
| Power Supply | AC220V 50Hz |
Industry Keywords Tag Cloud:
Core Equipment Terms: Benchtop Dispensing Robots, Tabletop Dispensing Machine, Desktop Fluid Dispenser, 3-Axis Tabletop Robot, Standalone Automated Dispensing System, Compact Liquid Dispenser Equipment, Portable Glue Dispensing Unit, Automatic Syringe Dispenser, Benchtop Fluid Control Automation, Smart Desktop Robot Platform
Processing & Micro-Dispensing Keywords: Precision Fluid Dispensing, Micro-Dot Jetting Technology, Fine Line Dispensing Path, Continuous Path Motion Interpolation, Syringe Liquid Feeding, Precision Needle Dotting, Non-Contact Fluid Deposition, Dynamic Arc Dispensing Pattern, Dam and Fill Process, Anti-Drip Suck-Back Fluid Control
Material & Fluid Adaptive Keywords: Epoxy Resin Dispensing, Silicone Adhesive Sealing, UV Curable Glue Liquid, Cyanoacrylate Adhesive Application, Thermal Conductive Paste Dispensing, Two-Component Liquid Polymer, Solvent-Based Adhesive, Solder Paste Micro-Volume Application, High Viscosity Fluid Compound
Manufacturing & High-Mix Application Keywords: Low-to-Medium Volume PCB Assembly, High-Mix Low-Volume Production, Electronic Engineering Prototyping, R&D Laboratory Testing, Small Scale SMT Workshop, Smartphone Component Repair Bonding, Automotive Sensor Sealing, Camera Module Bonding, LED Lens Encapsulation Protection
Performance & Machine Structure Keywords: High Precision Positioning Accuracy, Compact Footprint Spatial Design, Handheld Teach Pendant Programming, Heavy-Duty Anti-Vibration Base Frame, Integrated Fluid Pressure Regulator, CCD Vision Alignment System, Automatic Laser Height Sensor, Dual-Valve Quick Mount Assembly, Closed-Loop Motion Control Calibration
Quality Control & Setup Efficiency Keywords: Rapid Production Changeover, Dispensing Volume Uniformity Control, Defect-Free Pattern Execution, Glue Line Continuous Inspection, Quick Needle Syringe Replacement, Accurate Dot Repeatability Verification, Affordable Automation Engineering, Turnkey Desktop Liquid Dispensing Solution
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