OK-SASPP Series Semi-Automatic Solder Paste Printer.

Available in four mainstream models: 400/600/1200/1500, adaptable to PCB production needs of varying lengths. A full range of worktable specifications are available, compatible with corresponding stencil sizes, meeting the printing requirements of various electronic products. The equipment supports customized vacuum suction cup configurations for easily adhered products such as FPC flexible boards, memory modules, and cooling chips, allowing for easy separation of the printed product from the stencil, effectively preventing stencil sticking, shifting, and warping, thus improving printing yield. Standard configuration includes 200mm and 250mm squeegees; extended 300mm squeegees can also be customized to accommodate different printing width requirements.

Equipment Features

The entire machine adopts a closed sheet metal and aluminum alloy structure, providing enhanced safety and stable operation. Equipped with a PLC control system and touchscreen interface, it features automatic fault diagnosis, audible and visual alarms, and on-screen prompts, making operation simple, intuitive, and maintenance convenient. The printing mechanism utilizes upper and lower cylinders in conjunction with linear guides, ensuring smooth and stable lifting without wobbling. The left and right drives employ stepper motors, linear guides, and frequency converters for speed regulation, resulting in uniform operating speed and high parallelism. Combined with precision micro-adjustment knobs on the X and Y axes, alignment is accurate and convenient, achieving a printing accuracy of ±0.01mm.

Application Scenarios

The equipment supports standard 220V voltage, features low power consumption, moderate air pressure requirements, and a reasonable footprint. It is suitable for solder paste printing on PCB boards of 3C electronic products such as mobile phones, computers, and tablets. It can also be used for precise printing of thermal grease, ensuring uniform coating of the heat dissipation material, improving product heat dissipation and operational stability. It is a high-precision, cost-effective standard printing equipment for SMT production lines.