High Speed Acid Copper Plating Process Compatible With Iron Parts Zinc Alloy Plastic Plating
Price:
Negotiable
MOQ:
25-30kg
Delivery Time:
5-8 work day
Product Description
R·G-OUTRE High-Speed Acid Copper Plating Process
Performance & Features
Combines the advantages of Cupracid 210 and Cupracid 300; easy bath control and excellent leveling performance.
- Minimal pinholes, low internal stress and good ductility of deposits.
- Wide current density window; leveling capacity up to 75% to achieve full bright finish.
- Ultra-fast deposition rate: approx. 1 μm copper per minute at 4.5 A/dm², shortening plating cycle.
- Low coating resistivity, ideal for motor industry with strict requirements on physical properties.
- Compatible with various substrates: iron parts, zinc alloy, plastic plating and more.
- High impurity loading capacity; activated carbon treatment only required after approx. 800–1000 Ah/L bath usage.
Operating Parameters
| Item | Concentration Range |
|---|---|
| Copper Sulfate Pentahydrate (CuSO₄·5H₂O) | 200–220 g/L |
| Sulfuric Acid (Specific gravity=1.84) | 50–90 g/L |
| Chloride Ion | 70–150 mg/L (ppm) |
| Outre Make-Up Agent | 4–8 mL/L |
| Outre A Brightener | 0.4–0.6 mL/L |
| Outre B Brightener | 0.4–0.6 mL/L |
| Operating Temperature | 20–30 ℃ |
| Cathode Current Density | 1–6 A/dm² |
| Anode Current Density | 0.5–2.5 A/dm² |
| Anode Material | Phosphor copper balls (0.03% P) |
| Agitation | Air agitation + mechanical agitation |
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Company
Wuhan Aobong Surface Technique Co., Ltd.
Location
No.296 Changqing Road Jianghan District, Hubei Province, Wuhan City, China
Contact Person
Amy