DS-33 Acid Copper Plating Additives Low Internal Stress High Ductility
Price:
Negotiable
MOQ:
25-30kg
Delivery Time:
5-8 work day
Product Description
DS-33 Acid Copper Plating Additive
Performance & Features
- Excellent leveling performance across a wide range from high-current to low-current density areas.
- Low internal stress and outstanding ductility of deposits.
- Superior brightness and covering power especially in low-current regions.
- Excellent heat resistance.
- Produces bright, clear and attractive coating appearance.
- Main bath components can be analyzed accurately for precise bath maintenance.
Operating Parameters
| Item | Working Range |
|---|---|
| Cathode Current Density | 1–6 A/dm² |
| Anode Current Density | 1–3 A/dm² (Optimal: 3–9 A/dm²) |
| Bath Temperature | 20–45 ℃ |
| Agitation | Vigorous air agitation |
| Filtration | Continuous filtration without activated carbon |
| Anode Material | Phosphor copper anode |
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Company
Wuhan Aobong Surface Technique Co., Ltd.
Location
No.296 Changqing Road Jianghan District, Hubei Province, Wuhan City, China
Contact Person
Amy