DS-510 Mirror Bright Acid Copper Plating Process Excellent Leveling Capacity
Produces perfect mirror-bright finish.
- Outstanding brightness and leveling performance; superior gloss especially under low current density.
- Wide operating temperature window (18–35 ℃), stable plating at elevated temperatures.
- Excellent leveling capacity.
- Low brightener consumption, cost-effective.
- Not affected by brightener decomposition by-products.
| Item | Concentration & Range |
|---|---|
| Copper Sulfate Pentahydrate (CuSO₄·5H₂O) | 160–240 g/L |
| Sulfuric Acid (H₂SO₄) | 40–90 g/L |
| Chloride Ion (Cl⁻) | 30–120 mg/L (ppm) |
| DS 510 MU Make-up Agent | 2–5 mL/L |
| DS 510 A Leveler | 0.3–0.6 mL/L |
| DS 510 B Brightener | 0.1–0.6 mL/L |
| Operating Temperature | 18–35 ℃ |
| Cathode Current Density | 1.5–8 A/dm² |
| Anode Current Density | 0.5–3.0 A/dm² |
| Operating Voltage | 2–10 V |
| Agitation | Vigorous air agitation or mechanical agitation |
| Filtration | Continuous filtration |
| Anode Material | Phosphor copper |
Precision electronic parts, automotive hardware, decorative metal fittings, communication components, jewelry accessories, mechanical precision parts, circuit board substrates, bathroom hardware, instrumentation parts, daily metal ornaments
DS-510 Mirror Bright Acid Copper Process delivers ultra-bright mirror copper plating with uniform, dense and smooth coating. It is applicable to various metal parts needing high-gloss decorative effect and good conductivity, widely used in electronics, automobile, decoration and hardware industries for high-precision surface finishing.
Q1: What is the biggest feature of DS-510 acid copper plating process?
A1: It forms a flawless mirror-bright copper coating with ultra-smooth surface and high flatness. The process has fast deposition speed, excellent coverage, stable liquid medicine, and can achieve high-gloss finishing without repeated polishing, suitable for high-standard decorative plating.
Q2: What production advantages does DS-510 process have for mass production?
A2: This process features stable operation, wide current density range and low defect rate. It offers consistent bright plating effect on batch workpieces, adapts to continuous mass production, and has strong compatibility with subsequent plating and passivation processes.
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