In large-area coating production lines, rotating targets are a common form of sputtering target.The so-called "rotary target bonding" refers to securely connecting the cylindrical target to the equipment's cathode system, allowing it to rotate smoothly during operation, ensuring uniform consumption, while guaranteeing reliable transmission of water cooling, gas, and electrical current.

The bonding process directly affects the lifespan of the target, deposited film uniformity, and equipment stability. A good bonding solution ensures the target remains concentric and stable during high-speed rotation, preventing water or gas leakage, ensuring stable electrical contact, and resulting films with superior unifromity.

 Outstanding Characteristics of Rotating Target Bonding

l Ensures uniform consumption of the target during prolonged sputtering, extending its service life;

l Improves the uniformity of film thickness and composition, reducing scrap rate;

l Quick replacement, short downtime, and improved production line utilization rate;

l Reliable sealing to prevent water cooling leaks, avoiding equipment downtime.