Copper (Cu) is a high-conductivity, thermally efficient transition metal essential for advanced thin-film applications. Typically supplied as high-purity ingots, pellets, or chunks, copper is optimized for vacuum deposition, electron-beam (e-beam) evaporation, and magnetron sputtering. The resulting thin films are characterized by high density, homogeneity, and superior interfacial adhesion, significantly optimizing the electrical, thermal, and structural stability of integrated devices.

Outstanding Properties of Copper

lHigh Purity

 Purity up to 99.9%–99.99%, with low impurity content, ensuring stable and reliable film performance.

lExcellent Conductivity

 High electrical conductivity, making it suitable for the production of conductive films, electrodes, and interconnect layers.

 lGood Thermal Conductivity

 High thermal conductivity, ideal for electronic device films requiring heat dissipation.

l Excellent Ductility

 Forms uniform, dense films on various substrates with strong adhesion.

 Widespread Applications of Copper

lSemiconductor Manufacturing

Used as interconnect layers, conductive films, electrodes, and contact layers, widely applied in chip, circuit board, and packaging processes.

lOptical Device Manufacturing

Used in reflective films, optical filters, and functional coatings to enhance optical performance.

lPhotovoltaic Industry

 Applied in functional films in solar cells, lithium batteries, and fuel cells to improve energy efficiency and stability.

l Decorative and Protective Coatings

Used in consumer electronics housings, architectural decorations, and crafts to form coatings that are both decorative and protective.