Advanced Turnkey PCB Manufacturing AOI SPI ICT FCT Turnkey Prototype Assembly

Quality verification requires more than just visual inspection—it demands a comprehensive testing ecosystem that catches defects at every stage of production. Studio Electronics delivers advanced turnkey PCB manufacturing backed by a complete inspection suite including AOI, SPI, 3D X-Ray, ICT, FCT, and Flying Probe testing. As a premier provider of PCB assembly in China, we deploy these advanced testing technologies at strategic checkpoints throughout production—from solder paste inspection before reflow to functional testing of fully assembled boards. Every board is verified, every defect is caught, and every delivery meets your quality expectations.

• 12 Fully Automated SMT Lines – High-speed placement with ±25μm accuracy; 01005 to BGA capability; up to 100,000 CPH

• Automatic Wave Soldering – Programmable closed-loop control; ±1°C accuracy for consistent THT soldering

• Programmable Automated Soldering Robots – ±0.05mm positional accuracy; precision selective soldering

• 3D SPI – Micron-level paste measurement; real-time feedback to screen printer

• 3D AOI – AI-assisted defect classification; high-speed optical inspection

• 3D X-Ray – Automated void calculation; detects sub-10μm defects

• Reliability Laboratory – Thermal shock, temperature cycling, damp heat, vibration, and burn-in testing

• SPI (3D Solder Paste Inspection) – Every board is inspected for paste volume, height, and area before components are placed. Data is collected per board, and boards with anomalies are rejected before reflow—saving components and reducing rework cost. Real-time feedback to the screen printer ensures immediate correction of paste printing issues.

• AOI (Automated Optical Inspection) – After reflow, high-speed AOI inspects component presence, polarity, alignment, and solder joint quality. AI-assisted defect classification ensures accurate detection with low false-call rates. Inspection data is logged per board serial number.

• 3D X-Ray Inspection – For BGAs, QFNs, and other hidden-joint components, X-Ray provides full visibility of solder joints that the naked eye cannot see. Automated void calculation measures void percentage against your acceptance criteria. Bridging and insufficient solder are detected and reported.

• ICT (In-Circuit Tester) – Bed-of-nails testing validates individual component values and detects electrical shorts or opens. Test results are logged per board and compared against specifications.

• FCT (Functional Circuit Test) – Power-on testing simulates real-world operating conditions to confirm full board functionality. Custom test fixtures are developed for your specific product requirements, ensuring accurate and repeatable testing.

• Flying Probe Tester – For low volume PCB assembly and prototype runs, Flying Probe testing provides fixture-less electrical verification with rapid changeover capability—eliminating test fixture costs for small batches.

Choose Studio for advanced turnkey PCB manufacturing and get the confidence that comes from knowing every board has passed through the most comprehensive inspection ecosystem in the industry—including AOI, SPI, X-Ray, ICT, FCT, and Flying Probe testing.