PCB Fabrication – ENIG, HASL, OSP Finishes
Surface finish selection is critical to PCB performance—affecting solderability, shelf life, wire bonding capability, and cost. Studio Electronics offers PCB Fabrication with ENIG, HASL, OSP, and other surface finishes to match your specific requirements. As a trusted provider of PCB assembly in China, we apply finishes with precise thickness control and uniformity verification—ENIG for fine-pitch and long shelf life, HASL for cost-effective through-hole, OSP for cost-effective flat surface, and more. Our complete turnkey service covers fabrication, component sourcing, assembly, and shipping.
| Finish | Description | Advantages | Best Applications |
|---|---|---|---|
| ENIG | Ni 3-5μm / Au 0.05-0.1μm | Excellent solderability; fine-pitch compatible; long shelf life; flat surface | Fine-pitch SMT; high-reliability; long storage |
| HASL | 1-25μm solder coating | Good solderability; cost-effective; reworkable | Through-hole components; cost-sensitive applications |
| OSP | 0.2-0.5μm organic coating | Cost-effective; flat surface; fine-pitch compatible | Consumer electronics; cost-sensitive; short shelf life |
| Immersion Silver | 0.1-0.3μm silver coating | Excellent for high-frequency; flat surface; cost-effective | High-frequency; RF applications |
| Immersion Tin | 0.8-1.2μm tin coating | Flat surface; press-fit compatible; good solderability | Press-fit connectors; flat surface required |
| Gold Plating | 0.8-1.5μm gold | Excellent durability; wire bonding compatible; long shelf life | Wire bonding; edge connectors; high-reliability |
| ENEPIG | Ni/Pd/Au 3-5μm | Wire bonding; superior reliability; long shelf life | Wire bonding; high-reliability applications |
| Hard Gold | 0.5-3.0μm | Excellent wear resistance; edge connector compatible | Edge connectors; high-wear applications |
| Board Type | ENIG | HASL | OSP | Immersion Silver | Immersion Tin | Gold Plating |
|---|---|---|---|---|---|---|
| Single-Sided | ✔ | ✔ | ✔ | ✔ | ✔ | ✔ |
| Double-Sided | ✔ | ✔ | ✔ | ✔ | ✔ | ✔ |
| Multi-Layer | ✔ | ✔ | ✔ | ✔ | ✔ | ✔ |
| Flexible (FPC) | ✔ | — | ✔ | ✔ | — | ✔ |
| Rigid-Flex | ✔ | — | ✔ | ✔ | — | ✔ |
| Aluminum Base | ✔ | — | ✔ | ✔ | ✔ | ✔ |
Stage 1: Surface Preparation – Cleaning and micro-etching to ensure optimal finish adhesion.
Stage 2: Finish Application – Electroless or electrolytic processes applied with precise control—thickness monitoring through XRF analysis.
Stage 3: Verification – XRF analysis verifies finish thickness; visual inspection confirms uniformity.
Stage 4: Solderability Testing – Solderability testing (where required) confirms finish performance.
| Consideration | ENIG | HASL | OSP | Immersion Silver | Immersion Tin | Gold Plating |
|---|---|---|---|---|---|---|
| Solderability | Excellent | Good | Good | Excellent | Good | Excellent |
| Fine-Pitch SMT | Excellent | Poor | Good | Excellent | Good | Excellent |
| Shelf Life | Long (12+ months) | Long (12+ months) | Short (3-6 months) | Long (12+ months) | Medium (6 months) | Long (12+ months) |
| Wire Bonding | No | No | No | No | No | Yes |
| Cost | Medium-High | Low | Low | Medium | Medium | High |
| Flatness | Excellent | Poor | Excellent | Excellent | Excellent | Excellent |
Multiple Finish Options – ENIG, HASL, OSP, Immersion Silver, Immersion Tin, Gold Plating
Precision Application – Thickness controlled to specification; XRF verification
Quality Assurance – Uniformity verification; solderability testing
Complete Service – Fabrication, component sourcing, and assembly—all under one roof
Low Volume Support – Competitive pricing for low volume PCB assembly with any finish
Studio delivers PCB Fabrication with ENIG, HASL, OSP, and more—the right finish for your application.
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Have questions about our products or want to discuss a custom order? Our team is ready to help you.