FPC SMT Rigid Flex Assembly Component Mounting Fast Turn Rigid Flex PCB
Flexible PCB assembly (FPCA) requires precision component mounting on thin, pliable polyimide substrates—a fundamentally different process from rigid board assembly. Studio Electronics offers Flex PCB Assembly with specialized FPC SMT and component mounting services, backed by years of experience handling flexible materials. As a trusted provider of PCB assembly in China, we understand the nuances of flexible circuit processing: carrier fixturing, thermal management, and bend reliability. Our 12 automated SMT lines, custom fixture fabrication capability, and comprehensive inspection equipment deliver reliable FPC assemblies for wearable, medical, and automotive applications.
| Capability | Specification | How We Ensure Quality |
|---|---|---|
| FPC Substrates | Polyimide (PI), Polyester (PET); single/double-sided | Material verification; pre-bake moisture removal |
| Component Types | 01005 to BGAs; fine-pitch QFPs; connectors | Precision placement with ±25μm accuracy; dedicated FPC program parameters |
| Carrier/Fixture | Custom machined carriers; magnetic or vacuum hold-down | Precision tooling pins; flatness verification before production |
| Solder Paste | Low-temperature; fine-pitch compatible | Optimized paste volume; stencil design for flexible substrates |
| Reflow Profile | Controlled low-temperature profile; nitrogen option | Profile validation per FPC type; thermal stress minimization |
| Stiffener Placement | FR4, PI, metal stiffeners | Precise application; adhesion verification |
- Material Procurement
We source FPC boards and electronic components per your BOM. For low volume PCB assembly, we support small-quantity sourcing through authorized distributors. - FPC Preparation
Flexible circuits are pre-baked to eliminate moisture—critical to prevent delamination during reflow. Each FPC is inspected for damage, creases, or contamination before proceeding. - Carrier Mounting
FPCs are precisely mounted onto custom carriers using tooling pins and adhesive or magnetic hold-down. Carriers provide the mechanical stability required for accurate solder paste printing and component placement. - Solder Paste Printing
Specialized stencil design and printing parameters optimized for flexible substrates. Polyurethane squeegees are used to prevent FPC damage. - Component Placement
12 automated SMT lines with fine-pitch capability. Placement parameters are adjusted for FPC—lower nozzle pressure, optimized placement speed—to prevent substrate deflection. - Controlled Reflow
Low-temperature reflow profiles with precise thermal control. Temperature is maintained below polyimide degradation thresholds while ensuring proper solder wetting. - Inspection & Testing
AOI, X-Ray, ICT, and Flying Probe testing; 100% coverage. Dynamic bend testing validates flex reliability. - Final Assembly & Shipping
Careful handling, anti-static packaging, and secure shipping.
- Specialized FPC Handling – Custom carriers, controlled reflow, and careful material handling
- 12 Automated SMT Lines – Precision placement capacity for any component type
- Comprehensive Quality Control – AOI, X-Ray, ICT, Flying Probe, and bend testing
- One-Stop Service – Component sourcing through final assembly and shipping
- Low Volume Support – Competitive pricing for low volume PCB assembly and prototypes
Studio delivers Flex PCB Assembly—FPC SMT and component mounting with the specialized expertise flexible circuits require.
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.