Quality BGA Assembly – 100% X-Ray Inspection
Quality in BGA assembly is defined by what you cannot see—the solder joints hidden beneath the component body. Studio Electronics offers Quality BGA Assembly with 100% X-Ray inspection on every board. As a premier provider of PCB assembly in China, we combine specialized BGA process expertise with advanced 2D and 3D X-Ray systems to verify every solder joint. Our complete turnkey service covers component procurement through final shipping, with uncompromising quality verification at every stage.
| Inspection Parameter | What We Detect | Acceptance Criteria |
|---|---|---|
| Ball Alignment | Misaligned or offset balls | All balls aligned to pads within specification |
| Bridging | Solder bridges between adjacent balls | No electrical shorts; minimum spacing maintained |
| Missing Balls | Absent or misplaced balls | All balls present; correct ball count verified |
| Voids | Internal voids within solder balls | Void ratio <15% per ball (IPC Class 2/3) |
| Cold Solder | Poor wetting or incomplete soldering | All joints show proper wetting; no cold joints |
| Head-in-Pillow | Incomplete ball-to-pad connection | Detected through 3D X-Ray analysis |
Stage 1: Component Sourcing & Incoming Inspection
Components sourced through authorized distributors. For low volume PCB assembly, small-quantity procurement supported. Incoming inspection verifies component integrity and BGA ball condition.
Stage 2: Solder Paste Application
3D SPI verifies paste volume, height, and area. Real-time feedback ensures consistent deposition.
Stage 3: Precision BGA Placement
12 SMT lines with advanced BGA placement. Vision systems ensure accurate alignment. ±25μm placement accuracy.
Stage 4: Controlled Reflow
Custom reflow profiles optimized per BGA type. Closed-loop temperature control; nitrogen reflow option.
Stage 5: 100% X-Ray Inspection
- 2D X-Ray – Ball alignment, bridging, missing balls—fast detection
- 3D X-Ray – Void analysis; automated void calculation per ball
- Documentation – X-Ray images stored per board serial number
- Coverage – 100% of BGA boards; not sampled
Stage 6: Electrical Testing & Final Verification
ICT; Flying Probe; FCT. AOI for visible components. Reliability lab testing available.
Stage 7: Final Assembly & Shipping
Careful handling; anti-static packaging; global logistics with tracking.
| BGA Quality Risk | Visual Inspection | Studio's X-Ray Solution |
|---|---|---|
| Hidden voids | Cannot detect | 3D X-Ray; automated void analysis |
| Head-in-pillow defects | Cannot detect | 3D X-Ray; precise joint analysis |
| Ball bridging | Cannot detect | 2D X-Ray; ball spacing verification |
| Cold solder joints | Cannot detect | X-Ray; solder wetting evaluation |
| Missing balls | Cannot detect | X-Ray; ball count verification |
Studio delivers Quality BGA Assembly—100% X-Ray inspection on every board, every BGA, every ball.
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.