End-to-End BGA Assembly – PCB to Finished Board

End-to-end BGA assembly—from bare PCB to finished, tested, and shipped board—simplified through one integrated service. Studio Electronics offers End-to-End BGA Assembly supporting your project from PCB fabrication through component procurement, SMT assembly, BGA process optimization, X-Ray inspection, and final shipping. As a premier provider of PCB assembly in China, we combine 12 automated SMT lines, specialized BGA expertise, and advanced 3D X-Ray inspection to deliver reliable BGA assemblies with complete documentation.

Stage 1: PCB Fabrication – In-house PCB fabrication (2-20+ layers; rigid/flex; multiple finishes).

Stage 2: Component Sourcing – Components procured through authorized distributors. For low volume PCB assembly, small-quantity procurement supported.

Stage 3: Engineering Review – BGA design review; reflow profile optimization; stencil design.

Stage 4: SMT & BGA Assembly – 12 SMT lines with ±25μm accuracy. BGA placement with vision alignment. Controlled reflow. Nitrogen reflow available.

Stage 5: X-Ray Inspection – 100% coverage; 2D and 3D X-Ray; void analysis; automated void calculation.

Stage 6: Testing & Final Assembly – ICT; Flying Probe; FCT. Careful handling; anti-static packaging; global logistics.

• Complete Accountability – One supplier for your entire project

• Specialized Expertise – BGA process optimization and X-Ray verification

• Quality Assurance – 100% X-Ray inspection; full traceability

• Time Efficiency – No handoff delays between vendors

• Cost Effectiveness – Eliminate multiple vendor markups

Studio delivers End-to-End BGA Assembly—PCB to finished board with 100% X-Ray verification on every BGA.