F4B SERIES PCBS

1. Introduction to F4BM245 F4BM245 is a high-performance PTFE fiberglass laminate manufactured by Taizhou Wangling Insulation Material Factory. It is produced through a scientifically formulated process combining fiberglass cloth, polytetrafluoroethylene (PTFE) resin, and PTFE film under strict processing controls. Compared to the earlier F4B series, F4BM245 delivers significantly improved electrical performance, including lower dielectric loss, higher insulation resistance,

What is F4BTM298? It is a high-dielectric-constant PTFE laminate manufactured by Taizhou Wangling Insulating Materials Factory. It is reinforced with glass fiber cloth. It contains nano-ceramic fillers. The dielectric constant (Dk) is 2.98 ±0.06 at 10 GHz. The dissipation factor (Df) is 0.0018 at 10 GHz. The material has a CTE of 15/16 ppm/°C in the X/Y axes. The Z-axis CTE is 78 ppm/°C. The decomposition temperature (Td) is not specified but the material operates from -55°C

What is F4BTD350S? It is a high-thermal-conductivity PTFE resin high-frequency substrate. It is reinforced with glass fiber cloth. It contains a large amount of high-thermal-conductivity special ceramics. The dielectric constant (Dk) is 3.5 ±0.07 at 10 GHz. The dissipation factor (Df) is 0.0016 at 10 GHz. The thermal conductivity is 1.25 W/(m·K). This is significantly higher than standard PTFE materials. The material has a CTE of 11/10 ppm/°C in the X/Y axes and 40 ppm/°C in

Introduction In the demanding world of aerospace, defense, and high-frequency communications, material performance and reliability are paramount. F4BTMS265 from Taizhou Wangling Insulation Material Factory represents a significant advancement in PTFE-based composite technology. As part of the F4BTMS series—the upgraded successor to the F4BTM family—this material combines the benefits of ultra-thin, ultra-fine glass fiber reinforcement with high ceramic filling to deliver

What is WL-CT350? It is a thermosetting resin-based high-frequency laminate manufactured by Taizhou Wangling Insulating Materials Factory. It is part of the WL-CT series. The dielectric layer is composed of hydrocarbon resin, ceramics, and fiberglass cloth. The dielectric constant (Dk) is 3.48 at 10 GHz. The dissipation factor (Df) is 0.0039 at 10 GHz. The material has a Tg greater than 280°C. The thermal conductivity is 0.70 W/(m·K). The CTE in the X and Y axes is 11 and 14

F4BME275 PTFE Laminate & Custom 2-Layer RF PCB – Complete Guide What is F4BME275? It is a high-performance PTFE glass fabric laminate. It has a dielectric constant (Dk) of 2.75 ±0.05. It has an ultra-low dissipation factor (Df) of 0.0015 at 10 GHz. It is manufactured by Taizhou Wangling Insulating Materials Factory in China. The material uses reverse-treated RTF copper foil. This provides superior low-PIM performance (≤ -159 dBc). It enables precise circuit etching. It also

What is F4BTMS450? F4BTMS450 is an upgraded PTFE-based composite laminate developed by Taizhou Wangling Insulating Material Factory. It represents a technological breakthrough over the F4BTM series, incorporating a significant amount of ceramic filler with ultra-thin and ultra-fine woven fiberglass reinforcement. With a dielectric constant of 4.50 ± 0.09 at 10GHz, a dissipation factor of 0.0015 at 10GHz, and a CTE matched to copper (12 ppm/°C in X/Y), it is an aerospace-grade

F4BTMS265 High Frequency PCB 0.8mm Substrates 1oz Copper With Immersion Gold and Black Solder Mask (PCB's are custom-made products, the picture and parameters shown are just for reference) Brief Introduction This is a type of double sided PCB with 2 layers of copper. It has only surface mount components. The PCB measures 120mm x 65mm with 1 piece up in panel. It starts 17um (0.5 oz) copper with plate on both the top layer and bottom layer. The core of F4BTMS265 (0.762mm) is

F4BTMS1000 High Frequency PCB High DK10.2 PTFE 3.2mm Substrates with Immersion Gold (PCB's are custom-made products, the picture and parameters shown are just for reference) Brief Introduction This Double-sided PCB features circuitry on both the top and bottom layers, each with a copper weight of 2oz. The middle layer consists of an F4BTMS1000 core, measuring 3.175 mm in thickness. The PCB size is 215mm x 145mm, with a single unit in the panel. It is equipped with surface

2-Layer F4BTMS1000 PCB | 10mil Core | OSP Finish Product Overview We are pleased to present this newly customized 2-layer rigid PCB built on Wangling's F4BTMS1000 aerospace-grade, high-reliability PTFE composite laminate. As an upgraded member of the F4BTMS series, this material incorporates a significant amount of ceramic filler with ultra-thin, ultra-fine glass fiber reinforcement, delivering exceptional electrical and mechanical performance for mission-critical RF and

2-Layer F4BME217 PCB | 1.0mm Core | Bare Copper Finish Product Overview We are pleased to present this newly customized 2-layer rigid PCB built on Wangling's F4BME217 high-performance PTFE composite laminate. Engineered for demanding RF and microwave applications, this board delivers superior electrical properties, low loss, and excellent passive intermodulation (PIM) performance. The board measures 102mm x 83mm (single piece) with a finished thickness of 1.3mm (including 1

F4BM300 High Frequency PCB 0.6mm PTFE substrates 2oz Copper With Immersion Gold (PCB's are custom-made products, the picture and parameters shown are just for reference) Brief Introduction This PCB features a square design with dimensions of 85mm x 85 mm, utilizing a double-sided layout that contains two layers of copper. It is compatible with surface mount components, while through-hole components are not included in this design. The layer stackup consists of a top layer

F4BTM320 High Frequency PCB 2oz Copper 1.27mm Substrates With Immersion Gold (PCB's are custom-made products, the picture and parameters shown are just for reference) Brief Introduction This PCB features a size of 110mm x 76mm and is designed as a double-sided layout with two layers. It accommodates surface mount components while excluding through-hole components. The layer stackup includes a top layer of 70 µm (2 oz) copper with starting 1oz plating, supported by a robust

F4BTMS615 High Frequency PCB 1.6mm DK6.15 F4B Substrate With Immersion Gold (PCB's are custom-made products, the picture and parameters shown are just for reference) Brief Introduction This printed circuit board (PCB) is designed as a double-sided board with two layers of copper, features a compact size of 171 mm x 58 mm. It supports surface mount components on top side. The layer stackup consists of a top layer with 35 µm (1 oz) copper starting with half ounces plating,

F4BTME320 High Frequency PCB 2oz Copper 1.0mm Thick With Immersion Gold (PCB's are custom-made products, the picture and parameters shown are just for reference) Brief Introduction This is a 2-layer high frequency printed circuit boards(PCB) built on Wangling F4BTME320 substrates. Both top layer and bottom layer feature 70 µm (2 oz) copper starting from 1oz plating. It supports surface mount components on top side, while through-hole components are not utilized in this design

Metal Based High Frequency PCB Aluminum Based Copper Based RF PCB Immersion Gold (PCB's are custom-made products, the picture and parameters shown are just for reference) Brief Introduction Metal-based substrate is a combination of metal-based high-frequency materials. The intermediate part of it is composed of high-frequency materials like PTFE and others. On one side, it's coated with copper foil, while on the other side, there's a coating of either a copper base or an

F4BM220 High Frequency PCB DK 2.2 PTFE PCB with 3.0mm Thick 1oz Copper and HASL Lead Free (PCB's are custom-made products, the picture and parameters shown are just for reference) Hello everybody, Today we talk about a type of F4BM high frequency circuit board at 3.0mm thick. F4BM series laminates are made by scientifically formulating and strictly pressing a combination of fiberglass cloth, polytetrafluoroethylene resin, and polytetrafluoroethylene film. Its electrical

F4BM265 High Frequency PCB DK 2.65 PTFE RF Circuit Board with 3oz Copper Coating Immersion Gold (PCB's are custom-made products, the picture and parameters shown are just for reference) Hello everybody, Today we talk about a type of F4BM high frequency circuit board. F4BM series laminates are made by scientifically formulating and strictly pressing a combination of fiberglass cloth, polytetrafluoroethylene resin, and polytetrafluoroethylene film. Its electrical performance is

F4BTME300 High Frequency PCB PTFE RF PCB Built on 3.0mm thick with Immersion Silver (PCB's are custom-made products, the picture and parameters shown are just for reference) Hello everybody, Today we talk about a type of F4BTME high frequency circuit board - F4BTME300 PCB. This PCB features a size of 170 mm x 95 mm and is designed as a double-sided board with two layers. It supports surface mount components, while through-hole components are not included in this design. The

F4BTM350 High Frequency PCB Board 1.5mm PTFE Plate with 3oz Copper and Immersion Silver (Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference) PCB Specifications Overview This is a double-sided printed circuit board (PCB) built on F4BTM350 high frequency substrates with a compact size of 67mm x 85 mm and Top surface mount components. The layer stackup includes a robust combination of 3oz copper and F4BTM350 dielectric