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Copper Coin Embedded 6-Layer Hybrid PCB: M6 and IT180 for High-Performance Applications At the forefront of advanced PCB technology, our Copper Coin Embedded 6-Layer Hybrid PCB is designed to meet the rigorous demands of high-speed communication, automotive electronics, and aerospace applications. Utilizing a hybrid construction of M6 high-speed material and IT180 High Tg FR-4, this PCB delivers exceptional thermal performance, signal integrity, and mechanical reliability.

6-Layer Rigid PCB with M6 Material, High Tg FR-4, Resin-Filled Vias, and ENIG Finish (All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.) Today I’m excited to introduce our 6-layer rigid PCB made with a combination of M6 high-speed material and High Tg FR-4. This PCB is designed for high-frequency applications, delivering exceptional thermal performance, low signal loss, and mechanical reliability. It features copper

Megtron6 (M6) R-5775 6-Layer PCB with 1.4mm Thickness: A High-Speed, Low-Loss Solution by Bicheng Technologies Limited (All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.) At Bicheng Technologies Limited, we are proud to offer the Megtron6 (M6) R-5775 6-Layer PCB, a cutting-edge solution designed to meet the demands of high-frequency, high-speed, and high-reliability electronic applications. This PCB is built with

Revolutionizing High-Frequency PCB Design with Megtron6 (M6) R-5775 In the era of 5G, IoT, and advanced computing, the demand for high-speed, low-loss printed circuit boards (PCBs) has never been greater. Enter Megtron6 (M6) R-5775, a cutting-edge multi-layer copper-clad laminate (CCL) designed to meet the rigorous demands of high-frequency, high-speed, and high-reliability applications. Whether it’s 5G communication, automotive radar, data centers, or

Elevating RF Design with DiClad 880 PCBs: Pioneering High-Frequency Innovation In the rapidly evolving field of RF design, the emergence of DiClad 880 PCBs has sparked a revolution in high-frequency innovation. These advanced laminates, characterized by their exceptional performance and reliability, are reshaping the landscape of RF applications. Let's explore the unique features, benefits, and applications of DiClad 880 PCBs through a blend of informative content and

4-Layer Hybrid High-Frequency PCB – RT/duroid 5880 + FR4 (Immersion Gold, Controlled Depth Trench) We present our 4-Layer RT/duroid 5880 + FR4 Hybrid PCB – a high-performance, ultra-low-loss circuit board engineered for demanding millimeter-wave, Ku-band, and aerospace applications. The top RF section utilizes Rogers RT/duroid 5880 glass microfiber-reinforced PTFE laminate (Dk 2.20 ±0.02, Df 0.0009 @ 10 GHz), while the bottom layers use High Tg FR4 for mechanical support and

Unveiling the High-Performance Two-Layer FPC with RA Copper and Green Solder Mask In the fast-paced world of consumer electronics, automotive systems, and medical devices, the demand for smaller, lighter, and more reliable interconnects is never-ending. At the heart of this evolution lies the Flexible Printed Circuit (FPC). Today, we examine a specific high-reliability FPC product—a two-layer board that combines premium materials to deliver outstanding mechanical flexibility

2-Layer TP2000 PCB (6.1mm Thick, Bare Copper) Overview This 2-layer rigid PCB is engineered for demanding high-frequency RF and microwave applications. Built on TP2000 – a unique ceramic-filled thermoplastic laminate – the board delivers an exceptional dielectric constant (Dk) of 20 and an ultra-low dissipation factor (Df) of 0.002 at 5GHz. With a finished thickness of 6.1mm and bare copper surfaces, this design prioritizes signal integrity, mechanical rigidity, and high

2-Layer TF600 High-Frequency PCB – 25mil (0.7mm) with ENIG Finish & Copper-Filled Vias Product Introduction We present our 2-Layer TF600 PCB – a high-performance, thermosetting RF circuit board engineered for applications demanding ultra-low dielectric loss, stable Dk, and reliable thermal performance. Fabricated with TF600 modified PTFE/ceramic composite laminate and finished with ENIG (Electroless Nickel Immersion Gold) , this 0.7mm (25mil) board delivers a stable

2-Layer RT/duroid 5870 High-Frequency PCB – 10mil (0.3mm) with ENIG Finish Product Introduction We present our 2-Layer RT/duroid 5870 PCB – an ultra-thin, high-performance circuit board engineered for demanding stripline, microstrip, and millimeter-wave applications. Fabricated with Rogers RT/duroid 5870 glass microfiber-reinforced PTFE laminate and finished with Electroless Nickel Immersion Gold (ENIG) , this 0.3mm (10mil) board delivers an exceptionally low and stable

2-Layer TMM13i High-Frequency PCB – 150mil (3.9mm) with OSP Finish Product Introduction We present our 2-Layer TMM13i PCB – a high-performance, thick-substrate circuit board engineered for demanding RF and microwave applications requiring a high dielectric constant. Fabricated with Rogers TMM13i isotropic thermoset microwave material and finished with OSP (Organic Solderability Preservative) , this 3.9mm (150mil) board delivers a stable, isotropic Dk of 12.85 ±0.35, ultra-low

2-Layer TRF-45 High-Frequency PCB – 32mil (0.9mm) with Immersion Gold Finish Product Introduction We present our 2-Layer TRF-45 PCB – a high-performance, low-loss circuit board engineered for reliable RF and microwave applications. Fabricated with Taconic TRF-45 ceramic-filled PTFE laminate and finished with Immersion Gold (ENIG) , this 0.9mm (32mil) board delivers a stable dielectric constant (Dk 4.5 ±0.15 @ 10 GHz), low dissipation factor (Df 0.0035), and exceptional

2-Layer RT/duroid 6002 High-Frequency PCB – 30mil (0.8mm) with Immersion Silver Finish Product Introduction We present our 2-Layer RT/duroid 6002 PCB – a premium high-frequency circuit board engineered for demanding microwave and RF applications. Fabricated with Rogers RT/duroid 6002 ceramic-filled PTFE laminate and finished with Immersion Silver, this 0.8mm (30mil) board delivers ultra-low loss (Df 0.0012 @ 10 GHz), exceptional dielectric constant stability (Dk 2.94 ±0.04),

2-Layer RF-30A High-Frequency PCB – 20mil (0.6mm) with ENIG Finish Product Introduction We present our 2-Layer RF-30A PCB – a high-performance, thin-profile circuit board engineered for demanding RF and microwave applications. Fabricated with RF-30A laminate (Dk 3.0, Df 0.003 @ 10 GHz) and finished with Electroless Nickel Immersion Gold (ENIG) , this 0.6mm (20mil) board delivers excellent signal integrity, low insertion loss, and superior environmental stability. The thin

4-Layer Hybrid High-Frequency PCB – WL-CT330 + FR4 (Immersion Gold) Product Introduction We present our 4-Layer WL-CT330 PCB with Immersion Gold – a hybrid solution engineered for high-frequency, high-reliability applications. The design combines a WL-CT330 high-frequency laminate (top two layers) with a High-Tg FR-4 (S1000-2M) substrate (bottom layers). This hybrid stackup delivers ultra-low loss RF performance on the outer layers while maintaining mechanical rigidity and

High-Dk 2-Layer Design Using Rogers TMM10 In high-frequency circuit design, certain applications demand a dielectric constant significantly higher than standard microwave laminates. Chip testers, GPS patch antennas, satellite communication systems, and dielectric polarizers all benefit from materials with Dk values approaching 10—enabling circuit miniaturization, improved antenna gain, and specific phase response characteristics. This article examines a 2-layer PCB implementa

2-Layer RO3010 High-Frequency PCB (50mil / 1.3mm) – EPIG Finish PCB Introduction As a trusted supplier of advanced high-frequency circuit solutions, we are proud to present our Custom 2-Layer RO3010 PCB. Engineered for demanding RF and microwave applications, this board utilizes Rogers RO3010—a ceramic-filled PTFE composite known for its high dielectric constant (10.2) and exceptional signal stability. With a finished thickness of 50mil (1.3mm) and an Electroless Palladium

4-Layer Hybrid PCB with RO4350B and High Tg FR-4 The 4-Layer Hybrid PCB combining Rogers RO4350B and High Tg170°C FR-4 materials is a high-performance circuit board designed for applications requiring excellent high-frequency performance, thermal stability, and durability. With a 10mil dielectric thickness of RO4350B and 1.55mm finished board thickness, this PCB is optimized for RF and microwave circuits, offering precise impedance control and superior mechanical stability. 1

Double-Sided Sandwich Aluminum Substrate PCB: Specifications and Insights 1. PCB Specifications The Double-Sided Sandwich Aluminum Substrate PCB is a high-performance circuit board designed for applications requiring excellent heat dissipation and structural stability. Below are its detailed specifications: Specification Details Type Double-Sided Sandwich Aluminum Substrate Thermal Conductivity >2 W/mK Finished Board Thickness 1.65mm ± 10% Copper Thickness 1oz (35μm) Surface

20mil TLX-0 2-Layer PCB with HASL Finish The 20mil TLX-0 2-Layer PCB is a high-performance, dimensionally stable PCB designed for RF and microwave applications. Built using TLX-0 PTFE fiberglass composites, this PCB offers excellent mechanical and thermal properties, low dielectric loss, and tight dielectric constant tolerances. The HASL (Hot Air Solder Leveling) surface finish ensures excellent solderability and protection, making it ideal for couplers, splitters, amplifiers