High Frequency PCB

TSM-DS3 High Frequency PCB Built on 30mil 0.762mm Double Sided Boards with Immersion Gold (PCB's are custom-made products, the picture and parameters shown are just for reference) Brief Introduction This board is a 2-layer rigid PCB with specific construction details and specifications. The board utilizes copper layers on both sides, each with a thickness of 35 μm. The core material used is Taconic TSM-DS3 with a thickness of 0.762 mm (30mil). The overall finished board

DiClad 527 High Frequency PCB Built on 20mil 0.508mm Substrates with Double Sided Copper and Immersion Gold (Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference) Brief Introduction This PCB is a 2-layer rigid board with stackup of 1oz (35μm) copper on top layer and bottom layer, sandwiching the 20mil DiClad 527 core material. The board measures 150mm x 32mm and maintains precise dimensions with a tolerance of +/- 0.15mm.

RO3003G2 High Frequency PCB (Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference) Material Introduction The high-frequency, ceramic-filled PTFE laminates of Rogers RO3003G2 are an extension of Rogers' industry-leading RO3003 solutions. The development of RO3003G2 laminates is based on industry feedback, with a special focus on addressing the next generation needs for millimeter wave automotive radar applications. The

RO3003G2 High Frequency PCB Built on 10mil 0.254mm substrates with Immersion Gold (Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference) Brief Introduction This PCB is a 2-layer rigid PCB with a stackup consisting of a 10 mil (0.254mm) thick RO3003G2 dielectric material and features a finished copper weight of 35um on both sides. The PCB measures 170mm x 90mm with a tolerance of +/- 0.15mm and the minimum trace width and

DiClad 527 High Frequency PCB (Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference) Substrate Introduction Rogers DiClad 527 laminates are composite materials reinforced with woven fiberglass for use as substrates in printed circuit boards. These laminates offer a higher proportion of fiberglass reinforcement compared to PTFE content. This carefully balanced ratio results in a wider range of dielectric constant (Dk) and

WL-CT High Frequency PCB Introduction The WL-CT series of organic polymer ceramic fiberglass cloth-covered copper boards is a thermosetting resin-based high-frequency material. The composition of the dielectric layer includes hydrocarbon resin, ceramics, and fiberglass cloth. It exhibits low loss performance, meeting the requirements for high-frequency designs. PCB processing can be carried out using techniques similar to FR4 materials, making it simpler compared to PTFE

F4BM High Frequency PCB Introduction These series laminates are made by scientifically formulating and strictly pressing a combination of fiberglass cloth, polytetrafluoroethylene resin, and polytetrafluoroethylene film. Its electrical performance is improved compared to F4B, mainly due to a wider range of dielectric constants, lower dielectric loss, increased insulation resistance, and improved stability. It can replace similar foreign products. F4BM and F4BME have the same

F4BTME High Frequency PCB Introduction This series laminates are made by scientifically formulating fiberglass cloth, nano-ceramic filling, and polytetrafluoroethylene resin, followed by strict pressing processes. The series is based on the F4BM dielectric layer, with the addition of high dielectric and low loss nano-level ceramics, resulting in higher dielectric constant, improved heat resistance, lower thermal expansion coefficient, higher insulation resistance, and better

F4BME High Frequency PCB Introduction These series laminates are made by scientifically formulating and strictly pressing a combination of fiberglass cloth, polytetrafluoroethylene resin, and polytetrafluoroethylene film. Its electrical performance is improved compared to F4B, mainly due to a wider range of dielectric constants, lower dielectric loss, increased insulation resistance, and improved stability. It can replace similar foreign products. F4BME and F4BM have the same

F4BTM High Frequency PCB Introduction This series laminates are made by scientifically formulating fiberglass cloth, nano-ceramic filling, and polytetrafluoroethylene resin, followed by strict pressing processes. The series is based on the F4BM dielectric layer, with the addition of high dielectric and low loss nano-level ceramics, resulting in higher dielectric constant, improved heat resistance, lower thermal expansion coefficient, higher insulation resistance, and better

Rogers RF and Microwave PCB on 60mil 1.524mm AD250C Substrates With Immersion Gold (Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference) General Description This is a type of double layer high frequency PCB built on Rogers AD250C antenna grade materials with dielectric constant of 2.50 and 0.0013 dissipation factor. It is 60mil thick with 1oz copper on both sides, no solder mask and silkscreen. It’s designed with 90mm by

Rogers DiClad 870 Woven Fiberglass Reinforced PTFE-based 31mil 93mil 125mil Microwave PCB (Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference) General Description DiClad 870 laminates are woven fiberglass/PTFE composite materials for use as printed circuit board substrates. In comparison to nonwoven fiberglass reinforced PTFE-based laminates of comparable dielectric constants, the woven fiberglass reinforcement in DiClad

Rogers CLTE-XT High Frequency PCB 9.4mil 25mil 40mil 59mil ceramic filled woven glass reinforced PTFE Circuit Boards (Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference) General Description The CLTE-XT laminates are composites of PTFE, woven fiberglass reinforcement, and micro-dispersed ceramic filler that are intended to increase loss tangent while preserving good dimensional stability and offering excellent thermal

DiClad 870 Microwave PCB with HASL Double Sided 31mil 0.8mm Thick no Solder Maks no Silkscreen (Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference) General Description This is a type of double-sided microwave PCB built on 31mil DiClad 870 substrates. It is a simple printed circuit board without solder mask or silkscreen. The surface finish of pads are protected by hot air soldering level(HASL), lead free type. It has a

High Frequency PCB Built on Rogers IsoClad 917 non-woven fiberglass/PTFE Materials (Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference) Brief Introduction Rogers IsoClad 917 laminates are non-woven fiberglass/PTFE composites using a low ratio of fiberglass/PTFE to achieve the lowest 2.17 or 2.20 dielectric constant and 0.0013 dissipation factor. Longer random fibers and proprietary process of IsoClad 917 provide greater

Rogers DiClad 880 High Frequency PCB Double Layer 20mil 0.508mm With Immersion Gold (Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference) General Description This is a type of Rogers high frequency PCB built on DiClad 880 laminates, double layers with signal layer on top side, shielding layer on bottom side. It is plated with immersion gold, no solder mask or silkscreen. It’s fabricated using 20mil substrates, 0.5oz copper

Precision RF PCB Solution Based on WL-CT300: High-Frequency Performance with FR4-Like Processability For designers working on RF, microwave, and aerospace applications, material selection is a constant trade-off between electrical performance and manufacturability. Traditional PTFE-based laminates offer low loss but introduce challenges in dimensional stability, multilayer processing, and consistency. The WL-CT300 from Taizhou Wangling Insulating Materials Factory closes this

A Custom 2-Layer PCB Solution Based on TF300 High-Frequency Laminate As microwave and millimeter-wave applications continue to evolve—especially in aerospace, satellite communications, and radar systems—the selection of an appropriate PCB substrate is considered critical. Wangling's TF300 PTFE/ceramic composite laminate has been developed to offer excellent dielectric stability, low loss, and a wide operating temperature range, making it an ideal foundation for high-frequency

Product Overview A newly shipped, high-performance 2-layer rigid printed circuit board has been developed for demanding high-frequency and aerospace-grade applications. This PCB has been fabricated using the TP440 laminate from the Wangling TP Series, a unique high-frequency thermoplastic material. The dielectric layer of the TP440 is composed of ceramic and polyphenylene oxide (PPO) resin, and no fiberglass reinforcement has been included. By adjusting the ratio between