Electronics X Ray Machine

UNICOMP AX9100MAX X-Ray Inspection System High-resolution X-ray equipment for PCBA BGA solder quality testing and SMT IC inspection with advanced non-destructive testing capabilities. System Overview This advanced X-ray inspection system is designed for high-precision non-destructive testing of electronics IC components and bonding wire analysis. It is widely deployed across industrial and semiconductor applications for quality control and R&D verification. Applications BGA,

AX8300MAX Unicomp PTH Void & Barrel Crack Detector Advanced X-ray inspection system with Unicomp Auto Void Analysis for comprehensive semiconductor and electronics testing. Features 110kV sealed tube technology with maximum 47.7X geometric magnification for PCBA inspection. Applications This system is widely applicable to semiconductor packaging (BGA, CSP, LED, Flip Chip), automotive parts, new energy industry components, aluminum die castings, injection molded plastics,

UNICOMP AX9600 160KV Open Tube X-ray Inspection System The UNICOMP AX9600 160KV microfocus X-ray inspection system features a proprietary 160kV high-power open-type microfocus X-ray tube, achieving an ultra-fine focal spot of merely 0.8 μm. With maximum geometric magnification of 2000* and superior X-ray penetrability, this system enables precise void fraction quantification for TVS diodes and serves as a high-accuracy inspection solution for advanced IC packaging, HBM

High Specifications Electronic Boards 2D 2.5D X-ray Machine Unicomp AX9100MAX 130KV micron focus spot size tube X-ray machine Unicomp AX9100 with dual computers for PCB BGA inspection. Optimized for high-precision non-destructive testing of semiconductors and electronics, the AX9100MAX provides comprehensive inspection capabilities for IC curvature measurement and various electronic components. Applications BGA, CSP, flip chips, LED packages Fuses, power diodes, multilayer

X-Ray Inspection Equipment for Electronics Description of IC X Ray machine AX7900: Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small MetalCasting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. APPLICATION of IC Xray machine AX7900: Large Size Inspection Table,Laser Pinpoint For Precise Location Accurate Control, CNC Programming,Automatic Positioning FPD Tilting ±25° Safely Electromagn

The Most Economic X-Ray inspection machine AX7900 with high performance Description of IC X Ray machine AX7900: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading area

AX8300MAX 110kV X-ray Inspection System Advanced industrial X-ray inspection system specifically designed for precision analysis of IGBT solder voiding and comprehensive quality verification of electronic components and industrial workpieces. Applications This inspection system is extensively deployed for quality verification of semiconductor packaging devices including BGA, CSP, LED and flip chip, automotive electronic components, new energy core parts, aluminum die castings

AX9100MAX X-Ray Inspection System High-precision non-destructive testing system optimized for laptop battery welding inspection and new energy cell analysis with advanced FPD stitched image functionality. Applications BGA, CSP, flip chips, LED packages, fuses, power diodes, multilayer PCBs, discrete semiconductors, lithium battery modules, precision castings, automotive connectors, wiring harnesses, and photovoltaic components. System Specifications Footprint1450(W) × 1765(D)

Offline 2D X-ray Inspection for LED Void Detection & Ratio Analysis Unicomp AX7900 The Unicomp AX7900 90KV X-ray inspection system is specifically engineered for cable terminal crimp quality assessment and comprehensive electronic component analysis, providing precise inspection capabilities for various industrial applications. System Overview The AX7900 features a 90kV/5μm micro-focus X-ray tube and high-performance FPD detector in a multifunctional workstation design. It

UNICOMP AX9100VS 360° Rotary Observation X-ray Inspection System Advanced 360° rotary observation high clarity 2D/3D scanning X-ray system for electronics assembly manufacturing and industrial inspection applications. Applications BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die Casting, Molded Plastic; Ceramic Products and other special industries. Key Features Precise detection inspection of tiny defects Multi-mode 3D reconstruction

CNC Auto Batch Inspection BGA Editmode X-ray AX9100 UNICOMP Electronics PCBA Processing Inspection System Advanced X-ray inspection system designed for comprehensive defect detection in electronic components and industrial applications. Key Features 130KV 7μm X-Ray tube for precise imaging High speed & millions pixels high resolution FPD 1000X magnification with high-definition real-time image display One-button operation with 2.5D image display Off-line programming function

AX9100MAX X-Ray Inspection System Full-angle 360° Rotation AI Image Enhancement for PCBA QFP SMT Electronic Testing Device Optimized for high-precision non-destructive testing of semiconductors and electronics, the AX9100MAX provides comprehensive inspection capabilities for IC curvature measurement and various electronic components. Applications BGA, CSP, and flip chips LED packages and fuses Power diodes and discrete semiconductors Multilayer PCBs and lithium battery

AX8300MAX X-ray Inspection System Advanced industrial X-ray inspection system specifically designed for precision analysis of IGBT solder voiding and comprehensive quality verification of electronic components and industrial workpieces. Applications This inspection system is extensively deployed for quality verification of semiconductor packaging devices including BGA, CSP, LED and flip chip, automotive electronic components, new energy core parts, aluminum die castings,

UNICOMP AX9100VS Ultra High Precision X-ray Inspection System Advanced X-ray inspection system designed for comprehensive semiconductor and PCBA production analysis with full-angle rotary capabilities. Applications BGA, CSP, LED, Flip Chip Automotive Components and New Energy Industry Aluminum Die Casting, Molded Plastic Ceramic Products and other special industries Key Features Precise detection inspection of tiny defects Multi-mode 3D reconstruction Synchronized 7-axis

AX7900 Real Time Digital X Ray Machine For Electronics Inner Defect Inspection APPLICATION of IC Xray machine AX7900: LED, SMT, BGA, CSP, Flip Chip Inspection. Semiconductor, Packaging components, Battery Industry. Electronic components, Auto parts, Photovoltaic Industry. Aluminum Die Casting, Moulding Plastic. Ceramics, Other Special Industries Technical Specifications of AX7900 Item Definition Specs System Parameters Size 1215(L)x1325(W)x1700(H)mm Weight 1240kg Power 220AC

UNICOMP AX9600 160kV Offline X-ray Inspection System High-precision microfocus X-ray machine for PCB & BGA void measurement and micron-level defect inspection in semiconductor manufacturing. System Overview The UNICOMP AX9600 160KV microfocus X-ray inspection system features a proprietary 160kV high-power open-type microfocus X-ray tube, achieving an ultra-fine focal spot of merely 0.8 μm. With maximum geometric magnification of 2000x and superior X-ray penetrability, this

Auto Void Detection X-ray Machine AX8300 High Motion Precision BGA Solder Joint Testing Equipment by Unicomp The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring a proprietary 110kV micro-focus X-ray source, it perfectly fills the performance gap between conventional 90kV and 130kV X-ray devices, providing balanced penetration power to

Unicomp AX8300 X-ray Inspection System The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT, and electronic component manufacturing. Featuring a proprietary 110kV micro-focus X-ray source, it provides balanced penetration power to solve insufficient penetration of 90kV equipment and excessive energy waste of 130kV models. Key Features 110kV Microfocus X-ray source High resolution Flat

CNC Programmable Automatic Inspection Electronics X-ray Machine Unicomp AX9100MAX Optimized for high-precision non-destructive testing of semiconductors and electronics, the AX9100MAX provides comprehensive inspection capabilities for IC curvature measurement and various electronic components. Applications BGA, CSP, flip chips, LED packages, fuses, power diodes, multilayer PCBs, discrete semiconductors, lithium battery modules, precision castings, automotive connectors,

Wire Harness Quality Detection AX7900 Electronics Unicomp X Ray Equipment Description of IC X-Ray machine AX7900: Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. APPLICATION of IC Xray machine AX7900: FEATURES of IC Xray machine AX7900: Technical Specifications of AX7900 Item Definition Specs System Summary Footprint 1215