Electronics X Ray Machine

AI Automatic Measurement 3D CT Layer Scanning UNICOMP AX9100VS Advanced X-ray inspection system designed for comprehensive semiconductor and PCBA production analysis with full-angle rotary capabilities. Applications BGA, CSP, LED, Flip Chip inspection Automotive Components and New Energy Industry Aluminum Die Casting and Molded Plastic components Ceramic Products and other special industries Key Features Precise detection inspection of tiny defects Multi-mode 3D reconstructio

Unicomp Factory Manufacturing 5μm High Resolution X-ray Equipment for Electric Switch Technical Specifications of AX7900 Item Definition Specs System Parameters Size 1215(L)x1325(W)x1700(H)mm Weight 1240kg Power 220AC,50Hz/60Hz Power Consumption 0.8kW X-ray Tube Type Closed Max.Voltage 90kV Max.Power 8W Spot Size 5μm X-ray System Intensifier FPD Monitor 24 ‘’LCD Geometric Magnification 52X Detection Region Max.Loading Size 600mm x 520mm Max.Inspection Area 505mm x 440mm X-ray

Unicomp AX7900 90KV X-ray Inspection System for MOSFET Void Detection The Unicomp AX7900 90KV X-ray inspection system is specifically engineered for cable terminal crimp quality assessment and comprehensive electronic component analysis, providing precise inspection capabilities for various industrial applications. System Overview The AX7900 features a 90kV/5μm micro-focus X-ray tube and high-performance FPD detector in a multifunctional workstation design. It includes

Chinese Manufacturer FDP 90KV X-ray Inspection System for Wire Harness Defects Detecting​ Description of IC X-Ray machine AX7900: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines.

AX9100MAX High Resolution 7-Axis X-Ray Inspection System The UNICOMP AX9100MAX represents the pinnacle of precision non-destructive testing technology, featuring high-resolution 7-axis linkage for comprehensive PCBA QFN solder quality inspection with advanced off-line programming capabilities. Applications BGA, CSP, flip chips, LED packages, fuses, power diodes, multilayer PCBs, discrete semiconductors, lithium battery modules, precision castings, automotive connectors,

High Resolution Digital X-Ray System Unicomp AX9100Max Advanced X-ray inspection system designed for ADSL splitter PCBA solder void detection and internal defect analysis in electronic components with high precision non-destructive testing capabilities. Applications This system is widely deployed for high-precision non-destructive inspection across extensive industrial and semiconductor applications, including: BGA, CSP, and flip chip components LED packaging components and

Wire Harness Cable Crimp Joint Void Detector AX8300 Unicomp X-ray Machine The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring a proprietary 110kV micro-focus X-ray source, it perfectly fills the performance gap between conventional 90kV and 130kV X-ray devices, providing balanced penetration power to solve insufficient penetration of 90kV

CX300 Unicomp Gold Bond Inspection Equipment 90kV 5μm Resolution Bonding Wire Semiconductor X-ray Tester for precise inspection and quality control. Applications BGA, CSP, LED, Flip Chip, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Aerospace Components, Photovoltaic Industry, and other specialized industries. Key Features Super Compact Desktop Design Multi-function X-Ray Inspection Multiple Inspection Modes Portable with Wheels Status

X-Ray Inspection Equipment for IC Description of IC X Ray machine AX7900: It has extensive applications in diverse fields such as BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Production, Miniature Metal Casting, Electronic Connector Assemblies, Wiring, Aerospace Parts, and Photovoltaic Industry, to name a few. FEATURES of IC Xray machine AX7900: Precision Positioning Laser Pointer System Installed on a Large Inspection Table Accurate Control, CNC

SMT PCB X-ray Machine - Unicomp AX9100MAX High-resolution micron focus spot size X-ray system optimized for BGA voids measurement and comprehensive non-destructive testing of semiconductors and electronic components. Applications BGA, CSP, flip chips, LED packages, fuses, power diodes, multilayer PCBs, discrete semiconductors, lithium battery modules, precision castings, automotive connectors, wiring harnesses, and photovoltaic components. System Specifications Footprint 1450

The Most Economic X-Ray inspection machine AX7900 with high performance Description of IC X Ray machine AX7900: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading area

Desktop Offline Real Time X-Ray Machine High Precision For Electronics Components​ OUR SERVICE 1. Your inquiry will be replied in 12 hours. 2. Original Manufacture to customers, with competitive price. 3. We provide one year warranty, free training and whole life technology support. 4. We can arrange the shipment by air, DHL,Fedex, UPS, and by Sea,etc for you,and will give you the tracking NO. after shipment. 5. Well-trained and Professional after-sales service team to

UNICOMP AX9100VS X-ray Inspection System Advanced X-ray inspection system designed for comprehensive semiconductor and PCBA production analysis with full-angle rotary capabilities. Applications BGA, CSP, LED, Flip Chip inspection Automotive Components and New Energy Industry Aluminum Die Casting and Molded Plastic components Ceramic Products and other special industries Key Features Precise detection inspection of tiny defects Multi-mode 3D reconstruction capabilities

90kv X ray machine high resolution Unicomp AX7900 with 5um tube for BGA bonding wires curvature testing Description of IC X Ray machine AX7900: It is broadly utilized in industries such as BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Batteries, Small Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, and Photovoltaics, among others. FEATURES of IC Xray machine AX7900: Large Size Inspection Table Laser Pinpoint For Precise Location

HD FPD Electronics X Ray Machine 0.8kW For Semicon IC Chips Microfocus X Ray machine with HD FPD for semicon IC chips wire sweep broken defect Inspection Specifications of Xray machine: System Summary Footprint 1215(W)×1325(D)×1700(H)mm Machine Weight 1240 kg Power Supply AC 220V, 50/60Hz Plywood Packing Size 1680(W)×1680(D)×2200(H)mm Packing Weight 1240 kg Power Consumption 0.8kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 90kV Focus Spot Size 5μm Imaging System

Unicomp AX7900 2D X-ray Machines for Button Cell Battery Internal Defect Detection The Unicomp AX7900 90KV X-ray inspection system is specifically engineered for cable terminal crimp quality assessment and comprehensive electronic component analysis, providing precise inspection capabilities for various industrial applications. System Overview The AX7900 features a 90kV/5μm micro-focus X-ray tube and high-performance FPD detector in a multifunctional workstation design. It

Unicomp AX9100MAX X-Ray Inspection System 130KV micron focus spot size tube X-ray machine with dual computers for high-precision PCB and BGA inspection. Optimized for non-destructive testing of semiconductors and electronics, providing comprehensive inspection capabilities for IC curvature measurement and various electronic components. Applications BGA, CSP, flip chips, LED packages, fuses, power diodes, multilayer PCBs, discrete semiconductors, lithium battery modules,

X-Ray Inspection Equipment for Electronics Description of IC X Ray machine AX7900: It is broadly utilized in a variety of fields including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, Small Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, the Photovoltaic Industry, among others. APPLICATION of IC Xray machine AX7900: Inspection Table of Large Dimensions, Laser Pinpointing for Exact Positioning Precise Control

Unicomp AX7900 X Ray Inspection Machine for Electric Switch Inner Quality Testing FEATURES of IC Xray machine AX7900: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, X-Y multi-axis movement. ±60° "Arc" motion(Option). Motion controls include X/Y table motion plus Z-axis tube and detector movement, ±60° tilt motion (option). Multi-function DXI image processing system. X/Y programming function for multiple image inspection routines Max. loading area 600mm x 520mm

X-Ray Inspection Equipment for Electric Razor Description of IC X Ray machine AX7900: It is broadly utilized in various sectors such as BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small-scale Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, Photovoltaic Industry, and more. FEATURES of IC Xray machine AX7900: Laser Pinpointing System on a Large Inspection Table for Precise Positioning Accurate Control, CNC Programming