RF PCB Board

This is a 4-layer rigid PCB fabricated with a high-performance composite material system, WL-CT330 and High Tg FR-4 (S1000-2M). It integrates WL-CT330's ultra-low loss and high-frequency stability with High Tg FR-4's mechanical robustness, compliant with industrial standards, featuring 2.7mm finished thickness, 1oz copper weight for all layers, and Immersion Gold surface finish, ensuring reliable performance for high-end RF and electronic applications. PCB Details Item

This 14-layer high-speed low-loss PCB is fabricated using M6 high-performance substrate, which is specifically engineered for high-speed signal transmission applications. It strictly adheres to IPC-3 quality standards, featuring a finished board thickness of 2.406mm, and incorporates professional manufacturing processes including 5-point impedance control, 0.2mm via holes with resin plugging, and electroplating leveling. The product exhibits superior signal integrity and

This is a 2-layer rigid PCB fabricated from Rogers RT/duroid 5870, a high-frequency glass microfiber-reinforced PTFE composite. Optimized for precision stripline/microstrip designs, it delivers uniform dielectric performance and ultra-low loss, ideal for Ku-band and millimeter-wave applications. This PCB features a finished thickness of 0.3mm, 1 oz (1.4 mils) copper cladding on both outer layers, and an Electroless Nickel Immersion Gold (ENIG) surface finish. PCB Specificatio

This 2-layer rigid PCB is fabricated from TF600, a thermosetting high-frequency laminate composed of modified PTFE resin and micron-sized ceramic fillers. It features 0.7mm finished thickness, 1 oz (1.4 mils) outer copper cladding, ENIG surface finish, and copper-filled vias on specified IC pads, ensuring superior signal integrity, thermal stability, and long-term reliability for high-frequency systems. PCB Specifications Specification Item Technical Specification Base

This 2-layer rigid PCB is fabricated using TP2000, a specialized high-frequency thermoplastic material composed of ceramic and polyphenylene oxide (PPO) resin, with no glass fiber reinforcement. It is specifically engineered for high-frequency radio frequency (RF) and microwave applications. TP2000 exhibits an ultra-high dielectric constant (DK), an ultra-low dissipation factor (Df), and superior thermal stability, rendering it highly suitable for designs requiring compact

This PCB is a double-sided rigid board fabricated using TRF-45, a new generation of low-loss, thermally stable laminated material. Characterized by woven-glass reinforcement for enhanced dimensional stability and integrated ceramic technology, TRF-45 ensures low and consistent Z-axis expansion even under soldering conditions. Engineered with a finished thickness of 0.9 mm, 1 oz (1.4 mils) copper cladding on the outer layers, and an Immersion Gold surface finish, this PCB

This 2-layer rigid PCB, specifically engineered for radio frequency (RF) and microwave applications, incorporates TLX-0—a polytetrafluoroethylene (PTFE) fiberglass composite substrate—and features a Hot Air Solder Leveling (HASL) surface finish. It delivers superior mechanical stability, consistent dielectric performance, and reliable operation in extreme environments, making it well-suited for low layer count microwave designs utilized in radar systems, mobile communications

This 2-layer rigid printed circuit board (PCB) utilizes RF-60A as its core substrate and incorporates a 100 uinch Pure Gold Plating surface finish. Featuring a 1oz (1.4 mils) copper weight on the outer layers, a final board thickness of 1.5mm, and a via plating thickness of 20 μm, this PCB delivers consistent electrical performance and high-precision manufacturing standards, making it highly applicable for power amplifiers, filters, and other high-frequency electronic devices

This double-sided PCB utilizes AD300D as its core substrate and incorporates an EPIG (nickel-free) surface finish. Configured with 1oz (1.4 mils) copper cladding on the outer layers, a finished board thickness of 1.2mm, and 20 μm via plating, the PCB delivers consistent electrical performance and high-precision manufacturing uniformity, making it highly suitable for applications including cellular infrastructure base station antennas, automotive telematics antenna systems,

This is a high-performance 2-layer rigid printed circuit board (PCB) manufactured using Taconic TLX-7, a high-frequency laminate based on polytetrafluoroethylene (PTFE) and reinforced with woven fiberglass. Specifically designed to deliver exceptional electrical performance in rigorous RF and microwave applications, the PCB leverages the material’s low and stable dielectric constant (Dk=2.6), ultra-low dissipation factor (DF), and excellent electrical stability across a wide

This 2-layer rigid PCB complies with international industry standards for reliable performance. It utilizes Rogers CuClad 217 as its base substrate, engineered to meet the stringent requirements of high-frequency and microwave applications with superior electrical and mechanical characteristics. PCB Specification Item Details Base Material Rogers CuClad 217 Layer Count 2 layers, no blind vias Board Dimensions 89mm x 56mm, 1 Piece, with a tolerance of +/- 0.15mm Minimum Trace

This 2-layer rigid PCB complies with international industry standards for reliable performance. It utilizes CER-10 organic-ceramic laminate as its base substrate, engineered to meet the stringent requirements of high-performance microwave and passive component applications with superior mechanical and electrical characteristics. PCB Specification Item Details Base Material CER-10 (organic-ceramic laminate) Layer Count 2 layers, no blind vias Board Dimensions 89.3mm x 56.9mm,

This 2-layer rigid PCB adopts WL-CT350, a thermosetting resin-based high-frequency laminate composed of hydrocarbon resin, ceramics, and fiberglass cloth. Specifically engineered to meet rigorous high-frequency signal transmission requirements, it is highly applicable to base station antennas, automotive radar, and other precision RF systems. PCB Specifications Parameter Details Layer Count 2-Layer (rigid structure) Base Material WL-CT350 Board Dimensions 41.8mm × 51.35mm per

Utilizing RF-10 copper clad laminate as the base material, this 2-layer rigid PCB is tailored for high-performance RF applications. RF-10 integrates ceramic filled PTFE and woven fiberglass, endowing the PCB with high dielectric constant, low dissipation factor, and excellent dimensional stability. It reliably fulfills the stringent requirements for high-frequency signal transmission in precision RF scenarios, including microstrip patch antennas and GPS antenna systems. PCB

Double-layer 1.6mm TMM4 PCB Silver and Gold Plating This high-performance 2-layer PCB is built with Rogers TMM4--a premium thermoset microwave material composed of ceramic, hydrocarbon, and thermoset polymer composite. Engineered for robust RF/microwave applications, it combines the mechanical resilience of ceramic with the process compatibility of traditional materials, eliminating the need for specialized fabrication techniques. PCB Specification Parameter Details Base

2L MT77 PCB 10mil Material Low-Loss Circuit Board This 2-layer rigid PCB is built with Astra MT77--an advanced low-loss dielectric material--optimized for millimeter-wave and RF/microwave commercial applications. PCB Specifications Parameter Specification Layer Count 2-layer rigid PCB Base Material Astra MT77 Board Dimensions 48.5mm x 43.3mm (1 piece), tolerance ±0.15mm Finished Board Thickness 0.33mm Finished Copper Weight 1oz (1.4 mils / 35μm) Via Plating Thickness 20μm

RO3003 PCB Double-Layer 50mil Rogers Laminate 1OZ RF Circuit Board This 2-layer rigid printed circuit board (PCB) is tailored for high-performance commercial microwave and RF applications, capitalizing on the outstanding properties of Rogers RO3003 ceramic-filled PTFE composite laminates. It provides stable electrical performance across a broad spectrum of temperatures and frequencies, rendering it a dependable option for crucial systems such as automotive radar, 5G mmWave

2-layer PCB on RF-10 Substrate 20mil Immersion Silver Finish This 2-layer high-performance PCB is engineered for RF (Radio Frequency) applications, utilizing the advanced properties of RF-10 copper clad laminates to achieve exceptional electrical, thermal, and mechanical performance. 1. PCB Specifications Parameter Specification Base Material RF-10 copper clad laminate (ceramic-filled PTFE with woven fiberglass reinforcement) Layer Count 2 layers (top and bottom copper layers

Double-layer Taconic TLY-3 PCB 20mil Laminate This 2-layer rigid PCB is built around Taconic TLY-3, a high-performance laminate featuring lightweight woven fiberglass. Renowned for exceptional dimensional stability, ultra-low dissipation factor, and consistent dielectric properties, TLY-3 makes this PCB a standout choice for demanding applications—from automotive radar (77 GHz) to satellite communications and aerospace systems. 1. PCB Specifications Parameter Specification

50mil Taconic TLX-9 PCB 2-layer Immersion Tin Finish This 2-layer rigid PCB is crafted from Taconic TLX-9, a PTFE/woven glass laminate. This material is highly valued for its exceptional electrical and mechanical stability, making it a top choice for applications where consistent performance and reliability are critical. 1. PCB Specifications This 2-layer rigid PCB is meticulously crafted with specifications optimized for precision and performance: Parameter Specification