RF PCB Board

Copper coin embedded PCB 6-Layer M6+High TG FR4 This 6-layer PCB integrates high-performance M6 High Speed material with High Tg FR-4, designed for demanding high-frequency, high-temperature, and reliability-critical applications. It complies with global quality standards and supports complex circuit designs across industries like 5G, automotive, and aerospace. 1. PCB details Parameter Specification Base Material M6 High Speed material + High Tg FR-4 (optimized for high

We proudly present our high-performance 4-layer rigid PCB manufactured with premium polyimide material, specifically engineered for demanding applications in extreme environments. This PCB delivers exceptional reliability in high-temperature, high-pressure operating conditions for aerospace, military electronics, and downhole oil extraction equipment. The stack-up of this PCB consists of: - Copper Layer 1: 35 μm (1oz) - Polyimide Core: 0.32 mm - Copper Layer 2: 35 μm (1oz) -

Introducing the TP1020 Double-Sided PCB, a high-performance printed circuit board designed for advanced applications in high-frequency environments. Constructed with top-grade TP1020 material, this PCB is engineered for reliability and optimal dielectric performance, making it ideal for complex electronic circuits. The TP1020 material is a unique thermoplastic composition, integrating ceramics with polyphenylene oxide resin (PPO). Unlike traditional PCB materials reinforced

In the world of electronics, the demand for innovative and reliable printed circuit boards (PCBs) is ever-increasing. The IsoClad 933 PCB emerges as a standout solution, specifically designed for applications that require high performance and durability, such as conformal antennas, radar systems, and missile guidance technologies. Material Composition This high frequncy PCB is constructed from IsoClad 933 laminates, which are nonwoven fiberglass and PTFE composites. This

Introducing the RT/Duroid 5880 PCB The RT/Duroid 5880 is a premium high-frequency laminate designed for demanding stripline and microstrip circuit applications. Crafted from advanced PTFE composites reinforced with glass microfibers, this PCB guarantees exceptional dielectric constant uniformity, ensuring reliable performance across a wide frequency range. Key Features: Dielectric Constant: 2.2 with a tight tolerance of 0.02 at 10 GHz/23°C. Dissipation Factor: An impressive 0

Introducing the Wangling TP PCB, a revolutionary high-frequency thermoplastic circuit board designed to meet the demanding needs of modern electronic applications. Utilizing a unique composite of ceramics and polyphenylene oxide resin (PPO), the TP material offers exceptional dielectric performance while eliminating the need for fiberglass reinforcement. This innovative design allows for precise adjustments to the dielectric constant, making it an ideal choice for a wide

Brief Introduction TB-73 high-temperature resistant and high-frequency Polyimide copper-clad laminates are designed to withstand high temperatures and high frequencies. They are used in the manufacture of special high-temperature and high-frequency circuit boards for electronic equipment in demanding industries such as aerospace, aviation, military, and underground petroleum exploration, among others. The material has excellent high-frequency dielectric properties, high

Rogers RT/Duroid 5870 20mil 0.508mm High Frequency PCB Double Sied RF PCB for Millimeter Wave Applications (Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference) Rogers RT/duroid 5870 high frequency material is glass microfiber reinforced PTFE composites which is designed for exacting stripline and microstrip circuit applications. The exceptional dielectric constant uniformity results from its randomly oriented microfibers.

This is a 4-layer rigid PCB fabricated with a high-performance composite material system, WL-CT330 and High Tg FR-4 (S1000-2M). It integrates WL-CT330's ultra-low loss and high-frequency stability with High Tg FR-4's mechanical robustness, compliant with industrial standards, featuring 2.7mm finished thickness, 1oz copper weight for all layers, and Immersion Gold surface finish, ensuring reliable performance for high-end RF and electronic applications. PCB Details Item

This 14-layer high-speed low-loss PCB is fabricated using M6 high-performance substrate, which is specifically engineered for high-speed signal transmission applications. It strictly adheres to IPC-3 quality standards, featuring a finished board thickness of 2.406mm, and incorporates professional manufacturing processes including 5-point impedance control, 0.2mm via holes with resin plugging, and electroplating leveling. The product exhibits superior signal integrity and

This PCB is a high-precision, double-sided rigid printed circuit board expertly fabricated using Rogers TMM13i, an advanced isotropic thermoset microwave material. Engineered for exceptional reliability in high-frequency applications, TMM13i combines the superior dielectric properties of ceramic with the processing flexibility of PTFE substrates, delivering consistent performance across extreme operational conditions. With a finished board thickness of 3.9mm, 1oz (35μm)

This is a 2-layer rigid PCB fabricated from Rogers RT/duroid 5870, a high-frequency glass microfiber-reinforced PTFE composite. Optimized for precision stripline/microstrip designs, it delivers uniform dielectric performance and ultra-low loss, ideal for Ku-band and millimeter-wave applications. This PCB features a finished thickness of 0.3mm, 1 oz (1.4 mils) copper cladding on both outer layers, and an Electroless Nickel Immersion Gold (ENIG) surface finish. PCB Specificatio

This PCB is a two-layer rigid PCB fabricated using Rogers RT/duroid 6002, a ceramic-filled polytetrafluoroethylene (PTFE) microwave laminate distinguished by its low dielectric constant and minimal loss properties. It is engineered with a finished thickness of 0.8 mm, 1 oz (1.4 mils) copper cladding on the outer layers, and an Immersion Silver surface finish, which collectively ensure consistent and reliable performance for sophisticated microwave and high-frequency

This 2-layer rigid PCB is fabricated from TF600, a thermosetting high-frequency laminate composed of modified PTFE resin and micron-sized ceramic fillers. It features 0.7mm finished thickness, 1 oz (1.4 mils) outer copper cladding, ENIG surface finish, and copper-filled vias on specified IC pads, ensuring superior signal integrity, thermal stability, and long-term reliability for high-frequency systems. PCB Specifications Specification Item Technical Specification Base

This 2-layer rigid PCB is fabricated using TP2000, a specialized high-frequency thermoplastic material composed of ceramic and polyphenylene oxide (PPO) resin, with no glass fiber reinforcement. It is specifically engineered for high-frequency radio frequency (RF) and microwave applications. TP2000 exhibits an ultra-high dielectric constant (DK), an ultra-low dissipation factor (Df), and superior thermal stability, rendering it highly suitable for designs requiring compact

This PCB is a double-sided rigid board fabricated using TRF-45, a new generation of low-loss, thermally stable laminated material. Characterized by woven-glass reinforcement for enhanced dimensional stability and integrated ceramic technology, TRF-45 ensures low and consistent Z-axis expansion even under soldering conditions. Engineered with a finished thickness of 0.9 mm, 1 oz (1.4 mils) copper cladding on the outer layers, and an Immersion Gold surface finish, this PCB

This is a 2-layer rigid PCB fabricated with high-performance RF-grade material RF-30A, which is engineered with an advanced resin system and optimized glass fabric reinforcement. The PCB integrates RF-30A's exceptional high-frequency signal transmission, low dielectric loss and outstanding environmental stability, compliant with industrial standards. It features a 0.6mm finished thickness, 1 oz copper weight for outer layers, and Electroless Nickel Immersion Gold (ENIG)

This is a 2-layer rigid printed circuit board (PCB) fabricated using TSM-DS3—a ceramic-filled reinforced material containing approximately 5% fiberglass—with an Immersion Gold surface finish. The outer layers feature a 1oz (1.4 mils) copper weight, complemented by a finished board thickness of 0.6mm and a via plating thickness of 20 μm, all of which contribute to stable performance and precise manufacturing tailored for high-demand, high-power electronic applications. PCB

This 2-layer rigid PCB, specifically engineered for radio frequency (RF) and microwave applications, incorporates TLX-0—a polytetrafluoroethylene (PTFE) fiberglass composite substrate—and features a Hot Air Solder Leveling (HASL) surface finish. It delivers superior mechanical stability, consistent dielectric performance, and reliable operation in extreme environments, making it well-suited for low layer count microwave designs utilized in radar systems, mobile communications

This 2-layer rigid printed circuit board (PCB) utilizes RF-60A as its core substrate and incorporates a 100 uinch Pure Gold Plating surface finish. Featuring a 1oz (1.4 mils) copper weight on the outer layers, a final board thickness of 1.5mm, and a via plating thickness of 20 μm, this PCB delivers consistent electrical performance and high-precision manufacturing standards, making it highly applicable for power amplifiers, filters, and other high-frequency electronic devices