RF PCB Board

This 2-layer TLY-5 rigid PCB is a premium ultra-low-loss high-frequency circuit board tailored for millimeter-wave and high-precision RF applications. Built with high-stability TLY-5 woven fiberglass-reinforced PTFE laminate, this rigid PCB features a 0.3mm finished board thickness and reliable EPIG surface finish, paired with 1oz outer-layer copper. Produced under strict IPC-Class-2 guidelines and 100% electrically tested prior to delivery, it delivers minimal dielectric

This is a custom 2-layer rigid high-frequency PCB built with Wangling TP440 thermoplastic dielectric material, engineered for high-stability radio frequency and miniature antenna applications. It adopts immersion gold surface finish with no solder mask and silkscreen on both sides. PCB Specification Parameter Item Specification Board Dimensions 67.5mm × 58.6mm (1 piece), dimensional tolerance: ±0.15mm Minimum Trace / Space 6 mils / 8 mils Minimum Mechanical Hole Size 0.3mm

This is a customized 2-layer rigid high-frequency PCB utilizing Taconic CER-10 organic-ceramic laminate, engineered for high-performance microwave and RF circuit applications. The board features immersion silver surface plating with double-sided silkscreen-free and solder mask-free construction. Each unit is fully electrically tested prior to delivery to guarantee consistent and dependable performance. PCB Specification Parameter Item Specification Base Material Taconic CER

This custom 2-layer rigid high-frequency PCB is fabricated with Wangling WL-CT300 thermosetting dielectric substrate, engineered for high-reliability RF, microwave and antenna system applications. The board adopts pure gold plating surface finishing, with black silkscreen printed on the top layer, no silkscreen on the bottom layer, and is constructed without double-sided solder mask. PCB Specification Parameter Item Specification Base Material WL-CT300 high-frequency

This custom 4-layer hybrid high-frequency PCB adopts WL-CT338 thermoset hydrocarbon ceramic glass-reinforced substrate combined with high-Tg FR4 dielectric materials. Featuring dual-side green solder mask with white legend and ENIG surface finish, the PCB applies differentiated inner/outer copper weight, standard FR4 fabrication process and stable lamination structure. With finished lamination thickness of 1.47mm and board dimension 175mm×121mm (10pcs), it delivers outstandin

This is a customized 2-layer rigid high-frequency PCB fabricated with Wangling TF300 high-performance dielectric substrate, designed for high-stability microwave and millimeter-wave circuits and miniature antenna systems. The board is finished with immersion gold, with no solder mask or silkscreen applied on either top or bottom surfaces. PCB Specification Parameter Item Specification Base Material TF300 high-frequency dielectric material Layer Count 2 layers rigid PCB Board

Today, I'd like to discuss a remarkable ceramic-filled PTFE composite that offers exceptional stability in both electrical and mechanical aspects. Rogers' RO3010 high frequency circuit laminates are specifically designed for commercial microwave and radio frequency applications. These laminates are made of ceramic-filled PTFE composites, which provide outstanding electrical properties and consistent mechanical properties. This allows our designers to create multilayer board

Hi, today we are happy to introduce the latest PCB from Bicheng Limited, the industry leader in high-quality printed circuit boards. This double-sided PCB is constructed with Rogers RO3010 material and a lead-free process, ensuring a reliable and environmentally-friendly product. With a working temperature range of -40℃ to +85℃, this PCB is designed to withstand extreme conditions. The board dimensions are 8.00 x 8.00 mm, with a minimum trace/space of 5/5 mils and a minimum

Copper coin embedded PCB 6-Layer M6+High TG FR4 This 6-layer PCB integrates high-performance M6 High Speed material with High Tg FR-4, designed for demanding high-frequency, high-temperature, and reliability-critical applications. It complies with global quality standards and supports complex circuit designs across industries like 5G, automotive, and aerospace. 1. PCB details Parameter Specification Base Material M6 High Speed material + High Tg FR-4 (optimized for high

This PCB is a high-precision, double-sided rigid printed circuit board expertly fabricated using Rogers TMM13i, an advanced isotropic thermoset microwave material. Engineered for exceptional reliability in high-frequency applications, TMM13i combines the superior dielectric properties of ceramic with the processing flexibility of PTFE substrates, delivering consistent performance across extreme operational conditions. With a finished board thickness of 3.9mm, 1oz (35μm)

This is a 2-layer rigid printed circuit board (PCB) fabricated using TSM-DS3—a ceramic-filled reinforced material containing approximately 5% fiberglass—with an Immersion Gold surface finish. The outer layers feature a 1oz (1.4 mils) copper weight, complemented by a finished board thickness of 0.6mm and a via plating thickness of 20 μm, all of which contribute to stable performance and precise manufacturing tailored for high-demand, high-power electronic applications. PCB

This 2-layer rigid PCB adopts TLY-5, a dimensionally stable laminate with lightweight woven fiberglass. Specifically engineered to meet rigorous high-frequency RF signal transmission requirements, it is highly applicable to automotive radar and millimeter wave antenna systems. PCB Specifications Parameter Details Layer Count 2-Layer (rigid structure) Base Material TLY-5 Board Dimensions 55mm × 50mm per piece (1PCS), tolerance ±0.15mm Minimum Trace/Space 6 mils (trace) / 8

This is a high-performance 2-layer rigid printed circuit board (PCB) fabricated with TLX-8 high-frequency laminate, featuring a 30mil (0.762mm) board thickness, 1oz copper weight, immersion gold surface finish, and no solder mask or silkscreen (no oil, no text). This PCB leverages TLX-8’s superior electrical and mechanical properties, making it suitable for various high-frequency applications that demand stable performance and reliable structural integrity. PCB Specification

This PCB is a two-layer rigid PCB fabricated using Rogers RT/duroid 6002, a ceramic-filled polytetrafluoroethylene (PTFE) microwave laminate distinguished by its low dielectric constant and minimal loss properties. It is engineered with a finished thickness of 0.8 mm, 1 oz (1.4 mils) copper cladding on the outer layers, and an Immersion Silver surface finish, which collectively ensure consistent and reliable performance for sophisticated microwave and high-frequency

This is a 2-layer rigid PCB fabricated with high-performance RF-grade material RF-30A, which is engineered with an advanced resin system and optimized glass fabric reinforcement. The PCB integrates RF-30A's exceptional high-frequency signal transmission, low dielectric loss and outstanding environmental stability, compliant with industrial standards. It features a 0.6mm finished thickness, 1 oz copper weight for outer layers, and Electroless Nickel Immersion Gold (ENIG)

Looking for a high-performance 2-layer rigid PCB optimized for RF applications? This 2-layer rigid PCB is built with RF-10 copper clad laminates—a composite of ceramic-filled PTFE and woven fiberglass—designed to address the growing need for size reduction in RF applications while maintaining superior signal integrity. Engineered to IPC-Class 2 quality standards, this PCB delivers reliable performance for critical applications like microstrip patch antennas, GPS antennas, and

This PCB utilizes TP600 as its base material, adopts an Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) surface finish, and strictly complies with IPC-Class-2 quality criteria. Configured as a double-sided rigid structure with a 0.5mm (19.6 mil) TP600 substrate core, it is custom-engineered to satisfy the high-reliability and high-frequency performance demands of precision electronic systems, including satellite navigation and missile-borne devices. PCB

This PCB utilizes TP960 as its base material, features an Electroless Nickel Immersion Gold (ENIG) surface finish, and strictly adheres to IPC-Class-2 quality specifications. Designed as a double-sided rigid structure with a 0.5mm (19.6 mil) TP960 substrate core, it is tailored to meet the high-reliability and high-frequency performance criteria of precision electronic systems, such as global satellite navigation equipment and missile-borne platforms. PCB Specifications

This PCB utilizes WL-CT440 as its base material, incorporates an Immersion Gold surface finish, and strictly adheres to IPC-Class-2 quality specifications. Configured as a 2-layer rigid structure with a 0.254mm (10 mil) WL-CT440 substrate core, it is tailored to meet the high-frequency, low-loss performance requirements of aerospace, radar, and satellite communication systems. PCB Specifications Construction Parameter Specification Base Material WL-CT440 (hydrocarbon resin

0.6mm TLX-0 PCB Double-Sided Immersion Gold Finish This 2-layer rigid PCB caters to versatile RF and microwave applications, utilizing TLX-0—a PTFE fiberglass composite—to offer stable electrical performance and outstanding resilience in harsh environments (e.g., vibration, extreme temperatures, radiation). Every construction detail, from material selection to hole treatment, is optimized for low-layer-count microwave designs, ensuring reliability across use cases like radar