Photography Light LED Chip
4050 RGBCW COB LED 180W Chips 2700K+6500K 5 Colors For Photography Lights
Five-Color Cob Chip 4050 180w Rgbwc Led Chip 21v 24v For Photography Light Rgbwc Led Chip Product Detailed Parameters Model POWER CCT LM/W IF VF WHOLE SIZE EMIT SIZE 4050 SERIES 180W 620nm/460nm/520nm/2700K /6500K 90 W/C:2.8A RGB:1A 21-24V 40X50MM 32MM The latest five-color LED chip uses NCSP technology, which makes the LED chip have high precision, high resolution and good controllability. patent “NCSP” technology, higher power better heat transfer Five-Color Cob Chip FAQ:
High Efficiency LED Chip 4050 Size 2700k 6500k 180w Five Color COB LED Chips Bead
Five-Color Cob Chip 4050 180w Rgbwc Led Chip 21v 24v For Photography Light Rgbwc Led Chip Product Detailed Parameters Model POWER CCT LM/W IF VF WHOLE SIZE EMIT SIZE 4050 SERIES 180W 620nm/460nm/520nm/2700K /6500K 90 W/C:2.8A RGB:1A 21-24V 40X50MM 32MM The latest five-color LED chip uses NCSP technology, which makes the LED chip have high precision, high resolution and good controllability. patent “NCSP” technology, higher power better heat transfer Five-Color Cob Chip FAQ:
RGBCW Five Color COB LED Chip 180W 2700k 6500k 4050 Photography COB chips
Five-Color Cob Chip 4050 180w Rgbwc Led Chip 21v 24v For Photography Light Rgbwc Led Chip Product Detailed Parameters Model POWER CCT LM/W IF VF WHOLE SIZE EMIT SIZE 4050 SERIES 180W 620nm/460nm/520nm/2700K /6500K 90 W/C:2.8A RGB:1A 21-24V 40X50MM 32MM The latest five-color LED chip uses NCSP technology, which makes the LED chip have high precision, high resolution and good controllability. patent “NCSP” technology, higher power better heat transfer Five-Color Cob Chip FAQ:
High Power Bi Color Cob Led Chip 1200W 120100 Photography Light Flip Chip
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm². 5.Double light intersection grid distribution, more uniform light mixing. Appilication: Film and television lights Photographic lights
Bi Color LED Chip High Power 1200W*2 70-100Lm/W Dual CCT 2700K 6500K For Photography Light 120100
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm². 5.Double light intersection grid distribution, more uniform light mixing. Appilication: Film and television lights Photographic lights
Flip Chip COB LED Module 1200w +1200w Full Spectrum High Power LED Chip for Photography light
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm². 5.Double light intersection grid distribution, more uniform light mixing. Appilication: Film and television lights Photographic lights
High Efficiency LED Chip 120100 Size 2700k 6500k 1200w Flip Chip COB LED Lamp Bead For Photography Light
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm². 5.Double light intersection grid distribution, more uniform light mixing. Appilication: Film and television lights Photographic lights
120100 Bi-Color 2700K 6500K CCT High Power 1200W+1200W COB LED Chip Module For Photography Lamp
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm². 5.Double light intersection grid distribution, more uniform light mixing. Appilication: Film and television lights Photographic lights
Ultra Bright 85V CRI 95 Ra 1200W 1200W COB LED Chip for Dual Color Lamp Video Film Lighting
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm². 5.Double light intersection grid distribution, more uniform light mixing. Appilication: Film and television lights Photographic lights
High Power 55mil Led 1200w Epistar Chips For Photography Light
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm². 5.Double light intersection grid distribution, more uniform light mixing. Appilication: Film and television lights Photographic lights
1200W 1200W High Power LED COB With 95 LM/W Full Spectrum Dual Color
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm². 5.Double light intersection grid distribution, more uniform light mixing. Appilication: Film and television lights Photographic lights
VF42-46V 75-85V*2 2700K 6500K LED Chips for High Power LED Encapsulation Series 1200W
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm². 5.Double light intersection grid distribution, more uniform light mixing. Appilication: Film and television lights Photographic lights
High Power COB LED Chip 1200W Bi color 2700k 6500k VF42-46V 75-85V*2 for Photography Light
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm². 5.Double light intersection grid distribution, more uniform light mixing. Appilication: Film and television lights Photographic lights
High Power COB LED Chip 1200W Bi color 2800k 6500k LED COB Chip for Photographic Lamp
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm². 5.Double light intersection grid distribution, more uniform light mixing. Appilication: Film and television lights Photographic lights
Dual Color High Power LED COB 1200W SMD Photography Light LED Chip
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm². 5.Double light intersection grid distribution, more uniform light mixing. Appilication: Film and television lights Photographic lights
350w 200+200w Photography Light LED Chip , CRI96 COB LED CHIP 2700-6500K 4000K for STAGE LIGHTS
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm². 5.Double light intersection grid distribution, more uniform light mixing. Appilication: Film and television lights Photographic lights
300W 300W Technology Bicolor LED COB Chip Tunable Dimmable CRI95 2700K 4000K for Stage Lights Photography
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm². 5.Double light intersection grid distribution, more uniform light mixing. Appilication: Film and television lights Photographic lights
Wholesale Waterproof 75v 85v 2700K/6500K 1200w+1200w Bi Color LED Chips
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm². 5.Double light intersection grid distribution, more uniform light mixing. Appilication: Film and television lights Photographic lights
OEM ODM Wavelength IR LED SMD Near Infrared LED Infrared Emission LED Chip 120100 1200W SMD LED
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm². 5.Double light intersection grid distribution, more uniform light mixing. Appilication: Film and television lights Photographic lights
Customized Photography Light Smd Led Chip 70-100Lm 1200W+1200W 18M-21M
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm². 5.Double light intersection grid distribution, more uniform light mixing. Appilication: Film and television lights Photographic lights