Photography Light LED Chip
3838 SERIES Bi Color LED Chips 50W+50W 200W+200W High Power Chip 2700K 6500K For Photography Light
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm². 5.Double light intersection grid distribution, more uniform light mixing. Appilication: Film and television lights Photographic lights
6060 Bi Color 2700K 6500K CCT High Power 300W + 300W COB LED Chip Module for Photography Lamp
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm². 5.Double light intersection grid distribution, more uniform light mixing. Appilication: Film and television lights Photographic lights
High Power Bi Color 300W 6060 Flip Chip Custom Cob Led Chip For Commerical Led Light Stage Light
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm². 5.Double light intersection grid distribution, more uniform light mixing. Appilication: Film and television lights Photographic lights
Bi Color LED Chip 6060 300W*2 100-120Lm/W Dual CCT 2700K 6500K For Video Light
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm². 5.Double light intersection grid distribution, more uniform light mixing. Appilication: Film and television lights Photographic lights
OEM ODM wavelength BI Color 205V smd led chip Warm white + white 6060 SMD LED chips Emitting
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm². 5.Double light intersection grid distribution, more uniform light mixing. Appilication: Film and television lights Photographic lights
Dual Color COB 6060 Bi Color LED COB Widely Range Color DC 205V 300w+300w LED COB Chip
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm². 5.Double light intersection grid distribution, more uniform light mixing. Appilication: Film and television lights Photographic lights
Bi-color 2700-6500K High CRI Ra>95 LED COB CHIP High Power 150W+150W 200W+200W for Photography light Video Light
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm². 5.Double light intersection grid distribution, more uniform light mixing. Appilication: Film and television lights Photographic lights
Five In One Full Color Cob Led 250W~350W 3538 2700K 6500K RGBCW Led cob chip 24-26V
Photography lights CHIPS 250W 620nm/460nm/520nm/2700K/6500K 140LM/W 24*5A 24-26V With Lighting LED CHIP products Specification: Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm². 5.Double
180W Five Color COB LED Chips RGBCW High Power LED Chip VF 24V EMIT Size 32mm Outlet
Photography lights CHIPS 180W 620nm/460nm/520nm/2700K/6500K 140LM/W 14-20A 35-40V With Outdoor Lighting LED CHIP products Specification: Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm².
3538 250W 350W Five Color COB LED Chips View Angle 120 CCT 620nm/460nm/520nm/2700K /6500K Emit Size 26MM CRI 95
Photography lights CHIPS 250W 620nm/460nm/520nm/2700K/6500K 140LM/W 24*5A 24-26V With Lighting LED CHIP products Specification: Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm². 5.Double
180W Five Color COB LED Chips CCT 620nm/460nm/520nm/2700K /6500K Emit Size 32MM CRI 95
Photography lights CHIPS 180W 620nm/460nm/520nm/2700K/6500K 140LM/W 14-20A 35-40V With Outdoor Lighting LED CHIP products Specification: Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm².
Bi-Color 1919 Chip White + Warm White 1919 Bi-color SMD LED 18w 24w 25w 30w
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm². 5.Double light intersection grid distribution, more uniform light mixing. Appilication: Film and television lights Photographic lights
36-38V 18W 24W 25W 30W Bi Color LED White Warm White Chips for Stage Light VF 36-38V
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm². 5.Double light intersection grid distribution, more uniform light mixing. Appilication: Film and television lights Photographic lights
White + Warm White Bi Color LED Chips With PCB Aluminum Radiators High Power Chip Beads 18w 24w 25w 30w
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm². 5.Double light intersection grid distribution, more uniform light mixing. Appilication: Film and television lights Photographic lights
Full Spectrum Ra90 18W+18W 24W+24W 25W+25W 30W+30W Bi-color Dimmable Led Chip 2800K/6500K Tunable Cob Leds
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm². 5.Double light intersection grid distribution, more uniform light mixing. Appilication: Film and television lights Photographic lights
Double Colors COB LED Chips 1919 18W 25W 30W with CCT 620nm/460nm/520nm and VF 36-38V
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm². 5.Double light intersection grid distribution, more uniform light mixing. Appilication: Film and television lights Photographic lights
Adjustable CCT COB LED 195-205V 2500K 6500K Dual Color LED 300W+300W High CRI LED Chips 6060
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm². 5.Double light intersection grid distribution, more uniform light mixing. Appilication: Film and television lights Photographic lights
High Power 300W 6060 Led Cob Chip Bi Color For Camera Lights Stage Lights
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm². 5.Double light intersection grid distribution, more uniform light mixing. Appilication: Film and television lights Photographic lights
Bi color Cob Led Chip 6060 Dual CCT 2700K 6500K Cob Chip High Power 300W*2 LEDs
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm². 5.Double light intersection grid distribution, more uniform light mixing. Appilication: Film and television lights Photographic lights
High Power 300W COB LED Chip Bicolor Dual CCT 2700K 6500k Warm White White CRI 95
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm². 5.Double light intersection grid distribution, more uniform light mixing. Appilication: Film and television lights Photographic lights