Photography Light LED Chip
Customized COB LED Chip 1200W RGBW Dc 75v 85v High Power COB LED Photography Light
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm². 5.Double light intersection grid distribution, more uniform light mixing. Appilication: Film and television lights Photographic lights
High lumen power red Warm white + positive white 18a-21a 1200w +1200w smd led chip 120*100 COB Chip Photography light
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm². 5.Double light intersection grid distribution, more uniform light mixing. Appilication: Film and television lights Photographic lights
Photography Light LED Chip 200W High Power Smd Led VF42-46V 51-53V 60X60MM Customized
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm². 5.Double light intersection grid distribution, more uniform light mixing. Appilication: Film and television lights Photographic lights
High Power 200W R61 60X60MM 34MM LED COB Chip Bi Color Flip Chip for Stage Light CCT 620nm/460nm
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm². 5.Double light intersection grid distribution, more uniform light mixing. Appilication: Film and television lights Photographic lights
Factory Price 60X60MM Bi Color LED Chips SMD LED Panel Full RGB Color Beads 200W Chip
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm². 5.Double light intersection grid distribution, more uniform light mixing. Appilication: Film and television lights Photographic lights
R61 60X60MM LED Chip White 200W+200W Light Lamp Bead Diode SMD LED chip
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm². 5.Double light intersection grid distribution, more uniform light mixing. Appilication: Film and television lights Photographic lights
AC 51-53V 2700K-6500K full spectrum led chip 200w AC COB LED Chip
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm². 5.Double light intersection grid distribution, more uniform light mixing. Appilication: Film and television lights Photographic lights
high power 200W 6060 led cob chip bi color chip for photography light
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm². 5.Double light intersection grid distribution, more uniform light mixing. Appilication: Film and television lights Photographic lights
Dual Cct Led Chip 3538 3545 3856 4050 7870 R50 High Power Bicolor Cob Led 180W 250W 300W 350W 500W 700W 800W
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm². 5.Double light intersection grid distribution, more uniform light mixing. Appilication: Film and television lights Photographic lights
2700K 6500K Dual Color High Power LED COB 1200W COB LED Photography light
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm². 5.Double light intersection grid distribution, more uniform light mixing. Appilication: Film and television lights Photographic lights
1200W Dual Color High Power LED COB CCT Warm White 2700K White 6500K Photography Light LED Chip
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm². 5.Double light intersection grid distribution, more uniform light mixing. Appilication: Film and television lights Photographic lights
AC 51-53V 2700K-6500K Full Spectrum LED Chip 200w AC COB LED Chip
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm². 5.Double light intersection grid distribution, more uniform light mixing. Appilication: Film and television lights Photographic lights
200W Chip 6060 LED COB Chip for Photography Light VF42-46V 51-53V LM/W 95
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm². 5.Double light intersection grid distribution, more uniform light mixing. Appilication: Film and television lights Photographic lights
3 Years Warranty Commercial Five Color Cob Led Chips Dc 42V 43V 46V 300W 700W
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm². 5.Double light intersection grid distribution, more uniform light mixing. Appilication: Film and television lights Photographic lights
Customized Ceramic Smd Led R50 Chip 2700K 6500K 300W-70W Special Angle 30 60 90 120 Degrees IF 1-4A VF 42-46V
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm². 5.Double light intersection grid distribution, more uniform light mixing. Appilication: Film and television lights Photographic lights
300w 700w High Power High Light R50 COB Five Color LED Source Customizable VF 42-46V LM/W 95
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm². 5.Double light intersection grid distribution, more uniform light mixing. Appilication: Film and television lights Photographic lights
R50 SERIES High Power Five Color COB LED Chip 300W/700W Warm White Red Green Blue RGB UV IR Infrared Grow Flood Light
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm². 5.Double light intersection grid distribution, more uniform light mixing. Appilication: Film and television lights Photographic lights
2700k 6500k Adjustable CCT LED COB 500W 200W High Power Ra95 Ra97 COB LED Chip for Photography Lamp
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm². 5.Double light intersection grid distribution, more uniform light mixing. Appilication: Film and television lights Photographic lights
OEM ODM Wavelength BI Color 72-76V SMD LED Chip Warm White White 3538 200W
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm². 5.Double light intersection grid distribution, more uniform light mixing. Appilication: Film and television lights Photographic lights
3538 250W Five Colors COB LED Chips with 620nm/460nm/520nm/2700K/6500K CCT and 24-26V
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure design, easily achieve power density above 100W/cm². 5.Double light intersection grid distribution, more uniform light mixing. Appilication: Film and television lights Photographic lights