Thermal Camera Core

Uncooled Thermal Camera Core 256×192/12μm for Temperature Measurement Product Overview This compact infrared module integrates a wafer-level packaging 256×192/12μm uncooled infrared detector. With SDK and USB interface, the Mini212G2 uncooled thermal module is designed for easy integration and secondary development. It features a temperature measurement range from -20℃ to +550℃ with accuracy of ±2℃ or ±2%. Main Features Miniature Module with Direct Thermal Imaging Output

256×192/12μm Infrared Camera Module Uncooled for Security Surveillance Product Overview Mini212G2 is a miniature infrared camera module equipped with a wafer-level packaged 256x192/12μm uncooled infrared thermal detector. Professionally developed to meet the varied and ever-growing requirements of emerging markets covering AIoT, Machine Vision, Industrial Vision, security surveillance and night vision observation. Featuring compact size and powerful infrared detection

Uncooled Thermal Camera Core Longwave FPA 384x288 / 17μm VOx Product Overview COIN417G3 infrared camera core integrates 384x288 / 17μm wafer level package (WLP) infrared detector, high performance signal processing circuit and image processing algorithm. Thanks to the wafer level packaging technology, the WLP infrared detector has simpler manufacturing process and easier to be integrated, which is more suitable for high volume and low cost production. The COIN417G3 infrared

Micro Thermal Camera Module Uncooled 256x192 Resolution 12μm Pixel Size Product Overview The Mini212G2 LWIR thermal imaging camera core integrates a 256×192/12μm focal plane array (FPA) uncooled VOx infrared detector with optional thermographic functionality. This compact module features a temperature measurement range from -20℃ to 550℃, making it ideal for industrial temperature measurement applications. Built on SensorMicro's self-developed TIMO212 infrared module, the

Uncooled 256×192/12μm Thermal Camera Core for Temperature Measurement Product Overview The Mini212G2 infrared module features a temperature measurement range from -20℃ to +550℃ with accuracy of ±2℃ or ±2%. Equipped with a wafer-level packaged 256×192/12μm uncooled infrared detector, this micro infrared camera module offers ultra-compact dimensions ideal for space-constrained applications. Engineered to meet the evolving requirements of fast-growing markets including AIoT,

VOx LWIR Fever Screening Thermal Camera Core Uncooled 640x512 8μm Product Overview Equipped with the ApexCore 640*512, 8μm high-performance infrared detector, the iHA608W is engineered exclusively for non-contact biological temperature measurement with a superior thermal accuracy of ±0.5°C. Embedded with medical-grade image processing algorithms, it delivers ultra-clear, refined thermal imagery, accurately mapping the temperature distribution of measured subjects while

VOx Thermal Camera Module Uncooled 640X512/12μm for Outdoor Observation Product Overview The iSE612 thermal camera core is engineered for professional thermal imaging applications, integrating a self-researched ApexCore ceramic packaged detector core that delivers excellent imaging quality and stable operation. With NETD≤20mK rating, it ensures precise temperature detection and clear thermal image presentation. This compact module features an ultra-small physical footprint

LWIR Thermal Camera Module 640x512 / 12μm with Clear Thermal Imaging Uncooled LWIR 640x512/12 μm Infrared Camera Module with Clear Thermal Imaging The iSE612 infrared core stands out with stable imaging capability, economical cost and easy integration performance. Powered by self-developed ApexCore ceramic packaging thermal sensor with 640×512 resolution and 12μm pixel size, it achieves superior thermal detection accuracy and low noise level under NETD≤20mK standard.

15μm 640x512 MCT MWIR Camera Core Cooled Infrared Detector Fast Integration Product Overview The GAVIN GC615HMG infrared camera core integrates a 640*512/15μm HOT MWIR cooled infrared detector with next-generation image processing algorithms. The HOT technology enables high-quality stable imaging while delivering optimized SWaP performance with compact size, lightweight design, and low power consumption. We specialize in the design, manufacture, and marketing of thermal

640*512/15μm HOT MWIR Infrared Camera Module for Fast Integration Product Overview The GAVIN GC615HMG infrared camera core integrates a 640*512/15μm HOT MWIR cooled infrared detector with next-generation image processing algorithms. The HOT technology enables not only high-quality and stable imaging, but also compact size, lightweight design, and low power consumption, delivering optimized SWaP performance for versatile applications. Main Features Mainstream FPA, Clear

Miniature Size 256x192/12μm Thermal Camera Core for AIoT Application Product Overview The Mini212G2 infrared camera module integrates a wafer-level packaging 256x192/12μm uncooled infrared detector, specifically engineered for emerging markets including AIoT (Artificial Intelligence of Things), Machine Vision, Industrial Vision, Security Monitoring, and Night Observation. With its compact design and high-performance infrared detection capabilities, this module serves as a

Elevated Skin Temperature Screening Thermal Camera Module 640x512/8μm Product Overview Meet the iHA608W — your reliable thermal solution for non-contact biological temperature testing. Powered by the ApexCore 640×512/8μm elite infrared detector, this module delivers outstanding temperature accuracy up to ±0.5°C. Tailored medical imaging algorithms provide vivid, high-fidelity thermal visuals, pinpointing subtle temperature variations and ensuring consistent, accurate readings

Ceramic Package Uncooled LWIR Thermal Camera Core 384x288 12μm Ceramic Package Uncooled LWIR 384x288 12 μm Thermal Camera Core The iSE412 thermal camera module utilizes a 384×288/12μm ceramic package infrared detector. Ceramic packaging represents the most advanced packaging technology currently available, enabling significant reductions in detector size, weight, and power consumption. By integrating ceramic packaging infrared detector technology, the iSE412 thermal module

Light Weight 256x192 / 12μm Thermal Camera Core for Consumer Electronics Product Overview The Mini212G2 infrared camera module features a miniature footprint built around a 256x192 / 12μm uncooled infrared detector in wafer-level packaging. Designed to address the evolving needs of emerging industries including AIoT, Machine Vision, Industrial Vision, Security Monitoring, and Night Observation, this compact sensing component overcomes the limitations of classic imaging

Uncooled LWIR Thermal Module 1280x1024 12μm with 14/19/25mm Lens COIN1212 Infrared Camera Core Product Overview Tailored for high-end industrial and scientific thermal imaging applications, the COIN1212 infrared camera core leverages a premium large-format 12μm wafer-level infrared detector with 1280×1024 megapixel resolution to achieve ultra-fine thermal detection and long-range high-definition imaging. Empowered by advanced self-adaptive imaging algorithms, it optimizes

Uncooled Thermal Imaging Module 256x192 / 12μm for Security Camera Product Overview The Mini212G2 uncooled IR imaging module represents an excellent low-cost thermal camera core solution, specifically designed for applications with strict requirements for small size, light weight, and competitive pricing in security and monitoring fields. This module incorporates an exceptionally compact 256x192/12μm wafer level package (WLP) infrared detector that captures long-wave infrared

Uncooled LWIR Infrared Thermal Module 256x192 for Security Thermal Camera Uncooled LWIR 256x192 / 12 μm Infrared Thermal Module for Security Thermal Camera TIMO212 uncooled IR imaging module integrates the 256x192 / 12μm focal plane array wafer level package (WLP) infrared detector and can capture long-wave infrared (LWIR) spectrum that ranges from 8 to 14μm. Oriented for fully optimized SWaP-C, the TIMO212 thermal camera module is specially designed for those customers who

VOx Uncooled Infrared Camera Module 384x288 / 17μm Rapid Development Product Overview COIN417G3 uncooled infrared module integrates 384x288 / 17μm wafer level package (WLP) infrared imaging detector that adopts the market preferred VOx material. Thanks to the wafer level packaging technology, the WLP infrared detector has simpler manufacturing process and easier to be integrated, which is more suitable for high volume and low cost production. The COIN417G3 infrared module

Thermal Camera Module Uncooled LWIR 384×288/12μm for Firefighting and Rescue Product Overview The iSE412 thermal camera core adopts the self-developed 384×288/12µm focal plane array VOx microbolometer uncooled infrared detector. This represents one of our most classic and popular products in our lineup. Equipped with abundant practical functions, it features super-resolution algorithms, picture-in-picture display, adjustable OSD, sleep mode, and electronic zoom. The module is

Uncooled VOx Mini Infrared Thermal Camera Module 256x192/12μm The ultra-compact Mini212G2 infrared camera module adopts a 256×192/12μm uncooled infrared detector with wafer-level packaging. Tailored for booming emerging sectors such as AIoT, Machine Vision, Industrial Vision, Security Monitoring and Night Observation, it perfectly accommodates their diversified and evolving application demands. Boasting a tiny form factor and premium infrared detection performance, it acts as