Thermal Camera Core

384x288 12μm LWIR Thermal Camera Module Uncooled Easy Integration into Security System Product Overview The iSE412 is a high-performance miniaturized infrared camera core independently developed with a 384×288 resolution and 12μm pixel pitch ceramic-packaged thermal detector. Different from traditional shutter-type infrared modules, it adopts a shutterless imaging architecture, which eliminates periodic shutter calibration operations, fundamentally solves the problems of

LWIR 384x288 / 17μm Uncooled Thermal Imaging Camera Core for Industrial Vision Product Description The COIN417G3 infrared camera core integrates a 384×288/17μm wafer-level infrared detector paired with upgraded professional image processing algorithms for instant, smooth thermal image output. With low power consumption and industry-wide standard interface compatibility, this cost-effective thermal module achieves a typical NETD lower than 30mK for highly sensitive thermal

OEM LWIR Thermal Camera core Uncooled 384x288 12μm for Machine Vision Product Overview The iSE412 infrared camera core features a cutting-edge shutterless design based on high-performance 384×288/12μm ceramic-packaged thermal detector, supporting silent, calibration-free and ultra-smooth continuous imaging. It integrates super-resolution optimization, picture-in-picture, power-saving sleep mode and more practical functions, with full compatibility for various lenses, displays

LWIR 384x288 / 12μm Uncooled Thermal Imaging Camera Core Product Overview Based on our self-developed high-performance 384×288/12μm ceramic-packaging thermal detector, the iSE412 infrared camera core eliminates the need for shutter calibration, effectively resolving issues of stuttering and noise during observation. To meet diverse user needs, the iSE412 supports super-resolution algorithms, picture-in-picture, customizable OSD, sleep mode, electronic zoom, and other features

384x288 / 12μm LWIR Thermal Camera Module Uncooled for Observation Product Overview The iSE412 thermal camera core utilizes a 384x288 / 12μm uncooled LWIR infrared detector, delivering exceptional infrared imaging performance adaptable to various observation scenarios. This infrared thermal module captures surrounding thermal distribution and presents vivid thermal imaging graphics, making it an ideal solution for real-time thermal scene monitoring and observation application

High Sensitivity LWIR 384x288/12μm Thermal Camera Core Uncooled NETD 30mk Product Overview The iSE412 infrared camera core is an easy-to-use, high-stability thermal imaging core module built with self-developed ceramic packaging detector technology. It eliminates the need for manual or automatic shutter calibration, effectively preventing image stuttering and noise generation during use, and supports silent operation without mechanical noise. To meet different user usage

VOx Uncooled Thermal Camera Core 640x512 / 12μm Longwave with Various IR Lenses Product Overview COIN612G2 uncooled infrared module integrates 640x512 / 12μm wafer level package (WLP) infrared imaging detector, high performance signal processing circuit and image processing algorithm. Thanks to the wafer level packaging technology, the WLP infrared detector has simpler manufacturing process and easier to be integrated, which is more suitable for high volume and low cost

Uncooled LWIR 640x512 / 12μm Thermal Imaging Module for Firefighting & Rescue Product Overview The COIN612G2 infrared camera core is an ideal ready-to-integrate thermal imaging solution that combines sharp thermal detection, compact size, and budget-friendly pricing. Equipped with a 640×512 12μm ApexCore wafer-level detector and advanced imaging algorithms, it achieves outstanding temperature sensitivity (NETD ≤25mK) to rapidly pinpoint hidden hotspots and deliver crystal

SWaP-C Uncooled LWIR Thermal Imaging Module 640x512 12μm Product Overview The COIN612G2 infrared camera core features a 640×512/12μm ApexCore wafer-level infrared detector with typical NETD ≤25mK, delivering an optimal balance between premium performance and cost-effectiveness. Its compact design, lightweight structure, and low power consumption of just 0.65W make it ideal for various applications. Enhanced image algorithms ensure sharper, clearer thermal imaging output.

Uncooled 640x512/12μm LWIR Thermal Camera Core with 0.65W Low Power Consumption Product Overview Equipped with the high-sensitivity 640×512 12μm ApexCore wafer-scale infrared focal plane array (FPA) featuring typical NETD ≤25 millikelvin, the COIN612G2 infrared imaging core achieves superior performance with optimized cost. It offers full compatibility with widely adopted serial communication interfaces, diverse video signal outputs, and a comprehensive selection of objective

COIN612G2 LWIR Uncooled Thermal Imaging Module 640x512 12μm SWaP-C Uncooled LWIR 640x512 12 μm Thermal Imaging Module For OEM manufacturers and system integrators seeking a ready-to-use thermal imaging building block, the COIN612G2 infrared camera core is a high-profit, low-development-cost solution. This core is equipped with a high-sensitivity 640×512 12μm ApexCore wafer-level infrared detector integrated with mature signal processing circuits and optimized imaging

Clear Imaging Thermal Camera Core 640x512/12μm for Fast Integration Product Overview The COIN612G2 thermal imaging camera core integrates a high-performance, cost-effective ApexCore wafer-level infrared detector with 640×512 resolution and 12μm pixel pitch, delivering a typical NETD of ≤25mK. Compatible with mainstream serial communication standards, this infrared camera core supports abundant video output interfaces and is paired with a full lineup of optical lens options to