Fused Silica Wafer
4'' 6'' Fused Silica Wafer 500μm SiO2 HPFS with Double Side Polishing and 1100°C Heat Resistance
High purity fused silica wafers with 500μm thickness and diameters of 4''/6''. Features double-side polished surfaces (Ra < 1 nm), excellent chemical resistance, and dimensional stability with ultra-low thermal expansion. Ideal for optical applications requiring superior transmission characteristics and thermal performance up to 1100°C.
4 Inch 100mm SiO2 Fused Silica Wafer Corning 7980 - 500μm Thickness DSP Surface
Premium 4-inch fused silica wafers with 100mm diameter and 500μm thickness. Double-side polished with surface roughness Ra < 1 nm. High purity Corning 7980 material with excellent thermal stability (1100°C max temperature) and dielectric properties. Available for immediate shipment with custom fabrication options.
IR Grade Fused Silica Wafer JGS3 C7979 SK1310 200mm Diameter with Less Than 5ppm OH Content
Premium IR grade fused silica wafers with transmission from 185nm to 350nm and very low OH content (
UV Grade Fused Silica Wafer 3'' 4'' 6'' JGS1 JGS2 JGS3 with 76.2-300mm Diameter and <1.0nm Surface Roughness
High-precision UV grade fused silica wafers available in 3", 4", 6" diameters with JGS1, JGS2, JGS3 quartz materials. Features include
Borofloat 33 Wafer 6 Inch 8 Inch Borosilicate Glass Substrate for Optics and Semiconductors
Schott Borofloat 33 wafers offer exceptional optical clarity, thermal stability, and tight flatness. Available in 150mm and 200mm sizes with custom thickness and polish. Ideal for MEMS, sensors, and precision optics. SEMI compliant.
UV Fused Silica Wafer 100mm 500um for MEMS Semiconductor Manufacturing
Precision polished to
High Purity Fused Silica Wafers 2-8 Inch JGS2 for Semiconductor and Photonics Applications
Ultra-pure fused silica wafers with excellent UV to IR transmission, low thermal expansion, and high chemical resistance. Ideal for optics, semiconductors, and microelectronics. Available in 2-8 inch sizes with customizable dimensions and surface finish.
Fused Silica Wafer 2-8 Inch JGS2 High Purity Semiconductor Grade
High-purity fused silica wafers in 2-8 inch sizes. Excellent UV to IR transmission, thermal stability up to 1200°C, and chemical resistance. Ideal for semiconductor and photonic applications. Custom dimensions and polishing available.
High Purity Fused Silica Wafers 2-8 Inch Wafer Grade for Optical and Microelectronic Designs
Our high purity fused silica wafers offer exceptional UV to IR transmission and thermal stability up to 1200°C. Precision polished with customizable dimensions, they ensure optical clarity and durability for demanding photonic and semiconductor applications.
Fused Quartz Wafer 100mm Diameter 1000um Thickness Bow ±40µm for Semiconductor
High-purity fused quartz wafer with TTV
200mm Fused Silica Wafer LTV 2um High Precision DSP SSP for Semiconductor
High-precision fused silica wafer with LTV under 2µm and bow as low as ±20µm. Available in JGS1, JGS2, JGS3 quartz with DSP, SSP, or DSL surfaces. Ideal for semiconductor and MEMS fabrication. ISO certified, customizable thicknesses, and vacuum-sealed packaging.
Customized Polished Fused Silica Glass Wafer Ra 1.0nm for MEMS 50.8mm to 200mm
High-precision fused silica wafer with polished side Ra
Fused Silica Wafer 50.8mm TTV 20µm PLTV 95% JGS1 JGS2 JGS3 for Semiconductor Optics
High-precision fused silica wafer available in JGS1, JGS2, JGS3 types. Features TTV
UV Fused Silica Wafer 50.8mm to 200mm LTV 2um JGS1 JGS2 JGS3 for Semiconductor
High purity fused silica wafer with LTV
Borofloat 33 Glass Substrate Wafer 4 Inch 100mm for Semiconductor MEMS Low Thermal Expansion
Borofloat 33 borosilicate glass wafer offers exceptional optical clarity, low thermal expansion, and high chemical resistance. Ideal for semiconductor, MEMS, and display applications. Available in sizes from 3 to 8 inches with custom surface polish and tight TTV tolerances. SEMI compliant.
Synthetic Quartz JGS2 Optical Windows 2 to 8 Inch Diameter for Scientific Instruments
High purity fused quartz JGS2 offers excellent UV to IR transmission and thermal stability up to 1200°C. Ideal for optics, lasers, and semiconductors. Custom sizes and polished surfaces available. Reliable for demanding industrial applications.
UV Grade Fused Silica Wafer 3 to 6 Inch JGS1 JGS2 JGS3 for Optical Applications
High purity UV fused silica wafers in 3-6 inch sizes. Offer exceptional UV transmission, low thermal expansion, and tight TTV tolerances. Available in JGS1, JGS2, JGS3 grades with custom polishing options for demanding optical systems.
High Purity Fused Silica Wafer 2-12 Inch Ra<1.0nm ISO9001
High purity fused silica wafer for semiconductor, MEMS, and medical industries. Features Ra
Fused Silica Wafer 2-12 Inch 0.1-10mm Thick for Semiconductor MEMS
High purity fused silica wafer with low thermal expansion and excellent thermal shock resistance. Features Ra
Fused Silica Wafer 300mm Diameter 5 Arc Sec Perpendicularity High Purity Substrate
High purity fused silica wafer with low TTV