Fused Silica Wafer
Fused Silica Wafer 2-12 Inch Diameter TTV 5um Glass Substrates JGS1 JGS2 JGS3
High purity fused silica wafers with TTV
High Purity Fused Silica Wafer 2 to 12 Inch Diameter with Primary Flat for Optics
Precision engineered fused silica wafer with excellent parallelism of 3 arc sec and transmission range 0.17-3.5um. High damage threshold >10J/cm2, warp
B270 Glass Wafer Optical Substrates 4 Inch 100mm Diameter High Flatness
High-quality B270 soda-lime glass wafers with excellent surface quality, flatness, and chemical resistance. Available in 3-8 inch sizes with custom thickness and polish options. Ideal for optics, MEMS, and microelectronics.
JGS2 Fused Quartz Wafer 8 Inch Semiconductor Grade High Purity SiO2 Thermal Stability
High-purity JGS2 fused quartz wafer with excellent UV to IR transmission and thermal stability up to 1200°C. Ideal for semiconductor, optics, and laser applications. Custom sizes and double-sided polish available. Resistant to acids and thermal shock.
8 Inch 12 Inch JGS1 Fused Quartz Wafers 200mm 300mm for Optics Lasers Semiconductors
High purity synthetic fused quartz JGS1 wafers with exceptional UV to IR transmission and thermal stability. Ideal for optics, lasers, and semiconductor applications. Available in 8 inch (200mm) and 12 inch (300mm) sizes with custom surface polish options.
Borofloat 33 Glass Wafer 8 Inch 200mm for Electronics Optics Semiconductors
Borofloat 33 borosilicate glass wafer, 8 inch (200mm) diameter, offers excellent thermal and chemical durability. Ideal for MEMS, sensors, and semiconductor substrates. Features low TTV, high transmittance, and customizable surface polish. Compliant with SEMI standards.
Fused Silica Quartz Wafer JGS1 JGS2 JGS3 0.05mm to 10mm Thickness 3 to 12 Inch Diameter
High-purity fused silica wafers in JGS1, JGS2, JGS3 grades. Thickness from 0.05mm to 10mm, diameters up to 12 inches. UV to IR transmittance, low TTV and bow. Single or double side polished, Ra
Fused Silica Quartz Carrier Wafers 200mm 300mm for Semiconductor Wafer Handling
High-purity fused silica and quartz carrier wafers in sizes from 3 to 12 inches. Offer extreme thermal stability, chemical resistance, and tight TTV tolerances down to 8 µm. Ideal for thin wafer handling, bonding, and de-bonding processes. Customizable surface polish and SEMI standard compliance.
Fused Silica Borosilicate Glass Wafers 150mm Diameter 0.35mm Thickness
Precision 150mm glass wafers with 0.35mm thickness in fused silica borosilicate. Tight tolerances, low TTV, and Ra ≤1nm. Ideal for semiconductor, optical, and medical applications. Custom sizes up to 400mm available.