Molybdenum Copper Alloy

MoCu30 heat sink rod offers high thermal conductivity (190-200 W/mK) and low density for aerospace and electronics. Custom sizes available. Ideal for power amplifiers, IGBT modules, and thermal control devices.

Mo80Cu20 alloy sheet combines high thermal conductivity with a low adjustable thermal expansion coefficient. Ideal for aerospace, electronics, and heat sink applications. Available in thicknesses from 0.5 to 20mm with customizable dimensions. Non-magnetic, good vacuum performance, and excellent machinability.

Mo70Cu30 alloy heat sink offers high thermal conductivity (180-200 W/mK) and a low thermal expansion coefficient (8.1 x10-6/K) matching ceramics. Lightweight at 9.8 g/cm3, ideal for aerospace. Custom sizes available with Ni plating. No sintering activators ensure purity.

Cu/MoCu/Cu sandwich structure heat sink material with high thermal conductivity and adjustable thermal expansion. Ideal for RF, microwave, and semiconductor power devices. Non-magnetic, withstands 850°C thermal shock, and can be stamped for cost-effective parts.

This CMC composite material features a molybdenum core with copper cladding, offering high thermal conductivity and an adjustable low expansion coefficient. Ideal for heat sinks, RF, and microwave packaging. Customizable thickness and ratios available for BGA and high-power devices.

MoCu15 molybdenum copper alloy heat sink parts offer high thermal conductivity (160-180 W/M.K) and low thermal expansion (6.8×10-6/K). Ideal for high-power electronics, lasers, and RF devices. Custom machining available. RoHS compliant.

High-performance 50Mo50Cu molybdenum copper alloy plate for heat sinks and electronic packaging. Offers excellent thermal conductivity (230-270 W/mK) and low thermal expansion. Ideal for IGBT modules, power amplifiers, and military thermal control. Custom sizes available with low impurity content.

MoCu25 rod offers excellent thermal conductivity (≥180 W/mK) and low thermal expansion. Made via isostatic pressing and copper infiltration for fine structure. Ideal for high-power microelectronic heat sinks and ceramic sealing. Custom sizes available.