Molybdenum Copper Alloy

MoCu alloy rod combines high strength, thermal conductivity, and arc resistance. Ideal for aerospace, resistance welding, and heat sinks. Custom sizes available with bright surface finish.

MoCu50 alloy plate offers high tensile strength of 200 MPa, melting point 2550°C, and excellent thermal conductivity. ISO9001 certified, corrosion resistant, ideal for heat sinks and aerospace. Custom sizes available, negotiable pricing, fast delivery.

High-performance MoCu30 molybdenum copper alloy sheet with 2mm thickness, offering excellent thermal conductivity (160-280 W/mK) and high melting point. Ideal for electronic heat sinks, aerospace, and semiconductor applications. Custom sizes available with reliable packaging and technical support.

Molybdenum copper alloy with adjustable thermal expansion and high conductivity (160-180 W/MK). Ideal for heat sinks in aerospace and microelectronics. ISO9001 certified, low density, stampable, and customizable for large batches.

PRM CuMoCu alloy heat sink offers 160-290 W/MK thermal conductivity, 6.8-11.8 10-6/K expansion, and up to 200 MPa tensile strength. ISO9001 certified, customizable in grades Mo85Cu15 to Mo40Cu60. Ideal for aerospace, automotive, and electronics.

Molybdenum copper substrates offer excellent thermal conductivity (140-180 W/mK) and high electrical connectivity for power device IGBT applications. Customizable thickness from 0.1 to 3.0mm and sizes. Easy to process and braze, ensuring reliable heat dissipation and durability in aerospace, electronics, and military fields.

Molybdenum copper composite material with high density ≥99%, adjustable Mo content, excellent thermal and electrical conductivity, low thermal expansion, and corrosion resistance. Ideal for high-voltage switches, microelectronic packaging, and instrumentation. Custom sizes available.

Mo60Cu40 heat sink sheet with 1.5mm thickness offers high thermal conductivity (210-250 W/mK) and low thermal expansion (10.3×10⁻⁶/K). Ideal for microelectronic packaging, BGA, QFN, and power amplifiers. Custom sizes and nickel/gold plating available.

High strength and thermal conductivity MoCu base plate with uniform 2-10μm nickel coating. Corrosion resistant, reliable for IGBT semiconductors. Custom sizes available with thickness 0.5-3.2mm and width under 300mm.

High-performance MoCu alloy heat sink with thermal conductivity up to 268 W/mK and customizable thickness from 0.3 to 5 mm. Offers excellent corrosion resistance and uniform thermal expansion for laser, microwave, and high-power electronic applications. Ideal for IGBT, FET, and aerospace components.

This electroplated nickel copper molybdenum composite plate features a sandwich structure with adjustable thermal expansion and high thermal conductivity. Ideal for electronic packaging, it offers excellent high temperature resistance and low processing cost. Custom thickness options available.

Cu/MoCu30/Cu CPC substrate offers high thermal conductivity and a designable thermal expansion coefficient matching BeO and Al2O3 ceramics. Ideal for high-power microelectronic packaging, it ensures durability and efficiency. Custom sizes and shapes available per drawing.

Sandwich-structured Cu/Mo/Cu composite with adjustable thermal expansion and high conductivity. Ideal for electronic packaging. Custom sizes available per drawing. Durable, high-temperature resistant.

CPC sandwich composite with copper outer layers and 70MoCu core. Offers matched thermal expansion coefficient (8.8×10-6 CTE) and high thermal conductivity (380 W/MK) for superior heat dissipation. Ideal for IGBT modules, RF amplifiers, and LED chip packaging. Custom thickness ratios available.

High thermal conductivity (230 W/mK) and low thermal expansion (10.3×10⁻⁶/°C). Ideal for instrumentation components, microelectronic packaging, and heat sinks. Custom sizes available. Reliable for high-power devices.

High thermal conductivity MoCu alloy radiator with tailored expansion coefficient. Ideal for aerospace and electronic heat dissipation. Available in MoCu10-40 grades, semi-finished or plated. Excellent airtightness and low density.

MoCu alloy offers high thermal conductivity (184-197 W/mK) and adjustable thermal expansion (7.0-7.1 x10-6/K). Ideal for heat sinks and electronic packaging. Custom sizes available. Durable, efficient, and RoHS compliant.

Mo75Cu25 molybdenum copper alloy bar, 20mm diameter, offers high thermal conductivity (180-190 W/mK) and low thermal expansion (7.9±2 ppm/K). Ideal for heat sinks and electronic packaging. Custom sizes available. Durable, non-magnetic, and vacuum-compatible.

High-performance molybdenum copper alloy sputtering target with excellent thermal conductivity (160-180 W/M.K) and low thermal expansion. Produced via infiltration method for fine structure and superior arc breaking. Custom grades available from Mo40Cu60 to Mo90Cu10.

Molybdenum copper alloy disc heat sink combines high strength, thermal conductivity, and arc resistance. Ideal for high-power microelectronic devices. Custom sizes available. Made via isostatic pressing and copper infiltration for superior performance.