Electronic PCB Board

PCB IPC-3 Test Standard Circuit Board PCB fabrication factory PCB Customized Designs PCB Reverse Engineering Service Specification Product Name PCB Customized Production PCB Reverse Engineering Service Type Rigid Material FR4, CEM1, CEM3, High Frequency Board, Layer 1,2,4,6...20Layer Shape Retangular, Round, Slots, Cutouts, Complex, Irregular Cutting Shear, V-score, Tab-routed Board Thickness 0.2-4mm, regular 1.6mm Copper Thickness 0.5-4oz, regular 1oz Solder Mask Green, Red,

Our services We mainly offer High-Precision Single-Side, Double-Side, Multi-layer Printed Circuit Boards, LED Aluminium Printed Circuit Board,Customers Components Procurement and PCB Assembly (SMT) Business,PCB Layout. Our Factory Dalian JY Electronic Technology Co., Ltd. was established in 2009, we focus on the manufacturing and development of single-layer, double-layer and multi-layer printed circuit boards.With application in the fields of telecommunications, medical

PCB IPC-3 Test Standard Circuit Board PCB fabrication factory Item Capability 1.Base Material FR-4 / High TG FR-4 /Aluminum /CEM-1/Rogers/Arlon/Taconic/Teflon 2.Layers 1-22 3.Finised inner/outer copper thickness 1-6OZ 4.Finished board thickness 0.2-7.0mm 5.Min hole size Mechanical hole: 0.15mm Laser hole: 0.1mm 6.Controlled Impedance +/-5% 7.Plugging vias capability 0.2-0.8mm 8.Outline profile Rout/ V-cut/ Bridge/ Stamp hole 9.Surface treatment HASL, HASL lead free, Immersion

PCB IPC-3 Test Standard Circuit Board PCB fabrication factory Specification Model Number 2-20L,FR4,1.6MM, HAL-LF,HASL,IMMERSION GOLD Place of Origin China Base Material FR4 Copper Thickness 1OZ Board Thickness 1.6MM Min. Hole Size 0.3MM Min. Line Width 0.15MM Min. Line Spacing 0.15MM Surface Finishing HASL& HAL LEAD FREE,IMMERSION GOLD Solder mask green soldermask,white silscreen,open-short test MOQ 1 PCS About HighLeap Electronic Advantages of HighLeap Electronic Our PCB

PCB IPC-3 Test Standard Circuit Board PCB fabrication factory Product Name Multilayer Printed Circuit Prototype Board PCB Factory Materials FR4/TG150-180/FR4 black core/CEM-3/Aluminum Place of Origin China Brand Name Original Board Thickness Tolerance 5-10% Profile Processing CNC Milling/V-Cut/Mold Flushes Copper Thickness 0.5oz-5oz soldermask green, red, blue, white black,yellow,etc. Flame resistance 94v0 Certification ISO 9001:2000, ISO 14001, ISO/TS16949:2002, UL E203640

PCB IPC-3 Test Standard Circuit Board PCB fabrication factory Project Process Capability Detailed explanation of pcb process layers 1-20 layer PCB circuit board The number of pcb layers refers to the number of layers of the design file. Currently, 1-12 through-hole boards can be produced. Plate type FR-4 rigid board /aluminum substrate FR-4 sheet (A-grade Kingboard material, A-grade Guoguo material)/Aluminum base sheet {Halogen-free circuit board} Ink / The quality of the ink

PCB Manufacturer Fast delivery customized multilayer copper PCB Fabrication circuit boards pcb boards PCB Capability Item Rigid PCB Product Name Multilayer PCB Layers 4 Layers Material FR4 Board Thickness 1.6mm Copper Thickness 1 oz Soldermask Color Green Finishing Treatment HASL About HighLeap Electronic Advantages of HighLeap Electronic Our PCB Equipments Our Certifications FAQ Q1:Are my design files safe when I submit them to you for manufacturing? A: Any customer’s file

High Tg board High frequency Rogers 5880 PCB factory PCB Capability Item Rigid PCB Max Layer 8L Inner Layer Min Space 3mil Out layer Min Space 3mil Inner Layer Max Copper 7oz Out Layer Max Copper 7oz Min Mechanical Drilling 0.15mm Min Laser Driliing 0.12mm PTH Tolerance ±0.071mm NPTH Tolerance ±0.055mm Countersink Tolerace ±0.15mm Board Thickness 0.4-8mm Board Thickness Tolerance ±0.12mm Board Thickness Tolerance ±15% Min Board Size 10.5*10.5mm Max Board Size 22*30 inch

PCB ENIG Black Solder Color IPC-3 Test Standard Circuit Board PCB fabrication factory PCB Capability Item Rigid PCB Max Layer 48L Inner Layer Min Trace/Space 3.3 / 4mil Out layer Min Trace/Space 3.3 / 4mil Inner Layer Max Copper 4 Out Layer Max Copper 4 Min Mechanical Drilling 0.2 mm Min Laser Driliing 0.15 mm Max Aspect Ratio(Mechanical Drilling) 20/1 Max Aspect Ratio(Laser Drilling) 1/1 About HighLeap Electronic Advantages of HighLeap Electronic Our PCB Equipments Our

PCB ENIG Black Solder Color IPC-3 Test Standard Circuit Board PCB fabrication factory PCB Capability Item Rigid PCB Max Layer 42L Inner Layer Min Trace/Space 3.3 / 4mil Out layer Min Trace/Space 3.3/4mil Inner Layer Max Copper 4OZ Out Layer Max Copper 4OZ Min Mechanical Drilling 0.2 mm Min Laser Driliing 0.15 mm Max Aspect Ratio(Mechanical Drilling) 20 : 1 Max Aspect Ratio(Laser Drilling) 1 : 1 About HighLeap Electronic Advantages of HighLeap Electronic Our PCB Equipments Our

PCB ENIG Black Solder Color IPC-3 Test Standard Circuit Board PCB fabrication factory PCB Capability Item Rigid PCB Max Layer 44L Inner Layer Min Trace/Space 3.3/4(mil) Out layer Min Trace/Space 3.3/4(mil) Inner Layer Max Copper 4(oz) Out Layer Max Copper 4(oz) Min Mechanical Drilling 0.2(mm) Min Laser Driliing 0.15(mm) Max Aspect Ratio(Mechanical Drilling) 20: 1 Max Aspect Ratio(Laser Drilling) 1: 1 About HighLeap Electronic Advantages of HighLeap Electronic Our PCB

PCB ENIG Black Solder Color IPC-3 Test Standard Circuit Board PCB fabrication factory PCB Capability Item Rigid PCB Max Layer 46L Inner Layer Min Trace/Space 3.3 / 4 Out layer Min Trace/Space 3.3 / 4 Inner Layer Max Copper 4OZ Out Layer Max Copper 4OZ Min Mechanical Drilling 0.2 mm Min Laser Driliing 0.15 mm Max Aspect Ratio(Mechanical Drilling) 20:1 Max Aspect Ratio(Laser Drilling) 1:1 About HighLeap Electronic Advantages of HighLeap Electronic Our PCB Equipments Our

PCB ENIG Black Solder Color IPC-3 Test Standard Circuit Board PCB fabrication factory PCB Capability Item Rigid PCB Max Layer 45L Inner Layer Min Trace/Space 3.3/4mil Out layer Min Trace/Space 3.3/4mil Inner Layer Max Copper 4oz Out Layer Max Copper 4oz Min Mechanical Drilling 0.2mm Min Laser Driliing 0.15mm Max Aspect Ratio(Mechanical Drilling) 20:1 Max Aspect Ratio(Laser Drilling) 1:1 About HighLeap Electronic Advantages of HighLeap Electronic Our PCB Equipments Our

PCB ENIG Black Solder Color IPC-3 Test Standard Circuit Board PCB fabrication factory PCB Capability Item Rigid PCB Max Layer 45L Inner Layer Min Trace/Space 3.3/4mil Out layer Min Trace/Space 3.3/4mil Inner Layer Max Copper 4oz Out Layer Max Copper 4oz Min Mechanical Drilling 0.2mm Min Laser Driliing 0.15mm Max Aspect Ratio(Mechanical Drilling) 20:1 Max Aspect Ratio(Laser Drilling) 1:1 About HighLeap Electronic Advantages of HighLeap Electronic Our PCB Equipments Our

sample pcb production 1-20Layer FR4 TG130-TG170 black core CEM-3 fast pcb PCB Capability Item Rigid PCB Max Layer 8L Inner Layer Min Trace/Space 3/3mil Out layer Min Trace/Space 3/3mil Inner Layer Max Copper 4oz Out Layer Max Copper oz Press Fit Hole Ttolerance ±0.05mm PTH Tolerance ±0.075mm NPTH Tolerance ±0.05mm Countersink Tolerace ±0.15mm Board Thickness 2.5mm Board Thickness Tolerance(

3.4mm heavy thickness half hole 10-20L HDI printing circuit board PCB Electronic Pcb Board PCB Capability Item Rigid PCB minimum linewidth/linespacing 3MIL/3MIL(0.075mm) minimum hole diameter 6MIL(0.15MM) minimum solder resist opening (single-side) 1.5MIL(0.0375MM) minimum solder resist bridge 3MIL(0.075MM) maximum aspect Ratio (thickness/hole diameter) 10:1 impedance control accuracy +/-8% finished thickness 0.3-3.2MM maximum board size 630MM*620MM minimum board thickness

Shenzhen LM301B SMD LED PCB for plant grow LED PCB manufacturer PCB Capability Item Rigid PCB Max Layer 4L Inner Layer Min Trace/Space 3/3mil Out layer Min Trace/Space 3/3mil Inner Layer Max Copper 2oz Out Layer Max Copper 2oz Min Mechanical Drilling 0.152mm Min Laser Driliing 0.12mm Press Fit Hole Ttolerance ±0.052mm PTH Tolerance ±0.0752mm NPTH Tolerance ±0.052mm Countersink Tolerace ±0.15mm Board Thickness 0.4-8mm Board Thickness Tolerance(