HDI PCB

Item Production capacity Product name FPC/PCB/FPCA/PCBA Prouct types single-layer/double-layer/multi-layer/rigid-flex Layer count 1~22 Surface treatment Immersion gold/OSP/Immersion silver/Immersion tin Hole diameter min 0.05mm Line width min 0.05mm Copper thickness 1/3OZ~6 OZ Product size min 1*1mm Finished board thickness FPC:1.0mm~1.6mm; PCB:0.1mm~3mm PTH diameter tolerance ±0.075mm NPTH diameter tolerance ±0.05mm Solder mask color Green Solder Mask/Black PI/Yellow PI

Multilayer PCB Special Tech Place of Origin: China 1.Impedance 2.Via Filling 3.PFH,Backdrill 4.Mix Finishes 5.Cave 6.Heatsink 7.ENEPIG Brand Name: Highleap Application Segment: Auto,Industrial,Medical,DataCom,Consumer Layer Count: 4~50L Matierial: FR4 (Tg130~Tg170) Board Thickness(mm): 0.6mm~10.0mm Copper Thickness(oz): Hoz~3oz Size(mm): 5mm~1200mm Min. LW/LS(mm): 0.1/0.1 Min. Hole(mm): 0.25 Solder Mask: Green, Yellow, Blue, Black, White... Surface Finish: ENIG,OSP,HASL,Imm

Rigid PCB Manufacturing Capability Item HDI minimum linewidth/linespacing 2MIL/2MIL(0.05MM) minimum hole diameter 6MIL(0.15MM) minimum solder resist opening (single-side) 1.2MIL(0.03MM) minimum solder resist bridge 2.2MIL(0.055MM) maximum aspect Ratio (thickness/hole diameter) 8:1 impedance control accuracy +/-8% finished thickness 0.2-3.2MM maximum board size 620MM*544MM maximum finished copper thickness 2OZ(70UM) minimum board thickness 3MIL(0.076MM) maximum layer 12

Item Specification 1 Numbr of Layer 1-18Layers 2 Material FR-4,FR2.Taconic,Rogers, CEM-1 CEM-3,ceramic , crockery Metal-backed Laminate 3 Surface Finish HASL(LF), Gold plating, Electroless nickel immersion gold, Immersion Tin, OSP(Entek) 4 Finish Board Thickness 0.2mm-6.00 mm(8mil-126mil) 5 Copper Thickness 1/2 oz min;12 oz max 6 Solder Mask Green/Black/White/Red/Blue/Yellow 7 Min.Trace Width & Line Spacing 0.075mm/0.1mm(3mil/4mil) 8 Min.Hole Diameter for CNC Driling 0.1mm

Item(pcb) Capability (pcb) Base Material FR-4 / High TG FR-4 / Halogen Free material/Rogers/Arlon/Taconic/Teflon Layers 1-22 copper thickness 1-6OZ Finished board thickness 0.2-7.0mm Min hole size Mechanical hole: 0.15mm Laser hole: 0.1mm Controlled Impedance +/-5% Surface treatment HASL, HASL lead free, Immersion Gold, Immersion Tin, Immersion Silver, Hard gold, Flash gold, OSP… solder mask green/blue/black/white/red/pink/orange/yellow Plugging vias capability 0.2-0.8mm

Charger PCB Custom Electronics Printed Circuit Board Manufacture pcb design and development service Name OEM/ODM PCB&PCBA Material FR4/CEM-3/custom Service One-stop Service Type Electronic Board Certificate ISO/RoHS/TS16949 Testing Service Fly Probe Testing (free),E-test Mask ink color green/black/white/red/blue/yellow Surface Finishing HASL, HAL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold Min. Line Width 0.075um(3mil) Min. Hole Size 0.10mm Board Thickness 7mm Copper

Hybrid plate RO4350B+RO4450F+RO4350 PCB Customized Gereber Designs PCB Engineering Service Material CEM-1/3, FR4, Ceramic, Aluminum, PI, PET, Rogers Layers 1-32 layers Final PCB Thickness 0.2mm-6.0mm(8mil-126mil) Finish copper thickness 0.5-12oz Min.Hole Size 0.1mm (4mil) Min Line width 0.1mm (4mil) Surface Finishes HASL – Leaded Solder Tin/Nickel HASL – Lead Free Solder Electroless Soft Gold Wire Bondable Soft Gold Nickel Flash Gold Electroless Nickel Immersion Gold/ Silver/

Custom Make FR4 FR1 CEM1 CEM3 Electronic Circuit Board Manufacturer OEM ROHS 94v0 PCB Item Capability Layers 1~22layers Base Material FR4 Aluminum Rogers CEM-3 Thicker Copper 1-6OZ Min.hole size Mechanical hole: 0.15 mm Laser hole: 0.1 mm Controlled Impedance +/-5% Plugging vias capability 0.5-2.4mm Surface treatment HASL/HASL lead free/Immersion Gold/Immersion Tin/Immersion Silver/Hard Gold/OSP About HighLeap Electronic Advantages of HighLeap Electronic Our PCB Equipments

high frequency board(ROGERS) Multilayer Printed Circuit Prototype Board PCB Factory Service Layers 1-40 Layers Material FR4,CEM1,CEM3,High TG,94v0 etc Board type Rigid, Board shape Rectangular,round,slots,cutouts etc Board Thickness 0.2~5.0mm Copper weight 0.5 oZ~5 oZ Board cutting Shear,V-score,tab-routed Silk screen Single double-sided green LPI etc Design file format Gerber,Eagle, CAM350 Bom format Excel,PDF About HighLeap Electronic Advantages of HighLeap Electronic Our

Smart board PCB Bare Printed Circuit Board High-Q Special Shape multilayer pcb PCB Item Manufacture Capacity Layer Counts 1--20L Base Material FR4,High-TG FR4,CEM3,aluminum,High Frequency(Rogers,Taconic,Aron,PTFE,F4B) Material Thickness(mm) 0.40, 0.60, 0.80, 1.00, 1.20, 1.50, 1.60, 2.0, 2.4, 3.2 Max board size(mm) 1200x400mm Board Outline Tolerance ±0.15mm Board Thickness 0.4mm--3.2mm Thickness Tolerance ±8% Minimum line/space 0.1mm Min Annular Ring 0.1mm SMD Pitch 0.3mm

China Shenzhen factory professional oem manufacturing transparent pcb Name PCB Material FR4,H-TG,Rogers,Ceramics,Aluminium,custom Service One stop Type PCB Board Certificate ISO;RoHS;TS16949 Testing Service Fly Probe Testing (free),E-test Mask ink color black/white/red/blue/yellow/green/ Surface Finishing HASL, HAL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold Min. Line Width 0.075um(3mil) Min. Hole Size 0.10mm Board Thickness 6mm Copper Thickness 10 Oz... Layers custom

Multilayer HDI Pcb Manufacturer Fr4 Multilayer Pcb 94v0 Printed Circuit Board Item Capability Layers 1~16layers Base Material FR4,Aluminum,Rogers,Taconic,Argon,HI-TG,CEM-1,Nalco,Isola and so on Thicker Copper 0.5-6OZ Min.hole size Mechanical hole: 0.15mm Laser hole: 0.1mm Controlled Impedance +/-5% Plugging vias capability 0.2-7mm Surface treatment HASL,HASL lead free,Immersion Gold,Immersion Tin,Immersion Silver,Hard Gold,OSP... About HighLeap Electronic Advantages of