High Layer PCB
High Layer HDI PCB 2+N+2 S1000-2M 40 Layer 3mil Line Width Space
Advanced HDI PCB with 2+N+2 structure, supporting up to 40 layers and 3mil line width/space. Features 8oz outer copper, laser drilling, and special processes like buried vias and rigid-flex. Ideal for high-density industrial applications.
High Layer PCB 3mil Min Line Width Spacing 0.2mm to 6.0mm Board Thickness for Communications
High layer PCB with 3mil line width/spacing and impedance control for complex circuits. Supports 6-50+ layers, fast 3-5 day lead time, and RoHS compliance. Ideal for communications, medical, and aerospace applications. Custom options available.
High Layer PCB White Solder Mask 0.15mm Min Silkscreen Clearance 6-20 Layers
High layer PCB with white solder mask and 0.15mm min silkscreen clearance. Supports 6-20 layers, copper thickness 1/3-2 Oz, and surface finishes like HASL, ENIG, OSP. RoHS compliant, ideal for telecom, medical, aerospace, and industrial control systems. Customizable options available.
High Layer Impedance Control PCB Board 0.15mm Silkscreen Clearance 32 Layers
High layer PCB up to 32 layers with impedance control for high-speed signals. Features 0.15mm silkscreen clearance, 3mil line/space, and copper thickness from 1/3 to 2 Oz. Ideal for telecom, aerospace, and medical applications. Custom options available.
High Layer Multilayer PCB 0.1mm Solder Mask Clearance 0.2mm Hole Size RoHS
High layer PCB with FR-4 material, 0.1mm min solder mask clearance, and 0.2mm hole size for precision. Supports up to 30 layers, copper thickness 1/3-2 oz, and multiple surface finishes. RoHS compliant, ideal for aerospace, medical, and telecom applications.
High Layer Multilayer PCB 0.2mm-6.0mm Board Thickness 3mil Line Width Spacing
Our High Layer Multilayer PCB supports up to 30 layers with copper thickness from 1/3 Oz to 2 Oz. Features 3mil line width/spacing, impedance control, and RoHS compliance. Ideal for high-speed computing, aerospace, and medical devices. Customizable with various surface finishes and solder mask colors.
High Layer PCB FR4 3mil Line Width Spacing Yellow Solder Mask 0.2mm to 6.0mm Thickness
High layer PCB with min. line width/spacing of 3mil/3mil, available in yellow solder mask. Features impedance control, RoHS compliance, and customizable thickness from 0.2mm to 6.0mm. Ideal for high-density interconnect applications in advanced electronics.
High Layer PCB FR-4 1/3 Oz to 2 Oz Copper 3mil/3mil Line Width Spacing 8-40 Layers
High layer PCB with FR-4 material, copper thickness from 1/3 Oz to 2 Oz, and min line width/spacing of 3mil/3mil. Supports 8-40 layers, fast 3-5 day lead time, and RoHS compliance. Ideal for telecom, medical, and aerospace applications.
High Density Interconnect High Layer PCB 0.1mm Min Solder Mask Clearance 3mil Line Width
High layer PCB with 0.1mm min solder mask clearance for complex circuits. Supports 3mil line width/spacing, impedance control, and multiple surface finishes. Ideal for consumer electronics, medical devices, and industrial equipment. Custom options available with 3-5 day lead time.
FR-4 High Layer Multilayer PCB 0.2mm Hole Immersion Silver Surface Finish
High density interconnect board for complex designs. Features 1/3-2oz copper, impedance control, and 0.2mm min hole size. RoHS compliant with customizable surface finish and silkscreen colors. Ideal for aerospace, telecom, and medical applications.
Rogers High Layer PCB Any Layer HDI PCB Min Hole Size 0.2mm FR-4 3mil Line Width
High layer multilayer PCB with 0.2mm min hole size and 3mil line width/spacing. Supports HASL, ENIG, OSP finishes. Copper thickness from 1/3 to 2 oz. RoHS compliant. Customizable layer count and colors. Ideal for high-density applications in telecom, medical, and automotive.
FR-4 High Layer PCB 1/3 Oz to 2 Oz Copper Thickness 0.2mm to 6.0mm Board
High layer PCB with FR-4 material, copper thickness from 1/3 Oz to 2 Oz, and board thickness 0.2mm to 6.0mm. Features impedance control, 3mil line width/spacing, and multiple surface finishes. RoHS compliant, customizable, and ideal for complex electronics.
High Layer PCB with Impedance Control FR-4 0.2mm to 6.0mm HASL ENIG Surface Finish
High layer PCB with impedance control, FR-4 material, and multiple surface finishes including HASL and ENIG. Supports board thickness from 0.2mm to 6.0mm, 3mil line width/spacing, and RoHS compliance. Ideal for high-density, high-reliability applications with 3-5 day lead time.
Red Solder Mask High Layer PCB OSP Multilayer 4-20 Layers Impedance Control 0.2mm-6.0mm Board
High layer PCB with 4-20 layers, impedance control, and copper thickness from 1/3 oz to 2 oz. Features red solder mask, OSP finish, and 0.1mm min clearance. RoHS compliant, ideal for telecom, medical, and aerospace applications. Custom options available.
High Layer PCB FR-4 HASL Surface Finish 0.2mm Min Hole Size Printed Circuit Board
High layer PCB with FR-4 material and HASL surface finish. Features 0.2mm min hole size, 3mil line width/spacing, and copper thickness from 1/3 Oz to 2 Oz. Ideal for high-speed signal transmission and complex designs. RoHS compliant. Custom options available.
High Layer PCB 6-40 Layers FR-4 0.2-6.0mm Board OSP Immersion Silver 3mil Line Width
High layer PCB with 6-40 layers, 0.2-6.0mm thickness, and 1/3-2 Oz copper. Features impedance control, 3mil line width/spacing, and OSP/Immersion Silver finish. RoHS compliant, 3-5 day lead time, and customizable silkscreen colors for demanding electronics.
High Layer PCB Immersion Tin 0.2mm Min Hole Size 6-12 Layer FR-4
High layer PCB with 0.2mm min hole size and 3mil line width/spacing. Offers immersion tin finish, impedance control, and RoHS compliance. Ideal for high-frequency, compact designs in telecom, aerospace, and medical industries.
High Layer Multilayer PCB 0.2mm Thickness FR-4 Immersion Tin Surface Finish
Premium high layer PCB with 0.2mm to 6.0mm board thickness and 3mil line width/space. RoHS compliant FR-4 material offers superior durability and precision. Customizable solder mask and silkscreen colors. Ideal for advanced electronics, telecom, and military applications.
36 Layer 2 Level HDI Multilayer Metal Core PCB Semiconductor Test Board
High-density 36-layer PCB with 2-level HDI and metal core for semiconductor testing. Supports up to 40 layers, 3/3mil line width/space, and 8OZ copper. Features buried blind vias, rigid-flex, and custom options. Ideal for advanced test applications.