Semiconductor PCB
Semiconductor PCB Assembly Turnkey Service 12 Layer Gold Plating 0.2mm Min Hole
High-quality 12-layer semiconductor PCB with Rogers 4003C and FR-4. Features blind microvias, gold plating, and 0.2mm min hole size. Includes function and 100% testing. Lead time: 2 weeks. Ideal for OEM electronics.
Green Solder Mask Semiconductor PCB Rogers 4003c Gold Plating 0.1mm Trace Width
High-performance semiconductor PCB with green solder mask and gold plating. Features Rogers 4003c material for low-loss high-frequency applications. Min trace width 0.1mm. Ideal for OEM electronics. Turnkey assembly service available. Lead time 2 weeks.
TS16949 Semiconductor PCB 0.2mm Drilling Size FR-4 12 Layer Turnkey Assembly
High-quality FR-4 Semiconductor PCB with 0.2mm min drilling size and ENIG surface finish. Features blind microvias, 12-layer design, and 100% function test. Ideal for OEM electronics. Custom options available with 2-week lead time.
Turnkey Assembly Semiconductor PCB Rogers 4003c 14 Layer 0.2mm Min Hole for OEM Electronics
High-speed semiconductor PCB with Rogers 4003c material and ENIG finish. Features 14-layer design, 0.2mm min hole size, and blind microvias for compact OEM electronics. 100% function tested, lead time 1 week.
Semiconductor PCB FR-4 Gold Plating 0.2mm Drilling Size OEM Electronics
High-quality FR-4 semiconductor PCB with gold plating and 0.2mm min drilling size. Features blind microvias and Rogers 4003c for precision. 100% function tested, 2-week lead time. Ideal for OEM electronics.
Gold Plating Semiconductor PCB Rogers 4003c with Blind Microvias 0.1mm Trace
High-precision semiconductor PCB with Rogers 4003c material and blind microvias for complex circuits. Features 0.1mm trace width, gold plating, and 2-week lead time. Ideal for high-performance OEM electronics.
18 Layer FR4 Semiconductor PCB Rogers 4003C ENIG 0.2mm Min Drilling
High-performance 18-layer semiconductor PCB using Rogers 4003C and FR4. Features ENIG surface finish, blind microvias, and 0.2mm min drilling. Ideal for OEM electronics with 2-week lead time and turnkey assembly service.
Semiconductor PCB 36 Layer Turnkey Assembly Green Solder Mask 0.2mm Hole
High-precision 36-layer PCB for OEM electronics. Features blind microvias, 0.2mm min hole size, and gold plating. 100% function tested. FR-4 material with high TG. Customizable for semiconductor applications.
12 Layer FR-4 Semiconductor PCB Gold Plating 0.2mm Min Hole Blind Microvias
High-precision 12-layer FR-4 PCB for semiconductor applications. Features gold plating, 0.2mm min hole size, and blind microvias for compact designs. 100% function tested with 2-week lead time. Ideal for OEM electronics.
Semiconductor PCB FR-4 16 Layer Gold Plating Function Test 0.2mm Min Hole Size
High-quality Semiconductor PCB made from FR-4 with 16 layers and gold plating. Features function test, 100% test, and blind microvias. Cost-effective with no impedance control, 0.2mm min hole size, and 2-week lead time. Ideal for OEM electronics.
12-Layer Blind Microvias Semiconductor PCB FR-4 Green Solder Mask 0.2mm Min Hole
High-reliability FR-4 semiconductor PCB with 12 layers, blind microvias, and 0.2mm min hole size. Gold plating ensures excellent conductivity. Ideal for OEM electronics. Supports turnkey assembly and 100% functional testing.
Semiconductor PCB FR-4 ENIG Surface Finish 14 Layer Turnkey Assembly
High-reliability 14-layer FR-4 PCB with ENIG finish and 0.2mm min hole size. Features blind microvias, 100% function test, and 2-week lead time. Ideal for OEM semiconductor applications. Custom turnkey assembly available.
38 Layer Semiconductor PCB FR-4 High TG Gold Plating 0.2mm Min Hole Size
High-performance 38-layer semiconductor PCB with FR-4 High TG material and gold plating. Features 0.2mm min hole size, 0.1mm trace width, and turnkey assembly service. Ideal for OEM electronics requiring precision and reliability.
Semiconductor PCB FR4 High TG 12 Layer Turnkey Assembly Blind Microvias ENIG
High-performance semiconductor PCB with FR4 High TG material, 12 layers, and blind microvias for compact designs. Features ENIG surface finish, 0.1mm trace width, and 100% function testing. Ideal for OEM electronics requiring fast 1-week lead time and turnkey assembly service.
Semiconductor PCB FR-4 ENIG Min 0.0078" Drilling Size 18-Layer Blind Microvias
High-performance semiconductor PCB with FR-4 material, ENIG surface finish, and 0.2mm min drilling. Features blind microvias for compact designs, 100% function test, and 2-week lead time. Ideal for OEM electronics.
Semiconductor PCB 12 Layer ENIG Surface Finish Turnkey Assembly OEM Electronics
High-efficiency semiconductor PCB with 12 layers and ENIG surface finish. Features 0.2mm min hole size, 0.1mm trace width, and Rogers 4003c for high-frequency applications. Turnkey assembly, 100% tested, 2-week lead time.
14 Layer ENIG Semiconductor PCB Turnkey Assembly Rogers 4003c 0.2mm Min Hole
High-performance 14-layer semiconductor PCB with Rogers 4003c material and ENIG surface finish. Features blind microvias, 0.2mm min hole size, and 0.1mm trace width. Ideal for OEM electronics. Turnkey assembly service available. 2-week lead time.
Turnkey Assembly PCB Service for Semiconductor PCB FR4 High TG 38 Layer Gold Plating
This turnkey assembly PCB service delivers a 38-layer semiconductor PCB using FR4 High TG material with gold plating. Features include a minimum drilling size of 0.2mm, green solder mask, and a 2-week lead time. Ideal for OEM electronics, it offers precision, durability, and customization for demanding semiconductor applications.
OEM 36-Layer Semiconductor PCB FR-4 Turnkey Assembly 0.2mm Min Hole Size
High-density 36-layer semiconductor PCB with FR-4 material and gold plating. Features 0.2mm min drilling, 100% function test, and 2-week lead time. Ideal for OEM electronics requiring precision and reliability. Custom turnkey assembly available.
High Tg Semiconductor PCB HDI 4+N+4 Printed Circuit Board 6 Layer
Advanced HDI PCB with 4+N+4 structure, supporting up to 40 layers and 2-7 HDI levels. Features 3/3mil line/space, 8OZ copper, and buried blind vias. Ideal for semiconductor applications with high Tg materials and custom options.