Reflow Furnace

I. Equipment Name and Model: SLF3005-0504 Hot Air Reflow Furnace II. Technical Specifications and Basic Configuration: The equipment is mainly used for reflow soldering of surface-mounted components, chips, and similar products. The specific details are as follows: 2.1 Rated Temperature: 300°C; Maximum Temperature: 350°C 2.2 Effective Height: 50mm 2.3 Belt Width: 300mm 2.4 Belt Material: SUS304 2.5 Maximum Load: 25Kg/m² (excluding the weight of the belt itself) 2.6 Transmissi

I. Equipment Name and Model: SLF5605-0504 Hot Air Reflow Soldering Furnace II. Technical Specifications and Basic Configuration: The equipment is mainly used for reflow soldering of surface-mounted components, chips, and similar products. The specific details are as follows: 2.1 Rated Temperature: 300°C; Maximum Temperature: 350°C 2.2 Effective Height: 50mm 2.3 Belt Width: 560mm 2.4 Belt Material: SUS304 2.5 Maximum Load: 20kg/m² (excluding the weight of the belt) 2.6

Application Fields Circulating hot air heating is used for reflow soldering in the micro-assembly processes of mounted components, modules, chips, and power devices. Main Features - Utilizes circulating hot air heating in air or protective atmosphere, ensuring thorough heating, high efficiency, and compliance with current high-density SMT soldering requirements. - Uniform furnace temperature, sufficient binder removal, and convenient and reliable operation. Optional Systems -