Debinding And Sintering Furnace

Integrated drying and firing mesh belt furnace with ±1-2°C uniformity for tight TCR and resistance tolerances. Ensures complete binder removal, precision sintering, and high-volume production for reliable thick film chip resistors.

Integrated debinding and sintering furnace for thick-film heating tubes. Ensures hermetic dielectric layers, stable resistance, and superior adhesion. Features precise temperature control, high-volume production, and optional PC control. ISO certified, 1-year warranty.

Integrated drying, debinding, and sintering in one continuous system for high-volume EV thick-film heater production. Ensures superior adhesion, uniform temperature, and automotive-grade reliability. Customizable for multi-layer printing. ISO certified, 1-year warranty.

Integrated debinding and sintering furnace for thick-film circuits, LTCC, and electronic pastes. Features ±2°C temperature uniformity, precise atmosphere control, and energy-saving ceramic chamber. Customizable cooling rates and optional PC control. Ideal for clean room environments.

Rated to 400°C with ±3°C uniformity, this compact furnace features a 12-grid airflow chamber for precise debinding of LTCC and MLCC components. Durable stainless steel heaters and customizable airflow ensure consistent, high-efficiency results.

Designed for sintering electronic ceramics and magnetic materials. Features 20kW max power, 1300°C nominal temp, ±5°C uniformity, SiC rod heating, and PID control. Includes over-temp alarm and low surface temp ≤40°C. Custom options available.