Shenzhen Hanast New Material co.,LTD
                                                                                                           
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HN-5508ab

Others
2025-06-12
Epoxy Resin Glue Epoxy Resin Glue
Discover the HN-5508AB, a 25kg thermally conductive potting epoxy resin glue compound designed for electronic components. This two-component epoxy offers low viscosity, extended work time, and excellent fluidity, ensuring complete potting. Ideal for insulation, environmental protection, and harsh environments.