Thermally Conductive Potting Compound

3.0 W/mK Thermally Conductive Silicone Potting Compound for Power Electronics Encapsulation The HN-8830A/B is a high-performance, two-component addition-cure silicone potting compound engineered for demanding power electronics applications. With an industry-leading 3.0 W/m·K thermal conductivity , it efficiently dissipates heat from IGBT modules, power semiconductors, BMS circuits, and PCB assemblies, ensuring long-term reliability under extreme thermal cycling conditions.

3.0 W/M·K Thermal Conductivity Compound For Electronics Two Components Silicone Electronic Control Modules Sensor Product Overview for Thermally Conductive Potting Compound: RTV 2 Addition potting compound HN-8830A/B is a two-component addition type organic silicone with low viscosity and 1:1 mixed ratio, excellent thermal conductivity and good fluidity, which can be cured at room temperature or by heating, and meanwhile be cured in a wide temperature range (It maintains

Thermal Conductive Silicone For Electronics High Thermal Conductivity 2.0w/M·K Silicone Potting Compound Potting Factory Direct Supply Product Overview for Thermally Conductive Potting Compound: HN-8820 is a two-component, addition-cure silicone potting gel offering high thermal conductivity (2.0 W/m·K) and superior electrical insulation. With a 1:1 mix ratio and easy processing, it provides reliable protection for electronics operating in harsh environments from -40°C to 150

HN-8820 Potting Gel | 1:1 Mix Ratio | High Thermal Conductivity | UL94 V-0 Product Overview for Thermally Conductive Potting Compound: HN-8820 is a user-friendly, two-part silicone gel with 2.0 W/m·K thermal conductivity and V-0 flame resistance. Ideal for protecting electronics from heat, moisture, and mechanical stress. Why Choose HN-8820 for Thermally Conductive Potting Compound? Fast curing options available Excellent fluidity for complex shapes High insulation and

HN-8820 Potting Gel | 1:1 Mix Ratio | High Thermal Conductivity | UL94 V-0 Product Overview for Thermally Conductive Potting Compound: HN-8820 is a thermally conductive silicone encapsulant that safeguards sensitive electronics against overheating and environmental damage. It is simple to use and highly reliable. Performance Highlights for Thermally Conductive Potting Compound Thermal conductivity: 2.0 W/m·K V-0 self-extinguishing Good adhesion to most substrates Resists

Two-Part Potting Compound | HN-8820 | Thermal Conductivity 2.0 W/m·K | Easy Cure Product Overview for Thermally Conductive Potting Compound: HN-8820 two-part silicone potting compound delivers 2.0 W/m·K thermal conductivity and robust environmental protection. Its 1:1 ratio and room-temperature cure simplify manufacturing. Performance Highlights for Thermally Conductive Potting Compound Easy 1:1 mix by weight or volume Non-corrosive and safe to use Stable over a wide

HN-8820 RTV Potting Gel | V-0 Rated | Wide Temp Range -40°C to 150°C Product Overview for Thermally Conductive Potting Compound: HN-8820 RTV potting gel offers V-0 flame retardancy and reliable performance from -40°C to 150°C. It ensures long-term durability for demanding applications. Performance Highlights for Thermally Conductive Potting Compound •Superior flame resistance •Wide operating temperature •Low viscosity for easy filling •High dielectric strength Technical

Thermal Potting Compound 2.0 W/m·K | HN-8820 | For Power Modules & Transformers Product Overview for Thermally Conductive Potting Compound: This thermally conductive potting compound (2.0 W/m·K) is designed for high-power modules and transformers, providing electrical isolation and heat dissipation in one material. Performance Highlights for Thermally Conductive Potting Compound •Effective heat transfer •Electrical insulation •Easy 1:1 mixing •Long-term stability Technical

Low Viscosity Potting Gel HN-8820 | 1:1 Mix | 2.0 W/m·K | Moisture Resistant Product Overview for Thermally Conductive Potting Compound: HN-8820 low-viscosity potting gel ensures deep penetration and complete encapsulation. With 2.0 W/m·K thermal conductivity, it protects components from heat and humidity. Performance Highlights for Thermally Conductive Potting Compound •Low viscosity for intricate geometries •1:1 mix ratio •Moisture and humidity resistance •Fast heat

HN-8820 A/B Silicone Potting | High Insulation | 2.0 W/m·K | Fast Curing Product Overview for Thermally Conductive Potting Compound: HN-8820 A/B silicone potting system offers high insulation and 2.0 W/m·K thermal conductivity. It cures quickly with heat, speeding up your production cycle. Performance Highlights for Thermally Conductive Potting Compound •Fast heat cure option •Excellent dielectric properties •Good thermal stability •User-friendly 1:1 ratio Technical

Ultra-High Thermal Conductivity Silicone Potting Compound (4.0 W/m·K) This two-component, addition-cure (platinum-catalysed) silicone potting compound delivers an ultra-high thermal conductivity of 4.0±0.1 W/m·K , purpose-built for high-power electronic components with demanding heat dissipation and temperature resistance requirements. It is especially suited to photovoltaic and energy storage power equipment. Key Features Ultra-high thermal conductivity: 4.0±0.1 W/m·K for

3.0 W/m·K High Thermal Conductivity Silicone Potting Compound Manufacturer | RTV-2 Addition-Cure Encapsulation Gel (HN-8830A/B) Product Overview: Shenzhen Hanast New Materials Co., Ltd. is a professional China-based chemical manufacturer specializing in HN-8830A/B, a premium two-component, addition-cure (platinum-catalyzed) 3.0 W/m·K high thermal conductivity silicone potting compound. Designed for high-power electronics requiring rapid heat dissipation and electrical

China Thermally Conductive Silicone Potting Compound 3.0W/mK for EV Automotive Electronics Manufactured in Guangdong, China, this high thermal conductivity silicone potting compound delivers 3.0 W/m·K heat dissipation for electric-vehicle and automotive electronics. As a direct factory manufacturer and supplier , we support wholesale and bulk orders with stable supply and competitive pricing. The two-component 1:1 mix ratio system cures at room temperature or with heat to

LED Driver & Outdoor Lighting Thermal Silicone Potting Compound Manufacturer | 3.0 W/m·K High Heat Dissipation (HN-8830) Product Overview: Shenzhen Hanast New Materials Co., Ltd. is an ISO 9001 certified China chemical manufacturer producing HN-8830A/B, a high-performance 3.0 W/m·K high thermal conductivity silicone potting compound engineered for outdoor LED driver power supplies, street light modules, architectural fixtures, and high-bay lighting controls. Featuring a 1:1

EV Battery & Automotive Electronics Silicone Potting Compound Manufacturer | 3.0 W/m·K High Thermal Conductivity (HN-8830) Product Overview: Shenzhen Hanast New Materials Co., Ltd. manufactures HN-8830A/B , an ISO 9001 certified 3.0 W/m·K high thermal conductivity silicone potting compound specifically formulated for Electric Vehicle (EV) battery modules, BMS units, automotive ignition systems, and DC-DC converters. Featuring a 1:1 mix ratio by weight and low mixed viscosity

UL Certified Thermally Conductive Potting Compound 2.0W/mK for Power Module Encapsulation This UL certified, two-component thermally conductive silicone potting compound provides 2.0 W/m·K heat dissipation and reliable electrical insulation for power modules, EV electronics and industrial equipment. Supplied with full SGS test reports, MSDS and TDS documentation , it supports qualification and compliance review by procurement and engineering teams. The 1:1 mix ratio cures

Thermally Conductive Potting Compound 2.0W/m·K UL94 V-0 Waterproof Silicone for EV Onboard Charger DC-DC Converter Waterproof Potting Compound HN-8820 AB for EV Onboard Charger & DC-DC Converter Protection HN-8820 AB is a waterproof and anti-aging two-component silicone potting compound with 2.0 W/m·K thermal conductivity and UL 94 V-0 flame retardant certification . Purpose-engineered for EV onboard charger (OBC), DC-DC converter, and high-power electronic module encapsulati

Thermally Conductive Potting Compound 3.0W/mK UL94 V-0 Silicone for Automotive ECU Electronic Control Module 3.0 W/mK Potting Compound HN-8830A/B for Automotive ECU & Electronic Control Modules HN-8830A/B is a two-component 1:1 addition-cure thermally conductive silicone potting compound delivering 3.0 W/m·K thermal conductivity for automotive ECU and electronic control modules . It combines UL94 V-0 flame retardancy , excellent electrical insulation and a wide -40℃ to 200℃

Thermally Conductive Silicone Encapsulant 2.0W/mK UL94 V-0 Fast Heat Cure Potting Gel for Motor Drive BMS RF Module Protection Fast Heat Cure Potting Gel HN-8820 AB for Motor Drive, BMS & RF Modules HN-8820 AB is a two-component 1:1 thermally conductive silicone encapsulant engineered for motor drive controllers, battery management systems (BMS) and RF modules . With 2.0 W/m·K thermal conductivity , UL94 V-0 flame retardancy and an optional fast heat cure of 10-20 minutes at

Industrial Controller & Micro Inverter Silicone Potting Compound Manufacturer | 3.0 W/m·K Thermal Addition Silicone (HN-8830) Product Overview: Shenzhen Hanast New Materials Co., Ltd. manufactures HN-8830A/B, a premium addition-cure (platinum-catalyzed) 3.0 W/m·K high thermal conductivity silicone potting compound developed for industrial PLC controllers, frequency converters, micro inverters, and heavy-duty power circuit boards. Featuring a 1:1 mix ratio by weight, a density