Cemedine Adhesive

Cemedine Cement Sensitization And Hardening 8008L Black Adhesive 8008XL Universal Electronic Adhesive (Basic Properties)​ Cemedine SUPER X No.8008L BLACK is a fast-curing elastic adhesive in paste form. Designed for industrial applications, it offers high bonding strength, excellent elasticity, and environmental resistance across diverse substrates. Property Value (SUPER X No.8008L BLACK) Appearance Black paste Viscosity (Pa·s/23°C) 22 Specific gravity (g/cm³) 1.25 Tack-free

Cemedine 3000RS High-Performance Structural Adhesive for Industrial Bonding Product Properties Property Specification Brand Cemedine Model 3000RS Type Two-part epoxy adhesive Viscosity Approx. 120,000 mPa·s Pot Life 30 minutes Curing Time 24 hours at room temperature Shear Strength 25 MPa Service Temp -40°C to 120°C Color Translucent (after mixing) Density Approx. 1.15 g/cm³ Product Introduction The Cemedine 3000RS is a two-part epoxy structural adhesive engineered for high

Cemedine G-485 Rapid-Fuse Adhesive For Portable Battery Cases & Mobile Devices Core Product Attributes Cemedine G-485 is a specialized fusion adhesive engineered for polycarbonate (PC) and PC/ABS hybrid materials. It features rapid curing (5-10 sec), 100℃ heat resistance, -20℃ cold endurance, and EU environmental compliance, specifically developed for precision electronics assembly. Product Introduction As a fusion solution for portable battery cases and mobile phones, G-485

Cemedine CA-186 Industrial Adhesive for High-Strength Metal Bonding Product Properties Parameter ​ ​Value ​ Product Name Cemedine CA-186 Type Industrial Structural Adhesive Base Material Modified Acrylic Resin Curing Method Anaerobic (Airless Conditions) Tensile Strength ≥25 MPa Operating Temperature -40°C to +150°C Viscosity Medium-High (Thixotropic) Packaging 50ml / 200ml Cartridge Product Introduction Cemedine CA-186 is a high-performance structural adhesive designed for

(Basic Properties)​ Cemedine 777 Clear is a one-component, moisture-curing polyurethane elastic adhesive that rapidly hardens without mixing or heating. Its translucent pale yellow appearance suits aesthetically sensitive applications. It complies with JAIAF 4VOC environmental standards and is free from 14 substances restricted by Japan's Ministry of Health, Labour and Welfare. (Core Features)​ Rapid Moisture Curing​ ​ Achieves initial cure in ​ ​3 minutes​ ​ at 23°C/50%RH

Cemedine SX-720 Electronic W/B/WH Sealant for Encapsulation & Bonding Product Properties Parameter Value ​Viscosity ​ 100 Poise ​Hardness (Shore A)​ ​ 40 ​Tensile Strength ​ 2.0 N/mm² ​Temp. Range ​ -40°C to +120°C ​Curing Time ​ Initial: 5–10 min; Full: 24h ​Dielectric Strength ​ 15 kV/mm ​Flame Rating ​ UL94 V-0 (Smoke Density ≤15) ​Packaging ​ 200g Cartridge / 330ML Tube Product Introduction Cemedine SX-720 (available in Black/720B and White/720W) is a single-component,

Cemedine Super X No8008 Black/White Structural Adhesive for Multi-Substrate Bonding Product Properties Parameter Value Test Standard Appearance White paste Visual Viscosity (23°C) 85 Pa·s BH-type viscometer SVI (-) 2.3 20 rpm/2 rpm ratio Density 1.27 g/cm³ JIS K6833 Deep-section curability 1.90 mm/day 24h @23°C/50% RH ​Film Properties​ Elongation 200% Tensile test Tensile strength 2.5 MPa Tensile test Hardness (Shore A) 43 Shore A durometer Product Introduction Cemedine Super

CEMEDINE 1500 Epoxy Resin Adhesive High-performance two-component epoxy resin adhesive for sealing and bonding electronic and electrical components with excellent chemical resistance and room temperature curing. Product Overview CEMEDINE 1500 is a solvent-free, two-component epoxy resin adhesive that cures at room temperature without requiring heating equipment. Featuring a light yellow main agent and transparent hardener, this adhesive offers superior heat resistance,

Cemedine Super X 8008LL High-Performance Elastic Adhesive for Multi-Material Bonding Core Product Attributes ​​Cemedine Super X 8008LL​​ is a single-component, moisture-curing elastic adhesive designed for industrial applications. It features ​​rapid curing​​ (10–30 minutes initial set), ​​solvent-free formulation​​, and ​​exceptional elasticity​​ (Shore A 60). Compatible with metals, plastics, rubber, ceramics, and wood, it operates across ​​-60°C to +120°C​​ and complies

Cemedine Y-358AB Acrylic Adhesive for Electrical and Mechanical Bonding Product Properties Parameter Value Product Model Cemedine Y-358AB Type Two-component Acrylic Adhesive Appearance (20°C) A: Blue, B: Orange-red Viscosity at 20°C (cP) A: 4000 ± 500, B: 4000 ± 500 Specific Gravity at 20°C A: 1.00 ± 0.05, B: 1.04 ± 0.05 Main Component Acrylic Resin (both A and B) pH Value A: 4.2 ± 0.2, B: 3.5 ± 0.2 Flash Point (Mixed) 10°C Ignition Point (Mixed) 421°C Glass Transition Temp

Basic Product Properties Cemedine 8008B (Black) and 8008W (White) are one-component moisture-curing polyurethane structural adhesives designed for high-strength and weather-resistant bonding. Both feature high solid content (>94%), excellent deep-section curing capability, and broad substrate compatibility. 8008W exhibits lower viscosity at elevated temperatures, while 8008B offers superior electrical insulation properties. Product Introduction This series utilizes modified

Cemedine CA-149 High-Strength Epoxy Adhesive for Electronic Equipment and Precision Machinery Bonding Product Description Cemedine CA-149 is a two-component, high-strength epoxy resin adhesive. It consists of a main agent (Component A) and a hardener (Component B) that are mixed prior to use. This product is designed to provide durable bonds for various industrial applications. Product Introduction Cemedine CA-149, when cured, forms a tough and resilient bond layer with

Product Properties Property Value Type One-Part Heat Curing Epoxy Adhesive Base Resin Epoxy resin Appearance Light brown Viscosity (23 °C) 100 Pa*s Density 1.16 g/cm³ Standard Curing Conditions 110℃*60min or 120℃*30min Tensile Shear Strength 16.8 MPa T-Peel Strength 1.18 N/mm Hardness (Shore D) 85 Glass Transition Temperature (Tg) 140℃ Volume Resistivity 2.6*10¹⁵ Ω*cm Dielectric Constant (100Hz) 4.5 Dielectric Loss Tangent (100Hz) 0.011 Storage Temperature 0~10℃ Capacity 1kg

Product Properties Property Value / Description Chemical Resistance Highly resistant to chemicals, solvent, water Application Type 1-Part Material Form Liquid Substrates Ceramics, Metals Industry Applications Construction machinery, wheels, motorcycles, car brake linings, car clutch facings Chemistry Solvent based, Phenol, Modifier - Epoxy Cure Method Pressure sensitive, Solvent, Heat, Room temperature Cure Temperature (°C) 20 to 25 (Room temperature), 60, 180 Cure Time (min)

Product Properties Property Value Type Second-Generation Acrylic Adhesive (SGA) Composition Two-Part (A/B) Acrylic Resin Appearance (A) Pale Yellow Appearance (B) Grey Viscosity (23°C) 5,500 mPa*s (A/B) Mixing Ratio 1:1 (A:B) Workable Time (23°C) 3 minutes Set Time (23°C) 6 minutes Tensile Shear Strength 26.0 MPa T-Peel Strength 3.7 N/mm Hardness (Shore D) 72 Glass Transition Temp. 90°C Elastic Modulus 935 MPa Break Strength 19.0 MPa Elongation at Break 6% Packaging 50g

Product Properties Parameter Value Product Name Cemedine G-100GT Appearance White emulsion Cured Color White (after curing) Viscosity 600 cP (at 30°C) Solid Content 33% Package 1 kg Certifications Halogen-free, RoHS, REACH Product Introduction Cemedine G-100GT is a single-component, room-temperature rapid-curing adhesive engineered for precision electronic components. Its white emulsion texture allows for easy application monitoring, forming a high-strength white bond after

Cemedine EP138 Multi-Purpose Industrial Epoxy Adhesive Product Properties Property Value Type One-Part Heat Curing Base Epoxy resin Appearance Light yellowish brown Viscosity (23°C) 240 Pa·s Density 1.4 g/cm³ Standard Curing 120℃ × 30min Tensile Shear Strength 25.6 MPa T-Peel Strength 3.06 N/mm Product Introduction Cemedine EP138 is a one-component, heat-curing epoxy adhesive designed for simplicity and reliability in industrial applications. As a high-viscosity, non-sag type

(Cemedine LN-2250 Product Introduction)​ (Basic Properties)​ Cemedine LN-2250 is a high-performance adhesive designed for bonding electronic parts (battery cases) and PC/ABS materials. It features rapid curing, non-flammability (UL94V-0 certified), and compliance with ROHS, REACH, PFOS&PFOA environmental standards, making it ideal for precision electronics manufacturing. (Product Description)​ Based on thermoplastic resin technology, LN-2250 offers excellent flowability and

Cemedine EP001K Elastic Bonding Adhesive for Dissimilar Materials & Vibration Environments Product Properties Property ​ ​Base Resin ​ ​Hardener ​ ​Cured Properties ​ ​Type ​ Two-part epoxy adhesive (Room-temp cure) - - ​Base Material ​ Epoxy resin Silyl terminated polyether - ​Appearance ​ Milky white Light yellow - ​Non-volatiles (wt%)​ ​ 99 97 - ​Viscosity (Pa·s/23°C)​ ​ 14 18 - ​Density (g/cm³)​ ​ 1.15 1.00 - ​Mixing Ratio ​ - - 1 : 1 (Base : Hardener) ​Pot Life (23°C)​ ​

Cemedine PP-7F Polypropylene Bonding Adhesive for Industrial Assembly Product Properties Property Value Range Unit Note ​Tensile Strength ​ 2.72 - 3.67 N/mm² (e.g., C50A50: 2.72, C60A40: 3.67) ​Shear Strength​ 1.14 - 2.70 N/mm² (e.g., C10A90: 1.14, C40A60: 2.67) ​Peel Strength ​ 1.07 - 2.25 N/mm² (e.g., C100: 1.07-1.44, C100: 2.22-2.25) Product Introduction Cemedine PP-7F is a two-part cyanoacrylate (instant adhesive) specifically formulated for bonding difficult-to-bond