Metal Based PCBS

The aluminum-based PCB is the most widely adopted metal core printed circuit board, combining effective thermal management with cost-efficient manufacturing. Featuring an aluminum base layer bonded to a thermally conductive dielectric and copper circuit layer, this board delivers reliable heat dissipation for a broad range of applications including consumer LED lighting, power supplies, and automotive electronics. The aluminum base provides excellent thermal spreading while

The copper-based PCB is a premium metal core printed circuit board featuring a solid copper base layer that delivers exceptional thermal conductivity (up to 400 W/m·K) for the most demanding high-power electronic applications. The copper base efficiently transfers heat away from power components, extending device lifespan and maintaining stable operation under continuous high-load conditions. Available in single-sided and double-sided configurations with dielectric layers

This high-performance aluminum-based PCB features an advanced thermally conductive dielectric layer achieving 3.0 W/m·K thermal conductivity, delivering superior heat dissipation for automotive electronic lighting and demanding power applications. The enhanced thermal performance bridges the gap between standard aluminum PCBs and copper-based solutions, providing effective heat management at a more accessible price point. Available in single-sided and double-sided configurati

This high-power metal core PCB combines an aluminum base with heavy copper circuitry (up to 4oz) to deliver exceptional thermal management and current-carrying capacity for demanding industrial power electronics. The unique construction integrates thermal vias and heat sink attachment features within the circuit design, enabling direct component-to-base thermal paths that maximize heat transfer from power components. Ideal for high-power motor drives, industrial inverters,

High Thermal Conductivity Aluminum-Based PCB This high thermal conductivity aluminum-based PCB (Metal Core PCB / MCPCB) features an advanced thermally conductive dielectric layer achieving 3.0 W/m·K thermal conductivity – ten times that of standard FR-4 material (0.3 W/m·K). The exceptional heat transfer capability efficiently removes heat from power components, significantly lowering junction temperatures and extending device lifespan under continuous high-load operation.