RT/duroid 6202PR Copper Clad Laminate: Engineered for Embedded Resistor and Precision RF Applications

RT/duroid® 6202PR is a specialized high-frequency laminate designed to integrate seamlessly with embedded resistor foil technology, providing a unified, high-performance substrate for complex RF and microwave circuits. This material combines the proven electrical stability of the RT/duroid 6000 series with a formulation optimized for precision resistive layers, enabling the fabrication of integrated passive components directly within the circuit board structure. This integration is ideal for miniaturized designs requiring enhanced reliability, reduced parasitic effects, and simplified assembly.

A defining feature of the 6202PR is its compatibility with specific resistive foil values, with initial design values of 25, 50, and 100 ohms per square. This allows designers to embed resistors with predictable performance directly into the multilayer build-up, eliminating the need for discrete surface-mount resistors and improving circuit density and high-frequency response. The laminate itself maintains a stable and low dielectric constant (approximately 2.90-2.98 depending on thickness) and a controlled dissipation factor, ensuring the surrounding transmission line environment supports consistent signal integrity.

Beyond its electrical-resistive synergy, RT/duroid 6202PR delivers excellent mechanical and thermal properties critical for reliable multilayer constructions. It offers very good dimensional stability (0.07 mm/m), a balanced CTE that matches well with copper, and high thermal conductivity for effective heat dissipation. These characteristics ensure reliable plated through-holes and stable registration during thermal cycling, making it suitable for demanding aerospace, defense, and telecommunications applications.

Data Sheet

Standard Specifications of RT/duroid® 6202PR Laminate:

Electrical Properties (@ 10 GHz, 23°C):

• 0.005" thickness: 2.90 ±0.04
• 0.010" thickness: 2.98 ±0.04
• 0.020" thickness: 2.90 ±0.04
• Dissipation Factor (Df): 0.0020
• Thermal Coefficient of Dk: +13 ppm/°C (0-100°C)
• Volume Resistivity: 10¹⁰ MΩ·cm
• Surface Resistivity: 10⁹ MΩ

Embedded Resistor Compatibility (Initial Design Values):

Available nominal resistor values: 25, 50, and 100 ohms/square.

Thermal & Physical Properties:​

• Coefficient of Thermal Expansion (CTE): X & Y-axis: 15 ppm/°C, Z-axis: 30 ppm/°C
• Decomposition Temperature (Td): 500°C
• Thermal Conductivity: 0.68 W/(m·K)
• Moisture Absorption: 0.1%
• Density: 2.1 g/cm³

Mechanical Properties:

• Dimensional Stability: 0.07 mm/m (X, Y)
• Tensile Modulus (X, Y): 1007 MPa (146 kpsi)
• Compressive Modulus (Z): 1035 MPa (150 kpsi)
• Flammability: UL 94 V-0
• Lead-Free Process Compatible: Yes

Standard Claddings:

Electrodeposited Copper Foil: ½ oz (18 µm) and 1 oz (35 µm).

Rolled Copper Foil: ½ oz (18 µm) and 1 oz (35 µm).

Specialty Option: Available with integrated resistive foil cladding.

RT/duroid 6202PR is ideally suited for advanced applications such as integrated attenuators, terminations, impedance matching networks, and other circuits where embedded resistors are advantageous. By providing a cohesive material system that addresses both dielectric and resistive needs, it simplifies design, improves performance, and enhances the reliability of high-frequency multilayer assemblies in mission-critical systems.