M6 High Speed PCB R-5775 Low Loss Multilayer Circuit Board
M6 High Speed PCB R-5775 Low Loss Multilayer Circuit Board
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Brief Introduction
This type of 4-layer circuit board is built on Megtron6 (M6) R-5775G high speed low loss material. Outer layer with 1oz copper weight and black solder mask printed on both top and bottom side.Pads are plated with electroless nickel and immersion gold (ENIG). Every 50 boards are vaccum packed for shipment.
PCB Specifications
| PCB SIZE | 95 x 96mm=1up |
| BOARD TYPE | Multilayer PCB |
| Number of Layers | 4 layers |
| Surface Mount Components | YES |
| Through Hole Components | YES |
| LAYER STACKUP | copper ------- 17um(0.5 oz)+plate TOP layer |
| Prepreg | |
| copper ------- 18um(0.5 oz) | |
| R-5775G 0.25mm | |
| copper ------- 18um(0.5 oz) | |
| Prepreg | |
| copper ------- 17um(0.5 oz)+plate BOT layer | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 4 mil / 4 mil |
| Minimum / Maximum Holes: | 0.3 mm / 6.0 mm |
| Number of Different Holes: | 2 |
| Number of Drill Holes: | 6 |
| Number of Milled Slots: | 1 |
| Number of Internal Cutouts: | no |
| Impedance Control: | no |
| Number of Gold finger: | 0 |
| BOARD MATERIAL | |
| Glass Epoxy: | R-5775G |
| Final foil external: | 1.0 oz |
| Final foil internal: | 0.5 oz |
| Final height of PCB: | 0.8 mm ±0.1 |
| PLATING AND COATING | |
| Surface Finish | Immersion gold, 22% |
| Solder Mask Apply To: | Top Layer and Bottom layer |
| Solder Mask Color: | Black |
| Solder Mask Type: | Kuangshun |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | Top Layer |
| Colour of Component Legend | White |
| Manufacturer Name or Logo: | N/A |
| VIA | Plated through hole(PTH), minimum size 0.3mm. |
| FLAMIBILITY RATING | 94V-0 |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" |
| Board plating: | 0.0029" |
| Drill tolerance: | 0.002" |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
Manufacturing Process of Multi-layer PTH PCB (via filled)
(1). Material Shearing
(2). Inner Layer Dry Film
(3). Inner Layer Etching
(4). AOI 1
(5). Black Oxidation
(6). Milling Outline Frame
(7). Inner Layer Drilling
(8). PTH 1
(9). Inner Layer Dry Film
(10). Pattern Plating 1
(11). Via filled
(12). Outer Layer Drilling
(13). PTH 2
(14). Pattern Plating 2
(15). Outer Layer Dry Film
(16). Copper-tin Electro-Plating
(17). Peeling and Etching
(18). AOI 2
(19). Solder Mask
(20). Silkscreen Printing
(21). Surface Finishing
(22). Electrical Testing
(23). Prolie Contouring
(24). FQC
(25). Packaging
(26). Delivery
Main Applications:
Antenna (Automotive millimeter wave radar, Base station)
ICT infrastructure equipment
Measuring instrument
Super computer
CAPABILITY
2500-3000 types each month.
SERVICE AREA
North America, Oceania, Southeast Asia, Eastern Europe, Africa, Latin America, Western & Southern Europe, Northern Europe, Central & South Asian, Middle East.
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.