Shenzhen Bicheng Electronics Technology Co., Ltd
                                                                                                           
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23 Years
Since 2003
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Machinery Electronics Production Machinery

Laser Stencil For SMT Solder Paste Process 0.1mm thick stainless steel shim

Price Negotiable
Price: USD69~110
MOQ: 1
Delivery Time: 2-3 working days
Brand: Bicheng Enterprise Limited
Product Description

Product profile

 

 

1.1 General description


This is a type of solder paste SMT stencil (100% laser cut) built on 0.1mm stainless

steel foil with aluminum frame 520 mm x 420 mm x 20mm dimension. It’s fabricated

per IPC 7525A using supplied Gerber data, squeegee area locating in the center.

Fiducal marks are through holes to suit for the SMT machine. It’s packed with KK

carton (hard card) and usually 2 stencils are packed for shipment.

 

 

1.2 Features and benifits


A. The data file is used directly to produce and reduce the error rate;
B. The opening position accuracy of SMT template is very high: the whole process

      error is ≤ ±4 μ m;
C. The opening of SMT template has geometric figure, which is advantageous to

      the printing and forming of tin paste;
D. Engineering design prevents problems from occurring in pre production;
E. Comprehensive equipment management and maintenance and process control;
F.  Diversified shipping method;
G. Professional and experienced engineers;
H. Competitive price;
I.   Eligible products rate of first production: >99.99%
J.  More than 9000 types per month;

 

 

1.3 Application


SMD package such as PLCC,QFP,0402,0201,BGA,Flip Chip.

 

 

1.4 Parameter and data sheet

Dimension: 370mm x 470mm, 420mm x 520mm, 550mm x 650mm
Structure Stencil foils with aluminum frame
Base material Stainless steel shim
Foil Thickness

0.05mm, 0.06mm, 0.08mm, 0.1mm, 0.12mm, 0.15mm,

0.18mm, 0.2mm

Aperture configured Laser cut
Appearance Engraving and electro polishing
Fiducial mark Through hole
Service area: Worldwide
Quantity of open pads: 1235
Advantages:

a) High precision dimension; b) Good shape on the window;

c) Hole wall is smoother.

Application: CSP, BGA, 0.5mm QFP etc. package

 

 

1.5 Opening Hole Design for Stencil

Component

Type

Pitch Soldering Width Soldering Length Opening Width Opening Length Shim Thickness
PLCC 1.27mm 0.65mm 2.00mm 0.60mm 1.95mm 0.15-0.25mm
QFP 0.635mm 0.35mm 1.50mm 0.32mm 1.45mm 0.15-0.18mm
QFP 0.50mm 0.254-0.33mm 1.25mm 0.22-0.25mm 1.20mm 0.12-0.15mm
QFP 0.40mm 0.25mm 1.25mm 0.20mm 1.20mm 0.10-0.12mm
QFP 0.30mm 0.20mm 1.00mm 0.15mm 0.95mm 0.07-0.12mm
0402   0.50mm 0.65mm 0.45mm 0.60mm 0.12-0.15mm
0201   0.25mm 0.40mm 0.23mm 0.35mm 0.07-0.12mm
BGA 1.27mm 0.80mm   0.75mm 0.75mm 0.15-0.20mm
BGA 1.00mm 0.38mm   0.35mm 0.35mm 0.10-0.12mm
BGA 0.50mm 0.30mm   0.28mm 0.28mm 0.07-0.12mm
Flip Chip 0.25mm 0.12mm 0.12mm 0.12mm 0.12mm 0.08-0.10mm
Flip Chip 0.20mm 0.10mm 0.10mm 0.10mm 0.10mm 0.05-0.10mm

 

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Shenzhen Bicheng Electronics Technology Co., Ltd
Location 6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Contact Person Sally Mao

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