Rogers RT/duroid 6035 High Frequency PCB Built on 10mil Core With Immersion Gold for Filters
Rogers RT/duroid 6035 High Frequency PCB Built on 10mil Core With Immersion Gold for Filters
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
RT/duroid 6035HTC high frequency circuit materials of Rogers Corporation are ceramic filled PTFE composites for use in high power RF and microwave applications. With a thermal conductivity of almost 2.4 times the standard RT/duroid 6000 products, and
copper foil (electrodeposited and reverse treat) with excellent long term thermal stability, RT/duroid 6035HTC laminates are an exceptional choice for high power applications.
Features/Benefits:
1. High Thermal conductivity
Improved dielectric heat dissipation enables lower operating temperatures for high power applications
- Low loss tangent
Excellent high frequency performance
- Thermally stable low profile and reverse treat copper foil
Lower insertion loss and excellent thermal stability of traces
- Advanced filler system
Improved drill ability and extended tool life compared to alumina containing circuit materials
Some Typical Applications:
1. High Power RF and Microwave Amplifiers
- Power amplifiers, Couplers, Filters
- Combiners, Power Dividers
PCB Capability (RT/duroid 6035HTC)
| PCB Material: | Ceramic-filled PTFE composites |
| Designation: | RT/duroid 6035HTC |
| Dielectric constant: | 3.50±0.05 |
| Layer count: | Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| PCB thickness: | 10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, OSP etc.. |
Data Sheet of RT/duroid 6035HTC
| Property | RT/duorid 6035HTC | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.50±0.05 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
| Dielectric Constant,εDesign | 3.6 | Z | 8 GHz - 40 GHz | Differential Phase Length Method | |
| Dissipation Factor | 0.0013 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | -66 | Z | ppm/℃ | -50 ℃to 150℃ | mod IPC-TM-650, 2.5.5.5 |
| Volume Resistivity | 108 | MΩ.cm | A | IPC-TM-650, 2.5.17.1 | |
| Surface Resistivity | 108 | MΩ | A | IPC-TM-650, 2.5.17.1 | |
| Dimensional Stability | -0.11 -0.08 | CMD MD | mm/m (mils/inch) | 0.030" 1oz EDC foil Thickness after etch '+E4/105 | IPC-TM-650 2.4.39A |
| Tensile Modulus | 329 244 | MD CMD | kpsi | 40 hrs @23℃/50RH | ASTM D638 |
| Moisure Absorption | 0.06 | % | D24/23 | IPC-TM-650 2.6.2.1 ASTM D570 | |
| Coefficient of Thermal Expansion (-50 ℃to 288 ℃) | 19 19 39 | X Y Z | ppm/℃ | 23℃ / 50% RH | IPC-TM-650 2.4.41 |
| Thermal Conductivity | 1.44 | W/m/k | 80℃ | ASTM C518 | |
| Density | 2.2 | gm/cm3 | 23℃ | ASTM D792 | |
| Copper Peel Stength | 7.9 | pli | 20 sec. @288 ℃ | IPC-TM-650 2.4.8 | |
| Flammability | V-0 | UL 94 | |||
| Lead-Free Process Compatible | Yes |
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