Rogers 6010 PCB DK10.2 Substrate 50mil With Immersion Gold for Satellite Communications Systems
Rogers 6010 PCB DK10.2 Substrate 50mil With Immersion Gold for Satellite Communications Systems
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Rogers RT/duroid 6010LM microwave laminates are high-performance ceramic-filled PTFE (polytetrafluoroethylene) composites specifically designed for electronic and microwave circuit applications that require a high dielectric constant. These laminates offer several advantages in terms of electrical and mechanical properties, making them suitable for a wide range of applications.
PCB Capability (RT/duroid 6010)
| PCB Material: | Ceramic-PTFE composite |
| Designator: | RT/duroid 6010LM |
| Dielectric constant: | 10.2 ±0.25 (process) |
| 10.7 (design) | |
| Layer count: | 1 Layer, 2 Layer |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| PCB thickness: | 10mil (0.254mm), 25mil (0.635mm) |
| 50mil (1.27mm), 75mil (1.90mm) | |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, Immersion tin, Immersion Silver, OSP. |
Key Features:
1.High Dielectric Constant: The RT/duroid 6010LM laminate is available with a dielectric constant (Dk) value of 10.2 at 10 GHz. This high Dk value makes it suitable for miniaturizing electronic components and enhancing the performance of microwave circuits.
2.Low Loss Tangent: The laminates exhibit a low loss tangent, ensuring minimal signal loss and maintaining the integrity of high-frequency signals.
3.Thermal Stability: RT/duroid 6010LM laminates offer excellent thermal stability, with a low coefficient of thermal expansion (CTE) that matches copper. This ensures a stable electrical performance even under varying temperature conditions.
4.Dimensional Stability: These laminates provide excellent dimensional stability, enabling precise alignment of multi-layer circuits and reducing the risk of warping or distortion.
5.Ease of Fabrication: RT/duroid 6010LM laminates can be easily machined, drilled, and plated, making them compatible with standard PCB fabrication processes.
| Features and Benefits |
| 1. High dielectric constant for circuit size reduction |
| 2. Low loss. Ideal for operating at X-bank or below |
| 3. Low moisture absorption reducing effects of moisture on electrical loss |
| 4. Low Z-axis expansion providing reliable PTH in multilayer boards |
| 4. Tight DK and thickness control for repeatable circuit performance |
Applications:
Rogers RT/duroid 6010LM laminates are widely used in various electronic and microwave circuit applications, including:
- Patch antennas for wireless communication systems
- Power amplifiers and filters for telecommunications
- Radar systems and microwave sensors
- Phased array antennas
- Microwave components for aerospace and defense industries
Overall, Rogers RT/duroid 6010LM microwave laminates provide an excellent material choice for applications requiring a high dielectric constant, low loss tangent, and superior thermal and dimensional stability.
Appendix1: Properties of RT/duroid 6010LM laminates.
| RT/duroid 6010 Typical Value | |||||
| Property | RT/duroid 6010 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 10.2±0.25 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped stripline | |
| Dielectric Constant,εDesign | 10.7 | Z | 8GHz to 40 GHz | Differential Phase Length Method | |
| Dissipation Factor,tanδ | 0.0023 | Z | 10 GHz/A | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | -425 | Z | ppm/℃ | -50℃-170℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 5 x 105 | Mohm.cm | A | IPC 2.5.17.1 | |
| Surface Resistivity | 5 x 106 | Mohm | A | IPC 2.5.17.1 | |
| Tensile Properties | ASTM D638 (0.1/min. strain rate) | ||||
| Young's Modulus | 931(135) 559(81) | X Y | MPa(kpsi) | A | |
| Ultimate Stress | 17(2.4) 13(1.9) | X Y | MPa(kpsi) | A | |
| Ultimate Strain | 9 to 15 7 to 14 | X Y | % | A | |
| Compressive Properties | ASTM D695 (0.05/min. strain rate) | ||||
| Young's Modulus | 2144 (311) | Z | MPa(kpsi) | A | |
| Ultimate Stress | 47(6.9) | Z | MPa(kpsi) | A | |
| Ultimate Strain | 25 | Z | % | ||
| Flexural Modulus | 4364 (633) 3751 (544) | X | MPa(kpsi) | A | ASTM D790 |
| Ultimate Stress | 36 (5.2) 32 (4.4) | X Y | MPa(kpsi) | A | |
| Deformation under load | 0.26 1.3 | Z Z | % | 24hr/50℃/7MPa 24hr/150℃/7MPa | ASTM D261 |
| Moisture Absorption | 0.01 | % | D48/50℃ 0.050"(1.27mm) thick | IPC-TM-650 2.6.2.1 | |
| Thermal Conductivity | 0.86 | W/m/k | 80℃ | ASTM C518 | |
| Coefficient of Thermal Expansion | 24 24 47 |
X Y Z |
ppm/℃ | 23℃/50% RH | IPC-TM-650 2.4.41 |
| Td | 500 | ℃ TGA | ASTM D3850 | ||
| Density | 3.1 | g/cm3 | ASTM D792 | ||
| Specific Heat | 1.00(0.239) | j/g/k (BTU/ib/OF) |
Calculated | ||
| Copper Peel | 12.3 (2.1) | pli (N/mm) | after solder float | IPC-TM-650 2.4.8 | |
| Flammability | V-0 | UL 94 | |||
| Lead-free Process Compatible | Yes | ||||
Appendix2: Automatic silkscreen machine
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