Through Glass Vias (TGV) For JGS1 JGS2 Sapphire Corning Glass Eligible For Any Metalization Process
Through Glass Vias (TGV) For JGS1 JGS2 Sapphire Corning Glass eligible for any metalization process
Product Description
Our Through-Glass Vias (TGV) technology revolutionizes sensor manufacturing and packaging processes. By leveraging the superior properties of JGS1, JGS2, sapphire, and Corning glass, we enable the development of sensors that excel in performance, reliability, and compatibility with various applications.
Through our TGV technology, we create precise microholes within the glass substrate, allowing for seamless electrical connectivity and signal transmission. These microholes serve as vias, facilitating the integration of sensor components and enabling the miniaturization of sensor devices.
The use of premium materials such as JGS1, JGS2, sapphire, and Corning glass enhances the durability and stability of the sensors, making them well-suited for demanding environments. These materials possess excellent optical transparency, thermal resistance, and chemical inertness, ensuring accurate sensing capabilities across a wide range of conditions.
Our TGV technology offers significant advantages for sensor manufacturers. The precise positioning and reliable electrical connectivity provided by the microholes enable enhanced performance and sensitivity of sensors. Additionally, the miniaturization achieved through TGV enables the development of compact and lightweight sensor designs, opening up new possibilities for integration into various applications.
By leveraging our expertise in TGV technology and utilizing premium materials, we provide sensor manufacturers with a comprehensive solution for the production and packaging of high-performance sensors. Whether it's for automotive safety systems, aerospace navigation, medical diagnostics, or consumer electronics, our TGV technology delivers exceptional results, empowering the advancement of sensor technology in diverse industries.
Product parameter
| Specification | Value |
| Glass Thickness | <1.1 mm |
| Wafer Sizes | All standard up to 200 mm |
| Minimum Microhole Diameter | 10 µm |
| Identical Hole Diameter | 99% |
| Positional Accuracy | ±3 µm |
| Chipping | None |
| Super Smooth Sidewalls | RA < 0.08 µm |
| Hole Types | Through Via (True circle or Ellipse), Blind Via (True circle or Ellipse) |
| Hole Shape | Hourglass |
| Option | Singulation from hole-processed large-sized glass |
Product details display
Product trivia
Through Glass Via (TGV) technology is a microfabrication technique that involves creating vertical electrical connections through a glass substrate. These vias, or microholes, enable the integration of electronic components in advanced packaging and interposer applications.
TGV technology is widely utilized in the semiconductor industry, particularly for applications that demand high-density integration, improved thermal management, high-frequency performance, and enhanced mechanical stability. By providing a reliable and efficient means of vertical electrical interconnects, TGV technology enables the miniaturization and optimization of electronic devices.
The process of TGV fabrication typically involves laser drilling or chemical etching to create precise microholes in the glass substrate. These microholes are then metallized to establish electrical connections across different layers or components. The use of glass as a substrate offers several advantages, including excellent electrical insulation properties, high thermal conductivity, and compatibility with various semiconductor materials and processes.
In summary, TGV technology plays a crucial role in semiconductor manufacturing by enabling the creation of vertical electrical connections through glass substrates. It facilitates the integration of electronic components with high density, improved performance, and enhanced reliability in various applications.
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